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Our technologies for optimum thermal management cope with large currents, ensure the
Cooling of high-clocked, heat-producing processors and power components at
simultaneous control electronics on the same board.
Design examples for TO263 - Housing copper profile + microvias / thermovias / blind vias:
Curved copper profile + microvias / thermovias:
Copper profile + thermovias:
Copper IMS single layer:
Example: Thermal Clad HT-04503 material from Henkel/Bergquist
Thermal conductivity of 2.2 only applies to the insulation material (light yellow)
Application: Marine and boat lighting
| Structure | 4 layers multilayer, 35 μm copper |
| Material | FR4 TG130°C |
| PCB thickness | 1.6 mm |
| Printed circuit board technology | 1.3 mm thick copper profile for heat dissipation |
| Project | luminell.com |
| Special features | Partial heat dissipation in the LED area combined with on-board control electronics |
Application: EMC and wiring system test systems for the automotive industry
| Structure | 4-ply multilayer, 70 μm copper |
| Material | FR4 TG130°C |
| PCB thickness | 1.6 mm |
| Printed circuit board technology | 12 mm wide copper profiles on the inside |
| Special features | Copper profiles for 100A current flow and for heat dissipation on the back to the heat sink |
Motor control for fan cooling
| Structure | 4-ply multilayer, 70μm copper |
| Material | FR4 TG150°C Panasonic R1566W |
| PCB thickness | 1.7 mm |
| Printed circuit board technology | 12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amps |
| Special features | Eight half bridges must be connected to the plugs with 3x15A cables. The heat dissipation of the half bridges must take place via a bending edge to a PCB tab, which is bonded in the housing with an aluminum heat sink. |
Application: E-mobility
| Structure | 4-ply multilayer, 70μm copper |
| Material | FR4 TG150°C Panasonic R-1566W |
| PCB thickness | 1.6 mm |
| Printed circuit board technology | HSMtec, 8 and 12 mm wide copper profiles on the inside |
| Special features | Copper profiles for 220A current flow and for heat dissipation on the back to the heat sink |
The technical parameters for the realization of a PCB with heat dissipation are numerous. You should therefore contact us at an early stage of development. During an on-site or online consultation or an in-house workshop, we can address the aspects and special features of these PCB technologies right from the start. We are also happy to support you with technical optimizations or cost reduction measures.
Simply make an appointment now:
Modern power electronics rely on components such as high-performance LEDs, MOSFETs and IGBTs. At the center: the printed circuit board! As a multifunctional element, it masters high currents and ensures the cooling of high-clocked, heat-producing processors and heat-emitting power components.
Sophisticated high-current and thermal management on the PCB is therefore essential. In the next issue of XPERTS, Johann Hackl and Dirk Deiters will show you interactively and vividly how this can be optimally achieved in practice.
In this online seminar
KSG offers you two technology variants for optimum heat management:
The smart platform for fast and reliable PCB development.
We have bundled all the parameters for you in our Design Compass.
Use the direct line to the experienced PCB experts in our Technical Support department.
We are happy to support you in every phase of your project.
Talk to us in the early development phases of your project and contact our team of experts. Together we will find the solution that will make your product even better.
With a workshop at our premises or at your site, we give you the opportunity to discuss the key technical aspects and features of your project in detail.
From design and layout checks to various calculations and thermal analyses - the experienced, competent Technical Support team will be happy to help you.
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