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Printed circuit boards are exposed to a wide variety of stresses such as temperature and humidity in their daily use. We therefore recommend long-term and ageing tests in our laboratory for demanding applications and conditions. In individual reliability analyses, we simulate how environmental influences specifically affect individual product properties of your PCBs.
Continuous quality improvements are a priority at KSG. That's why we put our manufacturing processes and materials to the test in numerous projects with the supplier industry. The aim is to identify and consistently eliminate complex correlations between the thermo-mechanical fatigue behavior of through-hole plating and manufacturing technologies.
A particularly efficient test method that KSG has been using since 2011 is in-situ resistance measurement in the temperature shock test. This involves rapid temperature changes - for example, between -40 and +150 °C within just 30 seconds. When the PCBs are transferred from the cold chamber to the hot chamber, thermo-mechanically induced cracks in the through-hole plating increase in size. This method can also be used for microvias. The test procedure enables us to test a large number of holes very accurately - with up-to-date and available results at all times.
The grinding preparation is no longer used to locate failed parts, but only for selective depth assessment.
For SIR and CAF evaluations, we realize climatic loads in the range of 10 to 98 °C or 10-90 percent relative humidity. The measurement of leakage currents and insulation resistances under warm and humid load conditions is carried out with bias voltages between 10 and 1000 V on 180 measuring channels each. This allows a statistically validated number of PCBs to be tested simultaneously for several test variants. The main causes of migration, in addition to the PCB structure, are the cleanliness of the manufacturing processes and the PCB surfaces. At KSG, we rely on two high-performance insulation resistance measuring systems from LWS to identify and avoid migration phenomena under simulated operating loads.
From gigaohms to short circuits - PCBs in the CAF climate test
Miniaturization, higher circuit densities and environmental stresses are stress factors for the internal insulation properties of printed circuit boards. This makes it all the more important that processing, handling and cleaning are right. In another round from the quality lab, Dr. Swantje Frühauf and Holger Bönitz show you why PCBs fail in climate tests and what can be done to prevent CAF failures in particular.
In this online seminar
It's the layering that counts - PCBs in temperature cycling tests
Printed circuit boards are often exposed to extreme loads. In such cases, we recommend putting their durability through its paces. Follow Dr. Swantje Frühlauf and Holger Bönitz at KSG XPERTS into the quality laboratory.
In this online seminar
Do you have any questions or would you like technical advice? We are happy to support you in every phase of your project. Contact our team of experts.
Use the direct line to the experienced PCB experts in our Technical Support department.
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