{"id":8014,"date":"2023-03-27T14:23:21","date_gmt":"2023-03-27T12:23:21","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=8014"},"modified":"2025-02-18T08:35:16","modified_gmt":"2025-02-18T07:35:16","slug":"circuits-imprimes-hdi-possibilites-et-limites-de-conception-et-de-fabrication","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/hdi-leiterplatten-moeglichkeiten-und-grenzen-bei-design-und-herstellung\/","title":{"rendered":"Circuits imprim\u00e9s HDI - Possibilit\u00e9s et limites de la conception et de la fabrication"},"content":{"rendered":"
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Les principales questions et r\u00e9ponses<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Ils sont utilis\u00e9s dans les smartphones, les avions et les appareils m\u00e9dicaux et permettent d'obtenir des performances techniques \u00e9lev\u00e9es dans un espace r\u00e9duit : les circuits imprim\u00e9s HDI sont devenus incontournables dans l'industrie \u00e9lectronique. Cependant, avec la miniaturisation croissante et les circuits de plus en plus complexes, les exigences en mati\u00e8re de conception et de fabrication de circuits imprim\u00e9s multicouches augmentent.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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Qu'est-ce qui caract\u00e9rise un circuit imprim\u00e9 HDI ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Les circuits imprim\u00e9s HDI sont des circuits imprim\u00e9s multicouches compacts \u00e0 partir de quatre niveaux, qui sont g\u00e9n\u00e9ralement assembl\u00e9s de mani\u00e8re s\u00e9quentielle en plusieurs cycles de pressage au moyen de la technique SBU (Sequential Build Up). HDI est l'abr\u00e9viation de High Density Interconnect et signifie une haute densit\u00e9 de circuits. Celle-ci peut \u00eatre obtenue gr\u00e2ce \u00e0 une structure multicouche du circuit imprim\u00e9, des structures de lignes et des distances < 150 \u00b5m et des trous m\u00e9tallis\u00e9s d'une taille < 150 \u00b5m (souvent des MicroVias).<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Aper\u00e7u de la technologie et du Design to Cost<\/h4>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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W<\/b>uelles sont les exigences impos\u00e9es aux fabricants de circuits imprim\u00e9s ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Les fabricants de circuits imprim\u00e9s doivent d'une part veiller \u00e0 ce que les mat\u00e9riaux de base soient adapt\u00e9s. Il s'agit notamment d'avoir des \u00e9paisseurs de lamin\u00e9 et de cuivre aussi faibles que possible et un faible coefficient de dilatation thermique. D'autre part, les structures line space de plus en plus petites s'accompagnent d'exigences plus \u00e9lev\u00e9es en mati\u00e8re de technique d'installation. C'est l\u00e0 que l'exposition DI (direct imaging) gagne en importance, car elle offre non seulement une r\u00e9solution de layout \u00e9lev\u00e9e, mais aussi une meilleure pr\u00e9cision de positionnement. Dans le domaine des stops \u00e0 souder, l'exposition DI gagne \u00e9galement du terrain. L'exposition directe de la r\u00e9serve permet de r\u00e9duire le pas de vernis d'arr\u00eat et de diminuer le d\u00e9gagement de vernis d'arr\u00eat autour des pastilles. Dans le domaine de l'HDI, le processus de gravure doit r\u00e9pondre \u00e0 des exigences \u00e9lev\u00e9es et garantir un taux de gravure uniforme du haut et du bas.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t

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A quoi faut-il faire attention lors du layout PCB des circuits imprim\u00e9s HDI ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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En principe, il est recommand\u00e9 de prendre contact le plus t\u00f4t possible avec le fabricant de circuits imprim\u00e9s afin de conna\u00eetre ses possibilit\u00e9s. En fin de compte, le processus de layout devrait aboutir \u00e0 un layout pr\u00eat \u00e0 \u00eatre utilis\u00e9 par le fabricant. Du c\u00f4t\u00e9 du d\u00e9veloppeur et du layouter, il s'agit d'abord de d\u00e9crire \u00e0 quoi doit ressembler le futur circuit imprim\u00e9. Il faut notamment r\u00e9pondre aux questions suivantes :<\/p>

-<\/span> Quel mat\u00e9riau de base doit \u00eatre utilis\u00e9 ?<\/span><\/p>

- Combien de couches sont n\u00e9cessaires ?\u00a0<\/p>

- O\u00f9 se trouvent les trous dans la pile ?<\/p>

- Quelles sont les \u00e9paisseurs de cuivre de base n\u00e9cessaires ?<\/p>

- Des composants \u00e0 haute densit\u00e9 de connexion (par ex. BGA) sont-ils utilis\u00e9s ?<\/p>

Il est possible de d\u00e9finir la structure de la stratification ainsi que les contraintes pour tous les param\u00e8tres, par exemple les largeurs des conducteurs, les distances et les tailles des vias borgnes ou enterr\u00e9es.<\/span><\/p>

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Exemple : d\u00e9senchev\u00eatrement BGA<\/h5>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Situation TOP<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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1\u00e8re couche int\u00e9rieure<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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2\u00e8me couche int\u00e9rieure<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Quel est le r\u00f4le des technologies d'obturation dans les circuits imprim\u00e9s HDI ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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M\u00eame si elles impliquent des processus plus complexes, les technologies de fermeture telles que le Microvia-Copper-Filling ou le Plugging selon IPC-4761 Type VII offrent des avantages consid\u00e9rables.\u00a0une s\u00e9rie d'avantages. Il s'agit notamment de possibilit\u00e9s \u00e9tendues de conception et de d\u00e9senchev\u00eatrement ainsi que d'un gain de place gr\u00e2ce \u00e0 une topographie de surface presque plane. En outre, il est possible d'\u00e9viter les inclusions d'air et de fluides et de prot\u00e9ger les modules avec un vernis d'enrobage. Si les Microvias sont \u00e9galement utilis\u00e9s pour la dissipation de la chaleur, la performance thermique des circuits imprim\u00e9s HDI peut \u00eatre augment\u00e9e.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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O\u00f9 va-t-on dans le domaine HDI - qu'est-ce qui est encore possible \u00e0 l'avenir ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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A moyen et long terme, il sera possible d'utiliser des mat\u00e9riaux encore plus fins avec de meilleures propri\u00e9t\u00e9s et d'augmenter le nombre de presses. De nouveaux progr\u00e8s seront \u00e9galement r\u00e9alis\u00e9s dans le domaine de la miniaturisation, de sorte que des structures encore plus petites pourront \u00eatre r\u00e9alis\u00e9es, tant dans le sch\u00e9ma conducteur que dans le vernis d'arr\u00eat, et que des trous encore plus petits pourront \u00eatre trait\u00e9s en toute s\u00e9curit\u00e9.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t

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Vous avez d'autres questions ?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t
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Vous trouverez encore plus d'informations sur le th\u00e8me des circuits imprim\u00e9s HDI dans notre s\u00e9minaire en ligne XPERTS \"HDI - Geht's noch : M\u00f6glichkeiten zur Entflechtung hochintegrierter Bauelemente\" avec Thomas Doberitzsch et Dirk Deiters.\u00a0Pour acc\u00e9der \u00e0 la version \u00e0 la demande disponible \u00e0 tout moment, vous pouvez\u00a0<\/b><\/span>s'inscrire ici<\/b><\/u><\/a>.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

Die wichtigsten Fragen und Antworten Sie kommen in Smartphones, Flugzeugen und medizinischen Ger\u00e4ten zum Einsatz und erm\u00f6glichen eine hohe technische Performance auf kleinstem Raum: HDI-Leiterplatten sind aus der Elektronikindustrie nicht […]<\/p>\n","protected":false},"author":22,"featured_media":8025,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[302,177],"class_list":["post-8014","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenentwicklung","tag-leiterplattenherstellung"],"yoast_head":"\nHDI-Leiterplatten - M\u00f6glichkeiten und Grenzen \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"HDI-Leiterplatten sind in der heutigen Elektronikindustrie unerl\u00e4sslich. 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