{"id":4675,"date":"2021-08-18T12:00:08","date_gmt":"2021-08-18T10:00:08","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=4675"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"conseils-pour-la-conception-de-circuits-imprimes-avec-des-elements-en-cuivre-hsmtec-partie-2","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/tipps-fuer-das-leiterplattendesign-mit-kupferelementen-hsmtec-teil-2\/","title":{"rendered":"Conseils pour la conception de circuits imprim\u00e9s avec des \u00e9l\u00e9ments en cuivre (HSMtec) - Partie 2"},"content":{"rendered":"<p><strong>R\u00e8gles de conception pour les pistes conductrices de courant fort<\/strong><\/p>\n<p>Ces r\u00e8gles sont \u00e0 respecter lors de la conception de <a href=\"https:\/\/www.ksg-pcb.com\/fr\/cartes-de-circuits-imprimes\/circuit-imprime-hsmtec\/\">Circuits imprim\u00e9s HSMtec<\/a> \u00e0 prendre en compte :<\/p>\n<p>Les valeurs standard pour les circuits imprim\u00e9s HSMtec sont les suivantes : \u00e9paisseur finale de 0,8 \u00e0 3,2 mm ; 12 couches maximum ; 3 couches maximum pour les sections de cuivre avec profil\u00e9s en cuivre ainsi que des courants jusqu'\u00e0 400 A<\/p>\n<p>R\u00e8gle de base pour la capacit\u00e9 de transport de courant : pour chaque profil\u00e9 en cuivre de sa largeur, la piste conductrice doit \u00eatre plus large de 1 mm sur tout le pourtour. Exemple : un profil\u00e9 en cuivre de 8 mm n\u00e9cessite une piste conductrice de 10 mm de large.<\/p>\n<p>Les profil\u00e9s en cuivre ne doivent pas \u00eatre plac\u00e9s sur des couches voisines.<\/p>\n<p>Sur le c\u00f4t\u00e9 oppos\u00e9 du noyau FR4 de l'\u00e9l\u00e9ment en cuivre, il convient de pr\u00e9voir un d\u00e9p\u00f4t de cuivre ind\u00e9pendant du potentiel d'au moins la m\u00eame taille. Cette disposition du cuivre est ind\u00e9pendante du potentiel et sert de support univoque au profil\u00e9 de cuivre pour le soudage par ultrasons.<\/p>\n<p>Pour des raisons \u00e9conomiques, il s'agit d'acheminer les pistes conductrices de courant fort directement et en ligne droite (avec aussi peu de changements de direction des connexions de courant fort que possible). Les d\u00e9rivations dans les profil\u00e9s en cuivre peuvent \u00eatre r\u00e9alis\u00e9es \u00e0 l'aide de surfaces grav\u00e9es.<\/p>\n<p>Les profil\u00e9s en cuivre sont disponibles en quatre largeurs : 2, 4, 8 et 12 mm avec une longueur variable, qui ne doit toutefois pas \u00eatre inf\u00e9rieure \u00e0 15 mm.<\/p>\n<p>L'\u00e9cart entre les profil\u00e9s doit \u00eatre d'au moins 2,20 mm.<\/p>\n<p>Les changements de couches de profil\u00e9s en cuivre des couches int\u00e9rieures aux couches ext\u00e9rieures (et vice versa) sont possibles sans probl\u00e8me avec des trous m\u00e9tallis\u00e9s.<\/p>\n<p>Les circuits imprim\u00e9s \u00e0 courant fort conviennent \u00e0 tous les contacts de connexion courants : vis, contact \u00e0 pression, insertion en force ou soudure.<\/p>\n<p>Les Microvias et les Thermovias permettent de relier thermiquement les profil\u00e9s en cuivre \u00e0 un dissipateur thermique. Pour cela, il faut respecter les largeurs des conducteurs, les anneaux r\u00e9siduels et l'aspect ratio, de sorte qu'une quantit\u00e9 de cuivre suffisamment importante soit d\u00e9pos\u00e9e. Une \u00e9paisseur minimale de cuivre de 20 \u00b5m doit \u00eatre atteinte dans le trou.<\/p>\n<p>Comme les composants de puissance deviennent plus chauds que le conducteur de courant fort, il faut une conception optimis\u00e9e du point de vue thermique.<\/p>","protected":false},"excerpt":{"rendered":"<p>Designregeln f\u00fcr Hochstromleiterbahnen Diese Regeln sind beim Design von HSMtec-Leiterplatten zu beachten: Standardwerte f\u00fcr HSMtec-Leiterplatten sind 0,8 bis 3,2 mm Enddicke; maximal 12 Lagen; maximal 3 Lagen f\u00fcr die Kupferquerschnitte [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":4452,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[302,371],"class_list":["post-4675","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenentwicklung","tag-strombelastbarkeit"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2 \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ksg-pcb.com\/fr\/conseils-pour-la-conception-de-circuits-imprimes-avec-des-elements-en-cuivre-hsmtec-partie-2\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2 \u26af pcb-blog.com\" \/>\n<meta property=\"og:description\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ksg-pcb.com\/fr\/conseils-pour-la-conception-de-circuits-imprimes-avec-des-elements-en-cuivre-hsmtec-partie-2\/\" \/>\n<meta property=\"og:site_name\" content=\"KSG GmbH\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/ksgpcb\/\" \/>\n<meta property=\"article:published_time\" content=\"2021-08-18T10:00:08+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-02-18T07:35:28+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/06\/hsmtec-Aufbau-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1087\" \/>\n\t<meta property=\"og:image:height\" content=\"300\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Tobias Behnert\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u00c9crit par\" \/>\n\t<meta name=\"twitter:data1\" content=\"Tobias Behnert\" \/>\n\t<meta name=\"twitter:label2\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/tipps-fuer-das-leiterplattendesign-mit-kupferelementen-hsmtec-teil-2\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/tipps-fuer-das-leiterplattendesign-mit-kupferelementen-hsmtec-teil-2\\\/\"},\"author\":{\"name\":\"Tobias Behnert\",\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/en\\\/#\\\/schema\\\/person\\\/cbc2ebdaddb75f4f100b3a0395484bcb\"},\"headline\":\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) &#8211; 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