On June 18, 2026, the KSG Group will be represented at the FED Austrian Electronics Day at Techno-Z Urstein in Salzburg. At 11:10 a.m., Martin Leeb (KSG Group) will give a presentation together with Michael
Neutrinos are among the most fascinating particles in physics - extremely difficult to measure and yet crucial to expanding our understanding of the universe. This is precisely where the large-scale KATRIN project at the
Why blind outsourcing becomes a strategic risk Printed circuit boards are often seen as a commodity - interchangeable, comparable, price-driven - but this view is dangerous. After all, modern electronics are safety-critical, and PCBs are their physical
In modern electronics, devices are becoming ever more powerful - and the challenge is increasing: dissipating heat efficiently while maintaining a compact design is anything but trivial. Right here
Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and a compact design. Compared to traditional pin-connection methods, BGA offers better thermal performance.
The rapid development of the electronics industry requires increasingly efficient tools and technologies in order to meet the growing demands. We - the KSG Group - have developed our Digital Design Compass
Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and provide valuable insider knowledge for the
In a fast-moving world, trusting business partnerships are rare. So how is it possible to build and maintain a strong customer-supplier relationship over 30 years? One example of this is the successful collaboration between
The most important questions and answers They are used in smartphones, aircraft and medical devices and enable high technical performance in the smallest of spaces: HDI printed circuit boards are an integral part of the electronics industry.
Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven managed to set records with a KSG circuit board. In the blog article
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
Design rules for high-current conductor tracks These rules must be observed when designing HSMtec PCBs: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for the copper cross-sections