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Temperature differences are a major risk factor for the service life of an electronic component. So the question is: how do we manage to optimally spread the heat on the circuit board in order to create a thermal balance? Our thermal analysis service has two levels: it can be used as a software-based, thermographic simulation during development and layout creation and as a real stress test after the first prototypes have been produced. The objective of both processes is identical: possible hotspots and risk factors in the layout should be identified and eliminated before series production.
For the software-based, thermographic simulation, the layout data from Gerber data and other specifications, for example, are used for modeling. Additional information such as layer structure, base material, system structure, component characteristics, current ratings, ambient conditions and installation situation are important in order to model the subsequent operating conditions in the best possible way. The expected temperatures are calculated using the finite element method and thermographic images are clearly displayed.
In the second stage, we test your PCB in the high-current laboratory under real conditions. Two high-current generators and a thermal imaging camera are used to apply the actual currents to the high-current connections. Once thermal equilibrium has been reached, the thermal imaging camera carries out a surface measurement.
Do you have any questions or would you like technical advice? We are happy to support you in every phase of your project. Contact our team of experts.
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