{"id":2817,"date":"2021-08-11T13:00:15","date_gmt":"2021-08-11T11:00:15","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2817"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"conception-de-circuits-imprimes-avec-des-elements-en-cuivre-ce-dont-il-faut-tenir-compte","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\/","title":{"rendered":"Conseils pour la conception de circuits imprim\u00e9s avec des \u00e9l\u00e9ments en cuivre (HSMtec) - Partie 1"},"content":{"rendered":"

Lors de la conception de Circuits imprim\u00e9s HSMtec<\/a> avec des \u00e9l\u00e9ments en cuivre int\u00e9gr\u00e9s, il est en principe recommand\u00e9 de concevoir les conducteurs de courant fort avant le layout standard. Le processus de d\u00e9veloppement d'un circuit imprim\u00e9 HSMtec se d\u00e9roule en 10 \u00e9tapes de conception :<\/p>\n

    \n
  1. D\u00e9finir les caract\u00e9ristiques m\u00e9caniques : D\u00e9finir la taille et le contour du circuit imprim\u00e9<\/li>\n
  2. Placer les composants de puissance : d\u00e9finir des chemins courts et simples pour les pistes conductrices de courant fort<\/li>\n
  3. D\u00e9finir les intensit\u00e9s de courant : par ex. 80 ou 110 A<\/li>\n
  4. D\u00e9finir les conditions ambiantes : Temp\u00e9rature ambiante, par exemple 60 \u00b0C et diff\u00e9rence de temp\u00e9rature maximale Delta T de 40 K<\/li>\n
  5. D\u00e9finir la structure des couches et les couches de cuivre : Il est recommand\u00e9 de travailler de pr\u00e9f\u00e9rence avec des couches internes massives et d'inonder de cuivre toutes les surfaces libres des couches externes.<\/li>\n
  6. Calculer les sections de c\u00e2ble n\u00e9cessaires en fonction des conditions ambiantes et de la structure des couches.<\/li>\n
  7. Routage des pistes conductrices de courant fort
    \nPour le routage, la r\u00e8gle de base est la suivante : pour chaque largeur de profil, la piste conductrice doit \u00eatre plus large d'au moins 1 mm sur tout le pourtour. Exemple : un profil\u00e9 en cuivre de 8 mm n\u00e9cessite une piste conductrice d'au moins 10 mm de large, 2 fois 4 mm en parall\u00e8le n\u00e9cessitent une piste conductrice d'au moins 12 mm de large.<\/li>\n
  8. Conception des profil\u00e9s en cuivre, par exemple avec une couche auxiliaire
    \n    L'\u00e9quipe KSG se fera un plaisir de vous aider \u00e0 choisir les \u00e9l\u00e9ments en cuivre.<\/strong><\/a><\/li>\n
  9. Placer les trous pour le courant fort et les composants de puissance : trous m\u00e9tallis\u00e9s, thermovias - d\u00e9finir des microvias dans le chemin thermique des MOSFET sur les profils en cuivre. Placer des microvias de 0,1 mm de diam\u00e8tre et d'un pas de 0,5 mm dans les heatpads des MOSFET, qui seront en contact avec le profil\u00e9 de cuivre sous-jacent. Placer des thermovias autour du heatpad des MOSFET. Pour un diam\u00e8tre de 0,5 mm des thermovias, choisir par exemple un pas de 1,0 mm.<\/li>\n
  10. Routage de la partie logique du circuit<\/li>\n<\/ol>\n

    Le d\u00e9veloppeur d\u00e9finit les \u00e9tapes 1 \u00e0 4, pour les \u00e9tapes 5 et 6, KSG propose un Calculateur de courant fort<\/a> ou bien le \u00c9quipe KSG<\/a> avec plaisir.<\/p>","protected":false},"excerpt":{"rendered":"

    Beim\u00a0Design von HSMtec-Leiterplatten mit integrierten Kupferelementen empfiehlt sich grunds\u00e4tzlich das Design der Hochstromleiter vor dem Standardlayout. Der Entwicklungsprozess einer HSMtec-Leiterplatte l\u00e4uft in 10 Designschritten ab: Mechanische Merkmale definieren: Gr\u00f6\u00dfe und […]<\/p>\n","protected":false},"author":26,"featured_media":4452,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[302,371],"class_list":["post-2817","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenentwicklung","tag-strombelastbarkeit"],"yoast_head":"\nTipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 1 \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"Beim Design von HSMtec-Leiterplatten mit integrierten Kupferelementen sind verschiedene Regeln beim Leiterplattendesign zu beachten\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ksg-pcb.com\/fr\/conception-de-circuits-imprimes-avec-des-elements-en-cuivre-ce-dont-il-faut-tenir-compte\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 1 \u26af pcb-blog.com\" \/>\n<meta property=\"og:description\" content=\"Beim Design von HSMtec-Leiterplatten mit integrierten Kupferelementen sind verschiedene Regeln beim Leiterplattendesign zu beachten\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ksg-pcb.com\/fr\/conception-de-circuits-imprimes-avec-des-elements-en-cuivre-ce-dont-il-faut-tenir-compte\/\" \/>\n<meta property=\"og:site_name\" content=\"KSG GmbH\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/ksgpcb\/\" \/>\n<meta property=\"article:published_time\" content=\"2021-08-11T11:00:15+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2025-02-18T07:35:28+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/06\/hsmtec-Aufbau-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1087\" \/>\n\t<meta property=\"og:image:height\" content=\"300\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Tobias Behnert\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u00c9crit par\" \/>\n\t<meta name=\"twitter:data1\" content=\"Tobias Behnert\" \/>\n\t<meta name=\"twitter:label2\" content=\"Dur\u00e9e de lecture estim\u00e9e\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/\"},\"author\":{\"name\":\"Tobias Behnert\",\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/en\\\/#\\\/schema\\\/person\\\/cbc2ebdaddb75f4f100b3a0395484bcb\"},\"headline\":\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) – Teil 1\",\"datePublished\":\"2021-08-11T11:00:15+00:00\",\"dateModified\":\"2025-02-18T07:35:28+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/\"},\"wordCount\":267,\"publisher\":{\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/en\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ksg-pcb.com\\\/wp-content\\\/uploads\\\/2021\\\/06\\\/hsmtec-Aufbau-1.jpg\",\"keywords\":[\"Leiterplattenentwicklung\",\"Strombelastbarkeit\"],\"articleSection\":[\"Blog\"],\"inLanguage\":\"fr-FR\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/\",\"url\":\"https:\\\/\\\/www.ksg-pcb.com\\\/leiterplattendesign-mit-kupferelementen-das-ist-zu-beachten\\\/\",\"name\":\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - 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