Thermal management

Overview of thermal management

Modern power electronics circuitry with high currents makes use of components such as power MOSFETs and IGBTs which demand new types of high-performance PCB technology. As a result, the circuit board becomes a multifunctional element of an overall electronic system.

Such technology easily handles high currents, ensures effective heat dissipation from high-clock-speed, heat-producing processors and power components with high heat loss. It also carries the control electronics on the same board. That makes it possible to integrate all requirements within the heat management board, thus significantly reducing overall system costs.

Your advantages

  • Precisely targeted thermal conduction of heat loss from power components
  • Creation of an individual concept based on your requirements
  • Support with the design, dimensioning and choice of concept for your PCB
  • Thermal simulations, measurements and analyses
  • Implementation of the layout in the standard process
     

PCB technologies for heat management

KSG offers you two technology variants for optimum heat management:

Copper IMS

Graphic of a copper IMS PCB

Thermal management for power components

Power and control electronics on a single PCB

Extended service life and reduced system costs

Close-up of a printed circuit board for LED applications

Design examples for TO263 casing

Copper profile + microvias/thermovias/blind vias:

Bent copper profile + micro vias / thermovias:

Copper profile + microvias/thermovias:

Copper profile + LED

Typical layer stack up for LEDs with high thermal performance and multilayer PCB technology for on-board control electronic

Single-layer copper IMS:

Example: Thermal Clad HT-04503 material from Henkel/Bergquist
Thermal conductivity of 2.2 applies only to the insulation material (bright yellow)

  • Thick Cu film top: 70 µm 
  • Thickness of dielectric: 76 µm
  • Dielectric thermal conductivity: 2.2W/m*K
  • Copper substrate thickness: 1.0 mm 

We can offer you the following services for ideal heat management:

  • Advice on the right choice of PCB technology 
  • Concepts for heat dissipation from hot spots (MOSFETs, LEDs, etc.) 
  • Assistance with layout for hot-spot heat management
  • Thermal insulation, thermographs and measurements
     

Marine and boat lighting

Structure 4-layer multilayer, 35µm copper
Material FR4 TG130°C
PCB thickness 1,6 mm
Circuit board technology 1.3 mm thick copper profile for heat dissipation
Special features Partial heat dissipation in the area of the LEDs combined with control electronics on the board
Project https://luminell.com
Picture of LED PCB with control electronics

Automotive EMC and electrical system testing

Structure 4-layer multilayer, 70µm copper
Material FR4 TG130°C
PCB thickness 1,6 mm
Circuit board technology 12mm wide copper profiles on the inside
Special features Copper profiles for 100A current flow and for heat dissipation to heat sink on back of board

Motor controller for fan cooling

Structure 4-layer multilayer, 70µm copper
Material FR4 TG150°C Panasonic R-1566W
PCB thickness 1,7 mm
Circuit board technology 12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amperes
Special features

Eight half-bridges have to be connected to the connectors by 4x15A = 60 A conductors. Heat dissipation from the half-bridges has to be carried via a bending edge to a PCB tab that is glued to an aluminium heat sink in the casing.

Electric vehicles

Structure 4-layer multilayer, 70µm copper
Material FR4 TG150°C Panasonic R-1566W
PCB thickness 1.6 mm
Circuit board technology HSMtec, 8 and 12mm wide copper profiles on the inside
Special features Copper profiles for 220A current flow and for heat dissipation to heat sink on back of board
Macro shot of an HSMtec© circuit board

When designing and producing an LED PCB there is a large number of parameters to consider. That is why we advise you to talk to us at a very early stage of development. Through our online advice service or on-site workshops we can discuss the technical aspects and special considerations that such PCB types involve right from the start. We are also happy to help you with technical optimisation features or cost reduction measures.

Simply make an appointment by e-mail right now: 
power@ksg-pcb.com

Contact partner

If you have any questions about the topic, we are happy to be your contact person.

Portrait of Johann Hackl

Johann Hackl
Product Manager
Mobile+43 2985 2141-601
johann.hackl@ksg-pcb.com