With embedded technologies, KSG offers the right solution for the integration of active and passive electronic components - up to a minimum size of 01005 and a maximum component height of 2.5 mm.
No space on the outer layers? Why not use an additional placement level inside the PCB? With its embedding technologies, KSG offers you the right solution for integrating active and passive electronic components - up to a minimum size of 01005 and a maximum component height of 2.5 mm.
Number of layers | ≥ 3 |
PCB thickness | ≥ 0.25mm for component layer. Total thickness depends on component heights |
Materials | FR4, other base materials on request |
Glass transition temperature | 150°C, 170/180°C |
Components | Components with cavity or electrolytic capacitors unsuitable; suitability of components must be tested; components with copper terminals are required for laser connection; maximum height 2.50 mm |
Special features PCB | no HAL design rules on request |
The specified values represent the maximum power spectrum and may be limited in certain combinations.
The smart platform for fast and reliable PCB development.
We have bundled all the parameters for you in our Design Compass.
Take advantage of the direct line to the experienced PCB experts in our technical support team. We are happy to support you in every phase of your project.
Talk to us in the early development phases of your project and contact our team of experts. Together we will find the solution that will make your product even better.
With a workshop at our premises or at your site, we give you the opportunity to discuss the key technical aspects and features of your project in detail.
From design and layout checks to various calculations and thermal analyses - the experienced, competent Technical Support team will be happy to help you.