Embedded PCBs

KSG offers you the right solution for the integration of active and passive electronic components - up to a minimum size of 01005 and a maximum component height of 2.5 mm.

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Embedded Technology

Your advantages

Production of application-specific systems (System-in-Package, SiP)
Maximum miniaturisation possible
Replaces board-to-board solutions
Housing replacement/protection against accidental contact
Optimised thermal and power distribution
Improved EMC protection
Shorter signal paths
Complicated reverse engineering/plagiarism protection
Protected from extreme environmental influences
Protected from vibration, impact and pressure effects

We are happy to support your embedded pcb project at every step along the way.
Contact our expert team here.

Inquiry

Lack of space on the outer layers? Why not use an additional assembly layer inside the PCB? With its embedding technologies, KSG offers you the right solution for the integration of active and passive electronic components - up to a minimum size of 01005 and a maximum component height of 2.5 mm.

Number of layers	≥ 3
PCB thickness	≥ 0.25mm for assembly layer Total thickness dependent on component height
Materials	FR4, other base materials on request
Glass transition temperature	150°C, 170/180°C
Special features of components	Components with cavities or electrolytic capacitors unsuitable; Suitability of the components must be tested; Components with copper terminals are required for laser connection; maximum height 2.50 mm
Special features PCB	no HAL Design rules on request

The specified values represent the maximum performance spectrum and may be restricted in certain combinations.

Cavity describes the production of one or more defined cavity in the PCB. The components are contacted electrically and mechanically using various methods.

Detail view of a PCB, made with the cavity process

The soldering process is used to place components on a PCB and embed them in the subsequent laminating multilayer in its composite. The electrical contact is made via the rewiring in the multilayer.

Detailed view of an embedded component contacted by the pad bonding process.

The components are bonded to a multilayer component, laminated into the composite and electrically connected by means of laser and subsequent electroplating. The components used have a terminal contact adapted to this technology.

Design guidelines for PCBs

Which important parameters do you need to successfully create a layout for a project? We’ve combined all of the parameters for you in our PCB Design Compass