Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and provide valuable insider knowledge for the
In an increasingly digitalized and fast-moving world, speed is key. This applies to both everyday and industrial applications, be it wireless transmission systems, sensors or radar applications.
Sustainable mobility is one of the most important areas of development: Solar cars can cover long distances without any charging breaks. Students from the Belgian Agoria Solar Team from Leuven managed to set records with a KSG circuit board. In the blog article
Printed circuit board knowledge in a nutshell: Robert Jungk and Katharina Luchner provide insights into the intention and concept of the XPERTS online seminar series.
We use the SIR test according to IPC to test surface resistance in a humid/heat climate. We explain exactly how it works.
Plugging, hole filling, microvia copper filling or via hole plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the PCB. In this process, even highly complex circuit carriers achieve a
Incorrect handling and improper storage of PCBs can have fatal consequences. Contamination, moisture and electrostatic charge can irreparably damage printed circuit boards and later electronic assemblies, reduce solderability and impair the electrical test.
HSMtec 3D printed circuit board: the self-supporting 3D construction The HSMtec 3D printed circuit board does not require flex foil at the bending point. With this technology, copper wires and copper profiles, which are pressed into the FR4 material of the multilayer, are used as a
Semiflex printed circuit board: the low-cost alternative to rigid-flex Semiflex is a low-cost alternative to rigid-flex technology. The absence of flex foils lowers the price, but also reduces the bending properties. The moving areas are created here
Three-dimensional PCBs make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes
Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, HF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows,