![[Translate to English (us-en):] Innenansicht einer Hochstromplatine](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-leiterplatten-anwendung-hochstrommanagement.jpg "[Translate to English (us-en):] Hochstromleiterplatte mit innenliegenden Kupferprofilen")
Your benefits
- Control and power electronics on the same board
- Targeted partial increase in cross-section for high-current paths
- Minimisation of space requirements for high-current conductors
- High current in combination with 3D installation geometries
- Reduction of overall costs (logistics, procurement, assembly, quality assurance)
- Design support and calculation of current paths
Nowadays, high currents of up to several hundred amperes are nothing unusual. Nevertheless, in order to ensure that optimum functionality of the power electronics is obtained, a large amount of copper in the right places on the PCB is required. At the same, fine conductor structures need to be placed on a PCB for control tasks. With our wide choice of technologies for thick copper PCBs, we can offer a reliable basis for power electronics requirements – to suit your particular project. Our extensive product portfolio covers high-current-only PCBs as well as combined power and control electronics boards. Additional functions such as 3D designs increase functionalities and application possibilities.
Power distribution/fuses for tracked vehicle
| Structure | Thick copper, 8 copper layers |
| Material | FR4 – Isola DE104 (TG≈135 °C) |
| PCB thickness | 2,8 mm |
| Circuit board technology | Iceberg®, through-connection, line/space: 250/230 µm |
| Surface | Chemical tin |
| Special features | Combined outer layer layout with 50µm and 400µm copper thickness, via filling type III-a |
![[Translate to English (us-en):] Makroaufnahme einer Iceberg®-Leiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-anwendungen-dickkupfer-leiterplatte.jpg "[Translate to English (us-en):] Perfekt für Elektroverteilung und Sicherung von Raupenfahrzeugen")
Electric vehicles
| Structure | 4-layer multilayer, 70µm copper thickness |
| Material | FR4 TG150°C Panasonic R-1566W |
| PCB thickness | 1.6 mm |
| Circuit board technology | HSMtec®, 8 and 12mm wide internal copper profile |
| Surface | Chemical Ni/Au |
| Special features | Copper profiles for 220A current flow and for heat dissipation to heat sink on back of board |
![[Translate to English (us-en):] Makroaufnahme einer HSMtec©-Leiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/KSG-Leiterpl_-3.png "[Translate to English (us-en):] KSG bietet Leiterplatten-Anwendungen für E-Mobilität")
Motor controller for fan cooling
| Structure | 4-layer multilayer, 70µm copper thickness |
| Material | FR4 TG150°C Panasonic R-1566W |
| PCB thickness | 1.7 mm |
| Circuit board technology | 12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amperes |
| Special features | Eight half-bridges have to be connected to the connectors by 4x15A = 60A conductors. Heat dissipation from the half-bridges has to be carried via a bending edge to a PCB tab that is glued to an aluminium heat sink in the casing |
![[Translate to English (us-en):] Aufnahme einer mehrdimensionalen HSMtec-Leiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-leiterplatte-anwendungen-3D-motorsteuerung.jpg "[Translate to English (us-en):] Leiterplatten-Technologie: Motorsteuerungen für Gebläsekühlung")
Optimising high-current circuit boards for motor controllers: Technical article from Elektronik Praxis
When designing and producing a high-current PCB there is an enormous number of parameters to take into account. That is why we advise you to talk to us at a very early stage of development. Through our online advice service or on-site workshops we can discuss the technical aspects and special considerations that such PCB types involve right from the start. We are also happy to help you with technical optimisation features or cost-reduction measures.
Simply make an appointment by e-mail right now:
power@ksg-pcb.com
PCB technologies for high current
![[Translate to English (us-en):] Anschliff einer Dickkupfer-Leiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-leiterplatten-anschliff-dickkupfer.jpg "[Translate to English (us-en):] Dickkupfer-Leiterplattentechnologie")
![[Translate to English (us-en):] Anschliff einer HSMtec©-Leiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-leiterplatten-anschliff-hsmtec.jpg "[Translate to English (us-en):] HSMtec©-Leiterplattentechnologie")
Design guidelines for PCBs
Which important parameters do you need to successfully create a layout for a project? We’ve combined all of the parameters for you in our PCB Design Compass
- Conductor pattern criteria
- Design rules for all technologies
- Practical tips and examples
Use our high-current conductor track calculator to dimension your high-current PCB. 
A safe track to be smarter together
Take advantage of the direct line to the experienced PCB experts in our Technical Support. We are happy to support you in every phase of your project.
![[Translate to English (us-en):] Foto einer Hochstromleiterplatte](/fileadmin/Images/Technologien/Anwendungen/Hochstrommanagement/ksg-leiterplatten-anwendung-hsmtec-hochstrom.jpg "[Translate to English (us-en):] Hochstrommanagement auf Leiterplatten")