{"id":2568,"date":"2021-04-14T10:00:00","date_gmt":"2021-04-14T08:00:00","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2568"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"ksg-sinvite-dans-le-proces-du-plugging","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/ksg-holt-sich-plugging-prozess-ins-haus\/","title":{"rendered":"KSG lance le processus de branchement en interne"},"content":{"rendered":"&#13;\n<p class=\"wp-block-paragraph\">Le fabricant de circuits imprim\u00e9s KSG a introduit dans sa production le proc\u00e9d\u00e9 de plugging pour le remplissage des trous de passage et des trous borgnes. Les densit\u00e9s d'int\u00e9gration plus \u00e9lev\u00e9es possibles avec le plugging permettent un gain de place consid\u00e9rable dans les montages SBU (SBU : montage s\u00e9quentiel) et donc moins de restrictions dans la conception de layout de circuits complexes (technologie \"via in pad\" ou \"staggered\/stacked microvia on buried via\").<\/p>&#13;\n<p>KSG a opt\u00e9 pour le remplissage sous vide vertical sur toute la surface en raison du large \u00e9ventail d'applications. Outre les trous traversants, ce proc\u00e9d\u00e9 permet de remplir rapidement, de mani\u00e8re fiable et avec une reproductibilit\u00e9 constante, des trous borgnes perc\u00e9s m\u00e9caniquement ou au laser, ce qui le rend adapt\u00e9 \u00e0 un grand nombre d'applications. D'autres avantages par rapport \u00e0 la s\u00e9rigraphie traditionnelle sont le remplissage des trous sans bulles d'air, une grande flexibilit\u00e9, une consommation r\u00e9duite de p\u00e2te et le remplissage de trous de forage avec des profondeurs de trous plus exigeantes.<\/p>&#13;\n<p>La proc\u00e9dure interne nous permet d'\u00e9tendre nos capacit\u00e9s en plus de la possibilit\u00e9 de recourir \u00e0 des services externes, qui existe toujours. Nous augmentons ainsi notre flexibilit\u00e9, dans l'int\u00e9r\u00eat de nos clients\", explique Christof Sofsky, directeur des ventes chez KSG.<\/p>&#13;","protected":false},"excerpt":{"rendered":"<p>&#13; Der Leiterplattenhersteller KSG hat das Plugging-Verfahren zum F\u00fcllen von Durchgangs- und Sackl\u00f6chern in seiner Produktion eingef\u00fchrt. Die beim Plugging m\u00f6glichen h\u00f6heren Integrationsdichten f\u00fchren zu einem erheblichen Platzgewinn bei SBU-Aufbauten [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[364],"tags":[377,177,379],"class_list":["post-2568","post","type-post","status-publish","format-standard","hentry","category-news","tag-information","tag-leiterplattenherstellung","tag-prozessentwicklung"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>KSG startet Plugging-Prozess inhouse \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"Leiterplattenhersteller KSG hat den Plugging-Prozess zum Verf\u00fcllen von Durchgangs- und Sacklochbohrungen in seiner Fertigung implementiert.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, 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