Kurtz Ersa - 6th Technology Forum Electronics Manufacturing 2025
6th Electronics Manufacturing Technology Forum at Kurtz Ersa Experience two exciting days of current trends, innovations and solutions in electronics manufacturing.
6th Electronics Manufacturing Technology Forum at Kurtz Ersa Experience two exciting days of current trends, innovations and solutions in electronics manufacturing.
Chairman of the PCB Market Working Group Association of the Electrical and Digital Industry (ZVEI) Mr. Peter Schaarschmidt was unanimously elected Chairman on 18.03.2025.
Visit us at the evertiq Expo Malmö 2025! On May 15, 2025, the time has come again - the evertiq
Saving costs made easy? Design-to-cost recommendations from KSG The FED Regional Group Austria as a guest at OMICRON electronics GmbH - that does not guarantee
High-current and thermal management on printed circuit boards A technology comparison and application-oriented solutions On 27.02.2025 at 10:30 a.m., Johann Hackl, Head of Technical Development, will present
Make the future possible with us Save the Date! Whether electric cars, medical diagnostic devices or high-performance cameras - without modern electronics, many
Economic Warning Day 2025 Together for a strong economy! On 𝟮𝟵. 𝗝𝗮𝗻𝘂𝗮𝗿 𝟮𝟬𝟮𝟮𝟱 the Economic Warning Day will take place with a rally in Berlin
Three orders, zero service charges Saying welcome is easy - showing it makes all the difference.we look forward to working with
Creating Future Together A look back at electronica 2024 electronica has once again shown why it is the most important meeting place for
Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high number of pins and a compact design.
The reliability of printed circuit boards plays a decisive role in electronics production. Especially in applications that are exposed to high temperatures
The "chemical tin" soldering surface offers a planar surface and good solderability for fine-pitch components. We explain the most important properties of the solder surface.
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