Reliability for life.
During their day-to-day use, PCBs are exposed to an extremely wide range of stresses such as temperature and moisture. We therefore recommend subjecting them to an endurance test in our laboratory for demanding applications and conditions. Customised reliability analyses are used to simulate the exact ways in which environmental influences affect the individual product characteristics of your PCB.
At KSG, continual quality improvements are a top priority. That’s why we put our production processes and materials to the test in numerous projects with the supply industry. The aim is to detect and consistently remedy the complex connections between the thermo-mechanical fatigue behaviour of through-plating and manufacturing technologies.
During the relocation of printed circuit boards from the cold chamber to the hot chamber of the automatic test chamber, thermo-mechanically produced cracks in the through-hole plating are enlarged. This procedure can also be used for microvias. The resulting increase in resistance is detected and linked to a failure criterion, e.g. 5 percent increase in resistance. This means that a very large number of holes can be checked very accurately and the results are always available.
The preparation of the microsections is no longer used to locate failed parts, but only for spot-testing depth.
For SIR and CAF assessments, climate stresses in the range of 10-98 °C/10-90 percent relative humidity can be created. The measurement of leakage currents and insulation resistances for the evaluation of printed circuit board layouts under humid warm stress conditions with bias voltages between 10 and 1000V can be performed on 180 measuring channels in each case.
So a statistically validated number of printed circuit boards can be tested simultaneously for several test variants. The main causes of migration in addition to the PCB structure are the cleanliness of the manufacturing processes and the printed circuit board surfaces.
