{"id":2852,"date":"2021-07-21T12:00:12","date_gmt":"2021-07-21T10:00:12","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2852"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"cartes-de-circuits-imprimes-pour-densites-de-courant-elevees-et-gestion-efficace-de-la-chaleur","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/leiterplatten-fuer-hohe-stromdichten-und-effizientes-waermemanagement\/","title":{"rendered":"Circuits imprim\u00e9s pour des densit\u00e9s de courant \u00e9lev\u00e9es et une gestion thermique efficace (1)"},"content":{"rendered":"

Le cuivre \u00e9pais, Iceberg\u00ae et HSMtec\u00ae sont trois technologies diff\u00e9rentes pour les circuits imprim\u00e9s \u00e0 courant \u00e9lev\u00e9. L'article compare les trois technologies et explique les possibilit\u00e9s de conception, la capacit\u00e9 de transport de courant et la dissipation de chaleur des semi-conducteurs de puissance.<\/strong><\/p>\n

La commande de moteur adapte le r\u00e9gime, la puissance et le couple aux besoins et aux conditions de fonctionnement et joue un r\u00f4le majeur dans l'efficacit\u00e9 \u00e9nerg\u00e9tique des moteurs industriels et des v\u00e9hicules. Une trentaine de moteurs se trouvent dans un seul v\u00e9hicule, par exemple pour le ventilateur, le refroidissement du moteur, la pompe \u00e0 eau et \u00e0 huile, les l\u00e8ve-vitres, les essuie-glaces avant et arri\u00e8re.<\/p>\n

Du c\u00f4t\u00e9 du mat\u00e9riel, les utilisateurs et les fabricants de syst\u00e8mes exigent de l'innovation dans les composants d'acquisition, de conversion et de conditionnement des signaux. Les producteurs de circuits imprim\u00e9s et de connectique se sont \u00e9galement adapt\u00e9s \u00e0 ce march\u00e9 : Les processus de fabrication, les mat\u00e9riaux et les designs sont optimis\u00e9s pour r\u00e9pondre aux exigences sp\u00e9cifiques en mati\u00e8re de capacit\u00e9 de charge de courant, de gestion thermique et de fiabilit\u00e9.<\/p>\n

Du point de vue du circuit imprim\u00e9, les sp\u00e9cifications de l'\u00e9lectronique d'entra\u00eenement peuvent \u00eatre r\u00e9sum\u00e9es en cinq points :
\n1. Haute densit\u00e9 d'int\u00e9gration,
\n2. la fiabilit\u00e9 de l'assemblage \u00e9lectronique
\n3. dissipation rapide de la chaleur,
\n4. Courants \u00e9lev\u00e9s combin\u00e9s \u00e0 l'\u00e9lectronique de commande,
\n5. r\u00e9duire les co\u00fbts du syst\u00e8me, par exemple en passant aux composants CMS, \u00e0 moins de composants ou de processus d'assemblage.<\/p>\n

Une solution intelligente consiste \u00e0 combiner les exigences pour la partie puissance et l'\u00e9lectronique de commande, les circuits de charge et la commande sur un seul circuit imprim\u00e9 plut\u00f4t que sur deux circuits imprim\u00e9s - grandes sections de conducteurs et grandes distances d'isolation pour les conducteurs de courant fort et structures de conducteurs fins pour la commande. Cela permet de supprimer les connecteurs, les c\u00e2bles et les barres conductrices, les \u00e9tapes de montage et les risques qui limitent la fiabilit\u00e9. Cela permet \u00e0 son tour de gagner de la place, d'augmenter la fiabilit\u00e9 et la rentabilit\u00e9.<\/p>\n

Le site conception optimale des circuits imprim\u00e9s pour l'\u00e9lectronique de puissance ou les applications \u00e0 courant \u00e9lev\u00e9<\/strong> d\u00e9terminent cinq aspects essentiels :<\/p>\n

1. la connaissance des possibilit\u00e9s techniques du proc\u00e9d\u00e9 qui impose des r\u00e8gles de conception sp\u00e9cifiques<\/p>\n

2. le dimensionnement des conducteurs de courant fort et des distances d'isolation.<\/p>\n

3. le choix, la combinaison et l'utilisation maximale des mat\u00e9riaux.<\/p>\n

4. la structure des couches, qui est en partie d\u00e9terminante pour la capacit\u00e9 de charge du courant et la dissipation de la chaleur.<\/p>\n

5. une conception thermiquement optimis\u00e9e du circuit imprim\u00e9.<\/p>\n

Le sp\u00e9cialiste des circuits imprim\u00e9s KSG propose trois technologies utilis\u00e9es dans ces applications : La technologie du cuivre \u00e9pais, la technologie Iceberg\u00ae et la technologie HSMtec\u00ae. Dans ces trois applications, le mat\u00e9riau de base standard FR4 peut \u00eatre utilis\u00e9.<\/p>\n

Les circuits imprim\u00e9s en cuivre \u00e9pais r\u00e9partissent les pertes de puissance horizontalement<\/strong><\/p>\n

L'industrie des circuits imprim\u00e9s parle g\u00e9n\u00e9ralement de cuivre \u00e9pais pour les structures en cuivre de plus de 105 \u00b5m. Avec jusqu'\u00e0 quatre couches internes de 400 \u00b5m de cuivre chacune, il est possible d'obtenir une capacit\u00e9 de transport de courant de plusieurs centaines d'amp\u00e8res. Dans le cas id\u00e9al, les conducteurs en cuivre \u00e9pais se trouvent dans les couches internes.<\/p>\n

Les arguments en faveur du circuit imprim\u00e9 en cuivre \u00e9pais sont la flexibilit\u00e9 en cas de modification du layout, la forme compacte, la facilit\u00e9 de traitement\/d'assemblage et les co\u00fbts de modification comparativement faibles ainsi que les processus standard de l'industrie des circuits imprim\u00e9s. En raison de la forte sous-gravure, seules des structures relativement grossi\u00e8res peuvent \u00eatre cr\u00e9\u00e9es.<\/p>\n

Il est important de savoir : Les stratifi\u00e9s FR4 avec un placage de cuivre de base >105 \u00b5m ne sont pas bon march\u00e9 en raison de la forte teneur en cuivre. En comparaison avec un stratifi\u00e9 standard de 18 \u00b5m contrecoll\u00e9 sur les deux faces, le facteur se situe entre 1:8 et 1:10 en ce qui concerne les co\u00fbts des mat\u00e9riaux.21<\/p>\n

 <\/p>","protected":false},"excerpt":{"rendered":"

Dickkupfer, Iceberg\u00ae und HSMtec\u00ae sind drei verschiedene Technologien f\u00fcr Hochstromleiterplatten. Der Beitrag stellt die drei Technologien gegen\u00fcber und erkl\u00e4rt die gestalterischen M\u00f6glichkeiten, die Stromtragf\u00e4higkeit und Entw\u00e4rmung der Leistungshalbleiter. Die Motorsteuerung […]<\/p>\n","protected":false},"author":26,"featured_media":3729,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[202,177,371],"class_list":["post-2852","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-endoberflaechen","tag-leiterplattenherstellung","tag-strombelastbarkeit"],"yoast_head":"\nLeiterplatten f\u00fcr hohe Stromdichten und effizientes W\u00e4rmemanagement (1) \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"Vergleich der Leiterplattentechnologien Dickkupfer, Iceberg, HSMtec f\u00fcr hohe Stromtragf\u00e4higkeit und Entw\u00e4rmung von Leistungshalbleitern\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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