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Radar systems for printed circuit boards not only assume the functions of a circuit carrier, but are also developing into a system in which antennas are realized as planar versions. As a result, both the materials used and the manufacturing processes must meet new challenges.
PTFE-based base materials with a permittivity of approx. 3.00 and a loss factor < 0.002 are usually used for this purpose. These materials can contain inorganic fillers and/or glass fabric. The degree and type of filler varies depending on the product type and manufacturer. Copper foils with reduced treatment can be used to further optimize radar performance. Alternatively, there are base materials based on epoxy resin or PPE that achieve equivalent properties. The path to fully autonomous driving is determined by radar sensor technology. Distance sensors for medium and short ranges are used for this purpose. As a cost and design advantage, these base materials can be processed as a hybrid with common FR4 systems and external high-frequency laminates are used for the safe radar function. The remaining part of the multilayer offers almost complete design freedom. The design rules for multilayer PCBs apply. Despite the specific material properties of PTFE, standard technologies such as laser drilling, mechanical processing and the application of a solder mask can be implemented.
| Structure | Laminate technology, hybrid, 8 copper layers |
| Material | Rogers RO3003™/FR4 |
| PCB thickness | 1.1 mm |
| Printed circuit board technology | High frequency, plated through, laser blind holes on both sides, mechanical blind holes on one side, line/space: 100 μm/100 μm |
| Surface | OSP |
| Special features | Hybrid structure, reduced etching tolerance ± 15 μm |
The frequency range is limited? Compared to the 77 GHz applications, there are also low requirements for high-frequency performance? In these two cases, high-frequency-optimized FR4 base materials are predominantly used. This not only results in considerable cost advantages in PCB production, but also a greater degree of freedom in layer stack-up design. Typically, these laminates are combined with FR4 materials on the top and bottom of the multilayer in a hybrid system. High-volume type representatives are lane change assist or blind spot warning systems. As the processing is based on conventional FR4 materials, a wide range of standard technologies can be used - as well as HDI/SBU technologies.
| Structure | Laminate technology, hybrid, 4 copper layers |
| Material | Rogers RO4835™/FR4 |
| PCB thickness | 0.7 mm |
| Printed circuit board technology | High frequency, plated through, blind holes on one side, line/space: 100 μm/120 μm |
| Surface | electroless nickel/gold |
| Special features | Hybrid structure, reduced etching tolerance ± 25 μm |
In the industrial environment, the variety of applications for radar systems in the £ 24 GHz frequency range has grown considerably. These high-frequency circuit carriers are used, for example, in the electronics of automatic door systems, filling level sensors, traffic monitoring systems, anti-collision systems in robotics and alarm systems. The great advantage of the circuit carriers used in this field of application is that they require neither HF-performed base material nor adapted production processes.
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The complexity and variety of technical parameters involved in high-frequency circuit carriers is enormous. It is therefore best to consult with us at a very early stage of development and benefit from our decades of experience and technical expertise in the field of high-frequency PCB technology. We can solve your problems as part of an on-site or online consultation or an in-house workshop. It doesn't matter whether it's a new PCB development, product or cost optimization.
Simply make an appointment now by e-mail: matthias.schmied@ksg-pcb.com
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