When designing HSMtec PCBs with integrated copper elements, we generally recommend designing the high-current conductors before the standard layout. The development process of an HSMtec PCB consists of 10 design steps: Define mechanical features: Size and
Plugging, hole filling, microvia copper filling or via hole plugging refers to the filling of metallized through holes or metallized blind holes on the outer layers of the PCB. In this process, even highly complex circuit carriers achieve a
KSG has received the UL listing for the production of unpopulated printed circuit boards with the high-frequency material Megtron 6 after successfully passing the UL test of the sample sets. With immediate effect we are authorized to
Multifunctional system boards are already state of the art today. Different starting materials, methods and manufacturing processes enable highly specialized circuit carriers: densely packed and/or highly integrated, HF-capable, high-current-capable, heat-optimized and three-dimensional. The current technology roadmap shows,