{"id":2815,"date":"2021-06-02T11:00:43","date_gmt":"2021-06-02T09:00:43","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2815"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"circuits-imprimes-3d-trois-technologies-trois-exemples-partie-3","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/3d-leiterplatten-drei-technologien-drei-beispiele-teil-3\/","title":{"rendered":"Circuits imprim\u00e9s 3D : trois technologies, trois exemples (partie 3)"},"content":{"rendered":"
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Circuit imprim\u00e9 3D HSMtec : la construction 3D autoportante<\/strong><\/p>\n\n

Le circuit imprim\u00e9 3D HSMtec se passe de feuille flexible au niveau du point de pliage. Cette technique utilise des fils et des profil\u00e9s de cuivre press\u00e9s dans le mat\u00e9riau FR4 du multicouche comme mat\u00e9riau pliable. Sur les bords de pliage, le FR4 est enlev\u00e9 par des fraisages d'encoches. Sur ces points de pliage, il est possible d'aligner des segments individuels avec un angle d'inclinaison allant jusqu'\u00e0 \u00b190\u00b0. La particularit\u00e9 : les profil\u00e9s en cuivre permettent une construction autoportante, m\u00eame si des courants \u00e9lev\u00e9s ou de la chaleur sont conduits par-dessus le bord de pliage. De cette mani\u00e8re, il est possible de combiner des applications multidimensionnelles avec de l'\u00e9lectronique de puissance sur la zone de pliage ou avec un \u00e9talement rapide de la chaleur pour les supports de circuits pour les LED.<\/p>\n\n

La construction est pr\u00e9destin\u00e9e aux pliages uniques, par exemple pour les applications o\u00f9 la zone flexible n'est pli\u00e9e que pour le montage du module. Le circuit imprim\u00e9 est qualifi\u00e9 selon DIN EN 60068-2-14 et JEDEC A 101-A et audit\u00e9 pour l'a\u00e9ronautique et l'automobile. Autre avantage : gr\u00e2ce \u00e0 la faible absorption d'humidit\u00e9, les pr\u00e9traitements thermiques lors du brasage sont inutiles. De plus, tous les autres processus sont enti\u00e8rement compatibles avec le processus standard.<\/p>\n\n

\n
\"Cube<\/a>
Le cube eCube de Continental d\u00e9montre un module qui se monte sur la carte m\u00e8re des commandes de moteur via des connecteurs BGA.<\/figcaption><\/figure>\n<\/figure>\n\n

Les possibilit\u00e9s de cette structure 3D sont d\u00e9montr\u00e9es par eCube - un cube, n\u00e9 d'un projet de recherche dirig\u00e9 par Continental Automotive. L'objectif \u00e9tait de d\u00e9velopper un circuit imprim\u00e9 tridimensionnel en forme de cube ou de parall\u00e9l\u00e9pip\u00e8de, bas\u00e9 sur un layout de circuit imprim\u00e9 standard existant de Continental pour une commande de moteur. Les composants devaient \u00eatre mont\u00e9s sur le circuit imprim\u00e9 sur une ligne d'assemblage \u00e0 l'aide des machines de placement automatiques existantes. Apr\u00e8s le placement, le circuit imprim\u00e9 a \u00e9t\u00e9 pli\u00e9 au niveau des ar\u00eates de pliage d\u00e9finies et les ar\u00eates de jonction obtenues ont \u00e9t\u00e9 reli\u00e9es \u00e9lectriquement et m\u00e9caniquement.<\/p>\n\n

\n
\"Sch\u00e9ma<\/a>
Principe d'un circuit imprim\u00e9 3D HSMtec : Des \u00e9l\u00e9ments en cuivre press\u00e9s en multicouche servent de mat\u00e9riau pliable. Sur les ar\u00eates de pliage, le mat\u00e9riau du circuit imprim\u00e9 est enlev\u00e9 par des fraisages d'encoches.<\/figcaption><\/figure>\n<\/figure>\n\n

Une fois les bords reli\u00e9s, le cube a \u00e9t\u00e9 align\u00e9 sur la plaque de base et assembl\u00e9 aussi bien \u00e9lectriquement que m\u00e9caniquement. Le cube est reli\u00e9 \u00e0 la carte m\u00e8re de la commande moteur par une structure de type ball grid array. Ce qui semble compliqu\u00e9 au premier abord, \u00e0 savoir monter une construction de circuit imprim\u00e9 multidimensionnelle sur le circuit imprim\u00e9 proprement dit de la commande moteur, est une solution techniquement intelligente et \u00e9conomique lorsqu'on y regarde de plus pr\u00e8s. Le circuit imprim\u00e9 multidimensionnel permet de construire un module qui peut \u00eatre fabriqu\u00e9 en diff\u00e9rentes variantes, mais de mani\u00e8re standardis\u00e9e, tout en utilisant l'espace de montage disponible.<\/p>\n\n

\n
\"Tableau<\/a>
Le tableau pr\u00e9sente une comparaison des technologies de circuits imprim\u00e9s 3D et de leurs caract\u00e9ristiques.<\/figcaption><\/figure>\n<\/figure>\n\n

Conseil d'expert : le grand \u00e9cart parfait<\/strong><\/p>\n\n

Les circuits imprim\u00e9s multidimensionnels apportent une valeur ajout\u00e9e \u00e0 l'assemblage \u00e9lectronique. Bien que le circuit imprim\u00e9 3D soit plus valorisant et plus cher \u00e0 fabriquer qu'un circuit imprim\u00e9 rigide, les co\u00fbts du syst\u00e8me de la solution globale diminuent. Le circuit imprim\u00e9 tridimensionnel est lay-out\u00e9 et fabriqu\u00e9 comme un circuit imprim\u00e9 bidimensionnel et, apr\u00e8s l'assemblage, il est mis dans la forme tridimensionnelle souhait\u00e9e. Du point de vue du fabricant de circuits imprim\u00e9s, la finalit\u00e9 est au premier plan et il s'agit de trouver le juste milieu entre stabilit\u00e9, flexibilit\u00e9 et pr\u00e9cision. La stabilit\u00e9, pour que le circuit imprim\u00e9 fini puisse \u00eatre \u00e9quip\u00e9, passer au four \u00e0 refusion et \u00eatre test\u00e9 ; la flexibilit\u00e9, pour que le circuit imprim\u00e9 puisse \u00eatre s\u00e9par\u00e9 facilement et rapidement de son support ; et la pr\u00e9cision, parce qu'un trop grand nombre de barrettes de maintien laisserait des traces peu nettes.<\/p>\n

Circuits imprim\u00e9s 3D : trois technologies, trois exemples - Partie 1<\/a><\/p>\n

Circuits imprim\u00e9s 3D : trois technologies, trois exemples - Partie 2<\/span><\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

HSMtec 3D-Leiterplatte: die selbsttragende 3D-Konstruktion Ohne Flexfolie an der Biegestelle kommt die HSMtec 3D-Leiterplatte aus. Bei dieser Technik werden Kupferdr\u00e4hte und Kupferprofile, die im FR4-Material des Multilayers verpresst sind, als […]<\/p>\n","protected":false},"author":26,"featured_media":3940,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[235],"class_list":["post-2815","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenwissen"],"yoast_head":"\n3D-Leiterplatten: drei Technologien, drei Beispiele (Teil 3) \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"3D-Leiterplatten: drei Technologien, drei Beispiele (Teil 3): HSMtec 3D-Leiterplatte: die selbsttragende 3D-Konstruktion\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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