Three-dimensional PCBs make optimum use of tight installation spaces. We offer various technologies for the realization of your 3D printed circuit board, each with specific technical properties, design advantages and limitations.
Three-dimensional PCBs make optimum use of tight installation spaces. Parts of a circuit that are connected to each other on different PCBs or PCB segments also replace connectors and cables. 3D printed circuit boards can also increase the packing density, reduce weight, increase the reliability of the assembly and open up new design possibilities as well as reduce system costs.
Multi-dimensional PCBs can be designed using various processes, assembly variants and materials. We offer you different technologies so that your 3D printed circuit board can be realized in the best possible way. Each of these three processes uses different structures and has different technical properties, design advantages and limitations.
| Structure | sequential, 6 copper layers, 2 flex layers |
| Material | FR4 - Isola DE104 (TG≈135 °C), polyimide |
| PCB thickness | 1.1 mm |
| Printed circuit board technology | Rigid-flex symmetrical, plated through, Line/Space: 100 µm/150 µm |
| Surface | electroless nickel/gold |
| Special features | 3 press cycles, symmetrical design, blue solder mask |
| Structure | 4 layers multilayer, 70µm copper |
| Material | FR4 TG150°C Panasonic R-1566W |
| PCB thickness | 1.7 mm |
| Printed circuit board technology | 12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amps |
| Special features | Eight half bridges must be connected to the plugs with 4x15A = 60 ampere cables. The heat dissipation of the half bridges must take place via a bending edge to a PCB tab, which is bonded in the housing with an aluminum heat sink. |
| Structure | 4-ply multilayer |
| Material | FR4 TG150°C Panasonic R-1566W |
| PCB thickness | 1.5 mm |
| Printed circuit board technology | Semiflex, one flex layer outside, cover film over flex area |
| Structure | 4-ply multilayer |
| Material | FR4 Standard TG 130°C |
| PCB thickness | 1.6 mm |
| Printed circuit board technology | Semiflex in combination with HSMtec® for cooling the LED to the heat sink |
There are many parameters to consider when realizing a 3D printed circuit board. Therefore, please contact us at an early stage of development. With an online consultation or a workshop at your premises, we can discuss the technical aspects and special features associated with this type of PCB right from the start. We are also happy to support you with technical optimizations or cost reduction measures.
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Talk to us in the early development phases of your project and contact our team of experts. Together we will find the solution that will make your product even better.
With a workshop at our premises or at your site, we give you the opportunity to discuss the key technical aspects and features of your project in detail.
From design and layout checks to various calculations and thermal analyses - the experienced, competent Technical Support team will be happy to help you.
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