Installation spaces are getting smaller, currents higher. The aim is to continuously increase the performance of the assembly. With our individual, software-based calculation, we provide you with targeted support to optimize the current carrying capacity of your PCB. Together we will find the right technology for your application and avoid critical limit ranges. The aim is to manage the current flow optimally from A to B.
We take the following points into account for the calculations:
Temperature conditions
Printed circuit board technology
Layer structure
Number and layout of the high-current conductor tracks
The result: a reliable, stable performer.
Influencing factor layer structure on the current carrying capacity
The Higher Power - How to optimize your high-current printed circuit board
Modern power electronics rely on components such as high-performance LEDs, MOSFETs and IGBTs. At the center: the printed circuit board! As a multifunctional element, it masters high currents and ensures the cooling of high-clocked, heat-producing processors and heat-emitting power components.
Sophisticated high-current and thermal management on the PCB is therefore essential. In the next issue of XPERTS, Johann Hackl and Dirk Deiters will show you interactively and vividly how this can be optimally achieved in practice.
In this online seminar
we will show you which technologies are available to implement power solutions on the PCB,
Which influencing factors need to be taken into account when dimensioning
and how you can easily calculate and optimize the current carrying capacity.