{"id":2503,"date":"2021-05-19T12:00:00","date_gmt":"2021-05-19T10:00:00","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2503"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"cartes-de-circuits-imprimes-3d-trois-technologies-trois-exemples-partie-1","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/3d-gedruckte-leiterplatten-drei-technologien-drei-beispiele-teil-1\/","title":{"rendered":"Circuits imprim\u00e9s 3D : trois technologies, trois exemples (partie 1)"},"content":{"rendered":"&#13;\n<p class=\"wp-block-paragraph\"><strong>Les circuits imprim\u00e9s tridimensionnels utilisent de mani\u00e8re optimale l'espace de montage limit\u00e9 et peuvent \u00eatre construits avec diff\u00e9rents proc\u00e9d\u00e9s, variantes d'\u00e9quipement et mat\u00e9riaux. Avec Starrflex, Semiflex et HSMtec 3D, nous pr\u00e9sentons trois proc\u00e9d\u00e9s de fabrication et mettons en lumi\u00e8re leurs caract\u00e9ristiques techniques, leurs possibilit\u00e9s d'application ainsi que leurs avantages et limites.<\/strong><\/p>&#13;\n<p>Augmenter la densit\u00e9 d'empaquetage, r\u00e9duire le poids tout en augmentant la fiabilit\u00e9 des modules - les circuits imprim\u00e9s tridimensionnels sont utilis\u00e9s dans un nombre croissant de produits. La possibilit\u00e9 de connecter directement des parties d'un circuit sur diff\u00e9rents circuits imprim\u00e9s ou segments de circuits imprim\u00e9s remplace les connecteurs et les c\u00e2bles. En outre, les circuits imprim\u00e9s 3D ouvrent de nouvelles possibilit\u00e9s de conception et contribuent \u00e0 r\u00e9duire les co\u00fbts des syst\u00e8mes.<\/p>&#13;\n<p>Les circuits imprim\u00e9s se caract\u00e9risent par le fait qu'ils sont con\u00e7us sous forme de platine bidimensionnelle, fabriqu\u00e9s et assembl\u00e9s dans le panneau. Ce n'est qu'apr\u00e8s le montage que le circuit imprim\u00e9 est pli\u00e9 dans sa forme tridimensionnelle. On fait la diff\u00e9rence entre un pliage unique pour le montage, quelques pliages, par exemple lors de l'utilisation, ou un pliage permanent, par exemple pour des cycles de pliage \u00e9lev\u00e9s lors de l'utilisation.<\/p>&#13;\n<p><strong>Circuit imprim\u00e9 rigide et flexible : g\u00e9om\u00e9tries et layouts vari\u00e9s<\/strong><\/p>&#13;\n<p>Les circuits imprim\u00e9s flex-rigides sont la solution pr\u00e9f\u00e9r\u00e9e et optimale lorsque plusieurs circuits imprim\u00e9s rigides doivent \u00eatre connect\u00e9s \u00e9lectriquement dans diff\u00e9rentes positions de montage et orientations. Les \u00e9l\u00e9ments du circuit sont r\u00e9partis sur plusieurs supports de circuit rigides et reli\u00e9s entre eux par un film de circuit imprim\u00e9 flexible en polyimide. Le film flexible est int\u00e9gr\u00e9 dans la structure en couches des circuits imprim\u00e9s connect\u00e9s. Les parties flexibles et rigides sont reli\u00e9es \u00e9lectriquement. Aux points de pliage, le mat\u00e9riau FR4 est frais\u00e9 jusqu'\u00e0 la feuille flexible. Le polyimide fin garantit une adaptabilit\u00e9 tridimensionnelle maximale aux espaces limit\u00e9s. L'encombrement du circuit imprim\u00e9 peut pour ainsi dire \u00eatre \"escamot\u00e9\".<\/p>&#13;\n<p>La technologie Starr-Flex est tr\u00e8s polyvalente en termes de possibilit\u00e9s d'agencement et de g\u00e9om\u00e9tries. Elle pr\u00e9sente d'autres avantages : L'\u00e9limination de nombreux points de soudure, c\u00e2bles, fils, ponts et connecteurs permet non seulement de minimiser l'espace et le poids, mais aussi d'\u00e9liminer les sources d'erreur potentielles et de r\u00e9duire les co\u00fbts globaux. Toutefois, avec les mat\u00e9riaux minces de la partie flexible du circuit imprim\u00e9, il faut tenir compte des rayons de courbure et des cycles de pliage.<\/p>&#13;\n&#13;\n<figure class=\"wp-block-image size-large\">&#13;\n<figure id=\"attachment_811\" aria-describedby=\"caption-attachment-811\" style=\"width: 628px\" class=\"wp-caption alignnone\"><img fetchpriority=\"high\" decoding=\"async\" class=\"wp-image-2338\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Starrfex-Leiterplatte-3D.jpg\" alt=\"Multicouche Starrflex\" width=\"628\" height=\"353\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Starrfex-Leiterplatte-3D.jpg 628w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Starrfex-Leiterplatte-3D-300x169.jpg 300w\" sizes=\"(max-width: 628px) 100vw, 628px\" \/><figcaption id=\"caption-attachment-811\" class=\"wp-caption-text\">Multicouche rigide-flex : les composants \u00e9lectroniques de la pince porte-outil Power-Check sont log\u00e9s sur un multicouche rigide-flex \u00e0 4 couches qui relie quatre parties rigides \u00e0 une partie flexible.<\/figcaption><\/figure>&#13;\n<\/figure><p>Un exemple : le bo\u00eetier compact de la pince \u00e0 outils Power-Check de Ott-Jakob en Allg\u00e4u s'adapte dans les magasins d'outils de tous les fabricants de machines. Le serre-outil contr\u00f4le la force avec laquelle l'outil est enfonc\u00e9 dans le c\u00f4ne de la broche de la machine-outil. Si la force est inf\u00e9rieure \u00e0 un certain seuil, il y a un risque d'usure accrue de l'outil ou de vibrations qui laissent des marques d'usinage non nettoy\u00e9es sur une pi\u00e8ce. Le Power-Check ne contr\u00f4le pas seulement la force : lors de la mise en place d'une nouvelle broche motoris\u00e9e, il est possible de simuler diff\u00e9rentes tol\u00e9rances pour des outils de diff\u00e9rentes longueurs. En outre, des sorties de commutation num\u00e9riques peuvent \u00eatre programm\u00e9es pour envoyer des signaux clairs indiquant si un outil est bien ou mal bloqu\u00e9.<\/p>&#13;\n<p>Le design sophistiqu\u00e9 est r\u00e9alis\u00e9 dans un multicouche rigide-flex \u00e0 quatre couches - seulement 122,89 mm de long et 70,15 mm de large - avec une surface nickel-or sans \u00e9lectricit\u00e9, qui relie quatre parties rigides avec, entre autres, une partie flexible qui se soul\u00e8ve. On y trouve, entre autres, un microcontr\u00f4leur, un amplificateur d'appareils de mesure, plusieurs commutateurs magn\u00e9tiques, des LED pour l'affichage, une face avant compl\u00e8te pour la transmission radio et une pile au lithium pour le stockage de l'\u00e9nergie.<\/p>&#13;","protected":false},"excerpt":{"rendered":"<p>&#13; Dreidimensionale Leiterplatten nutzen den begrenzten Bauraum optimal aus und k\u00f6nnen mit verschiedenen Verfahren, Best\u00fcckungsvarianten und Materialien aufgebaut werden. Mit Starrflex, Semiflex und HSMtec 3D stellen wir drei Fertigungsverfahren vor [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":2277,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[235],"class_list":["post-2503","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenwissen"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>3D-Leiterplatten: drei Technologien, drei Beispiele (Teil 1) \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"3D-Leiterplatten er\u00f6ffnen neue konstruktive M\u00f6glichkeiten und helfen, Systemkosten zu reduzieren: starrflex, semiflec, HSMtec 3D im Vergleich\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" 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