Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and a compact design. Compared to traditional pin connection methods,
The rapid development of the electronics industry requires increasingly efficient tools and technologies in order to meet the growing demands. We - the KSG Group - have
Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and
In a fast-moving world, trusting business partnerships are rare. So how do you build and maintain a strong customer-supplier relationship over 30 years? An example of this
The most important questions and answers They are used in smartphones, airplanes and medical devices and enable high technical performance in the smallest of spaces: HDI printed circuit boards
Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven have managed to achieve this with a
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
Design rules for high-current conductor tracks These rules must be observed when designing HSMtec PCBs: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum
When designing HSMtec PCBs with integrated copper elements, it is always advisable to design the high-current conductors before the standard layout. The development process of an HSMtec PCB consists of 10 design steps:
Plugging, hole filling, microvia copper filling or via hole plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the PCB. There one achieves
KSG has received UL listing for the manufacture of bare printed circuit boards with the high-frequency material Megtron 6 after successfully passing the UL test of the sample sets. From
Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, HF-capable, high-current-capable, heat-optimized and
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