HDI Circuit Boards. Smart Design. Smart Price. On September 29 and 30, 2026, the electronics industry will gather at Power of Electronics in Würzburg. We’ll not only be there in person, but also
Additional mechanical reliability for demanding applications. Rigid-flex printed circuit boards combine rigid and flexible sections into a single, continuous structure. This enables compact 3D assemblies, reduces the number of connectors, and creates reliable electrical connections in tight spaces.
On June 18, 2026, the KSG Group will be represented at the FED Austrian Electronics Day at Techno-Z Urstein in Salzburg. At 11:10 a.m., Martin Leeb (KSG Group) will give a presentation together with Michael
Neutrinos are among the most fascinating particles in physics - extremely difficult to measure and yet crucial to expanding our understanding of the universe. This is precisely where the large-scale KATRIN project at the
Rising metal prices, more complex requirements and increasing cost pressure: choosing the right end surface is now more than ever a strategic decision. It's high time to take a closer look with Annett Horbach and Stefanie Schädlich.
Technology, exchange and strong impressions Two days full of innovation, personal exchange and exciting insights: With XPERTS OnBoard 2026, we were able to welcome over 60 customers to our company and spend an intensive day together.
Following the last release in July 2024, our Digital Design Compass (DDC) is now being launched with another extensive update, once again confirming its great popularity.
Today, our customers are faced with a key challenge: how can electronic products be produced safely, sustainably and economically when raw materials are becoming scarcer worldwide and supply chains more uncertain? copper - the heart of every printed circuit board
Whether it's PCB waste, metal-containing production residues or electronic scrap - industrial processes generate valuable materials every day that often remain unused. In this XPERTS, together with our partner MPM Environment
At first glance, thick PCBs seem like the opposite of miniaturization. After all, from the history of electronics, we are used to PCBs becoming thinner, lighter and thinner over the decades.
Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and a compact design. Compared to traditional pin-connection methods, BGA offers better thermal performance.
The reliability of printed circuit boards plays a crucial role in electronics production. Particularly in applications that are exposed to high temperatures, it is essential that the materials used to manufacture the printed circuit boards
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