SIR test according to IPC
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
The "chemical tin" soldering surface offers a planar surface and good solderability for fine-pitch components. We explain the most important properties of the solder surface.
Industry accounts for around 31 percent of annual energy consumption in Germany. If the energy transition is to succeed, companies must accept their responsibility:
Electroless nickel-gold is the most commonly used soldering surface for printed circuit boards in Europe. Find out the reasons in our blog article.
The soldering surface - also referred to as the final surface or PCB finish - is a thin metallic or organic layer that the PCB manufacturer
KSG has mastered the peak phase of the pandemic with entrepreneurial skill & customer service. The team provides an insight into how this was achieved.
ENAL = Use of nano-coated tools in PCB production Approximately ten percent of the manufacturing costs of a PCB are caused by the mechanical production processes, drilling
Design rules for high-current conductor tracks These rules must be observed when designing HSMtec PCBs: Standard values for HSMtec PCBs are 0.8 to 3.2 mm
When designing HSMtec PCBs with integrated copper elements, we generally recommend designing the high-current conductors before the standard layout. The development process of an HSMtec PCB
Interview with Margret Gleiniger (CEO/CFO) and Swen Klöden (CTO) of KSG GmbH and Kornel Schmidt, Managing Director of KSG Austria GmbH
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® PCBs are partial thick copper PCBs. In a wiring level, there are areas with 50 to
Thick copper, Iceberg® and HSMtec® are three different technologies for high-current printed circuit boards. The article compares the three technologies and explains the
