Printed circuit boards are tested intensively in advance to ensure that they work reliably even with high temperature fluctuations. KSG explains how.
In an increasingly digitalized and fast-moving world, speed is key. This applies to both everyday and industrial applications, be it wireless transmission systems, sensors or radar applications.
Printed circuit boards are tested intensively in advance to ensure that they work reliably even with high temperature fluctuations. KSG explains how.
Design rules for high-current conductor tracks These rules must be observed when designing HSMtec PCBs: Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum
When designing HSMtec PCBs with integrated copper elements, it is always advisable to design the high-current conductors before the standard layout. The development process of an HSMtec PCB consists of 10 design steps:
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® PCBs are partial thick copper PCBs. In one wiring level there are areas with 50 to 70 µm copper for the
Thick copper, Iceberg® and HSMtec® are three different technologies for high-current printed circuit boards. The article compares the three technologies and explains the design possibilities, current carrying capacity and
English 
German