A strong start to 2025 KSG has reached another milestone: the state-of-the-art technology of the new ENIG plant in Gars am Kamp is not only
Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and a compact design. Compared to traditional pin connection methods,
In the complex production of printed circuit boards, there are two typical manufacturing processes for the core processes of through-hole plating and structuring. A distinction is made between the so-called "pattern plating" and
On the way to a cost-efficient PCB, it is not only the utilization and selection of materials - as described in Part 1 - that play a role.
Today we are delving into the world of PCB marking and discovering its importance in the context of Industry 4.0 and the smart factory. At a time when
Organic surface protection (OSP, Organic Solderability Preservative or Organic Surface Protection) is a cost-effective alternative to metallic end surfaces on printed circuit boards. On the exposed
The demand for ever more powerful and compact electronic devices continues to grow. However, in times of rising raw material and energy prices, developers, engineers and companies are faced with the
Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and
The most important questions and answers They are used in smartphones, airplanes and medical devices and enable high technical performance in the smallest of spaces: HDI printed circuit boards
Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven have managed to achieve this with a
From process optimization to digitalization: KSG provides insight into the practice of lean management.
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® PCBs are partial thick copper PCBs. In one wiring level there are areas with 50 to 70 µm copper for the
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