The HDI PCB is a multilayer PCB with four or more layers, which is built up sequentially ("Sequential Build Up", SBU for short) in several press cycles. HDI stands for "High Density Interconnect".
HDI stands for "High Density Interconnect". These are multilayer PCBs with four or more layers that are built up sequentially ("Sequential Build Up" or SBU) in several press cycles.
This achieves higher packing densities and meets the requirements of state-of-the-art component development. This opens up completely new possibilities for your PCB layout in order to meet the ever-increasing miniaturization, which demands ever more complex circuits and components with extremely high pin counts.
Thanks to state-of-the-art production technology, layouts from a line/space of 75 µm are possible. The filling technologies of drill holes (e.g. microvia copper filling, plugging or resin filling) play a decisive role in the selection of an optimal rewiring strategy.
Multiple sequentially pressed multilayers (SBU) allow the individual components to be electrically connected to each other via drill holes using different drilling technologies and therefore more complex rewiring. This allows inner layers to be connected and unbundled without blocking the space for PCB components with high pin density on the outer layer.
In addition to through-holes, laser vias and internal holes (buried vias) are used for the connection to and on the inner copper layers. For a higher number of layers combined with an HDI design, the use of PCB base material with optimized Z-axis expansion is recommended.
Number of layers | ≤ 30 |
PCB thickness | 0.5 mm - 3.20 mm |
Materials | FR4, high frequency materials |
Glass transition temperature | (135), 150°C, 170/180°C |
Aspect ratio |
|
Advanced technologies | Viafilling type VII, microvia copper filling, Buried boreholes |
The specified values represent the maximum power spectrum and may be limited in certain combinations.
Solder resist masks
Additional prints
Edge metallization
In order to improve the EMC protection of a circuit board, to create an electrical contact to the housing of the assembly or to meet increased cleanliness requirements, the front sides of the circuit board contour can be metallized.
Milled vias
It is possible to produce application-specific components with so-called milled through-holes. The resulting circuit boards can be soldered onto another circuit board as components (interposer) due to their front-side contacting option.
Contour processing
Contour production: milling and scoring
Microvias (lasered) on outer layers
Microvias (lasered) in combination with plated-through laminates (mechanically drilled)
Microvias (lasered) in combination with buried vias (mechanically drilled)
Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L2 to Ln-1
Staggered microvias (lasered) in combination with buried vias (mechanically drilled) - from L3 to Ln-2
Stacked microvias (lasered) with microvia copper filling in combination with buried vias (mechanically drilled)
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