Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and a compact design. Compared to traditional pin connection methods,
The reliability of printed circuit boards plays a crucial role in electronics production. Especially in applications that are exposed to high temperatures, it is essential that the materials,
In a time of constant change and advancing technologies, the urge to successfully bring groundbreaking innovations to market is not only an entrepreneurial endeavor, but also a way of
Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and
In an increasingly digitalized and fast-moving world, speed is key. This applies to both everyday and industrial applications, be it wireless transmission systems, sensors or radar applications.
Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven have managed to achieve this with a
Printed circuit board knowledge in a nutshell: Robert Jungk and Katharina Luchner provide insights into the intention and concept of the XPERTS online seminar series.
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
Plugging, hole filling, microvia copper filling or via hole plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the PCB. There one achieves
Incorrect handling and improper storage of PCBs can have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards and later electronic assemblies, impair solderability, and cause damage to the PCB.
HSMtec 3D printed circuit board: the self-supporting 3D design The HSMtec 3D printed circuit board does not require flex foil at the bending point. This technology uses copper wires and copper profiles that are bent in FR4 material.
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties.
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