PCB manufacturer KSG brings plugging process in-house

The higher integration densities possible with this process lead to a considerable space gain in SBU setups (SBU: sequential build up) and thus to fewer restrictions in the layout design of complex circuits (technology "via in pad" or "staggered/stacked microvia on buried via").
Due to the wide range of applications, KSG has opted for full-surface, vertical vacuum filling. In addition to through-holes, this process also allows blind holes drilled mechanically or by laser to be filled quickly, reliably and reproducibly and is thus available to a wide range of applications. Further advantages compared to the conventional screen printing process are the air bubble-free filling of the boreholes, a high degree of flexibility, lower paste consumption and the filling of boreholes with more demanding borehole depths.
"With the in-house process, we are expanding our capacity alongside the external service option we still have. In this way, we increase our flexibility, entirely in the interest of our customers," explains Christof Sofsky, Sales Manager at KSG.