{"id":11664,"date":"2024-10-10T08:20:14","date_gmt":"2024-10-10T06:20:14","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=11664"},"modified":"2026-03-12T07:15:12","modified_gmt":"2026-03-12T06:15:12","slug":"ce-qui-est-important-pour-le-fanout-bga-des-structures-sbu","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/","title":{"rendered":"Ce qui importe dans le fanout BGA des structures SBU"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"11664\" class=\"elementor elementor-11664\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5737375f e-flex e-con-boxed e-con e-parent\" data-id=\"5737375f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-1ac97d3f e-con-full e-flex e-con e-child\" data-id=\"1ac97d3f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9f1e996 elementor-nav-menu__align-start elementor-nav-menu--dropdown-tablet elementor-nav-menu__text-align-aside elementor-nav-menu--toggle elementor-nav-menu--burger elementor-widget elementor-widget-nav-menu\" data-id=\"9f1e996\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;layout&quot;:&quot;vertical&quot;,&quot;submenu_icon&quot;:{&quot;value&quot;:&quot;&lt;i class=\\&quot;fas fa-caret-down\\&quot; aria-hidden=\\&quot;true\\&quot;&gt;&lt;\\\/i&gt;&quot;,&quot;library&quot;:&quot;fa-solid&quot;},&quot;toggle&quot;:&quot;burger&quot;}\" data-widget_type=\"nav-menu.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t<nav aria-label=\"BGA Fanout\" class=\"elementor-nav-menu--main elementor-nav-menu__container elementor-nav-menu--layout-vertical e--pointer-background e--animation-fade\">\n\t\t\t\t<ul id=\"menu-1-9f1e996\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30504\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/\" class=\"elementor-item\">Partie I : ce qui est important pour le fanout BGA des superstructures SBU<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30830\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/bga-fanout-im-sbu-aufbau-weitergedacht\/\" class=\"elementor-item\">Partie 2 : BGA Fanout dans la structure du SBU<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t<div class=\"elementor-menu-toggle\" role=\"button\" tabindex=\"0\" aria-label=\"Permuter le menu\" aria-expanded=\"false\">\n\t\t\t<i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--open eicon-menu-bar\"><\/i><i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--close eicon-close\"><\/i>\t\t<\/div>\n\t\t\t\t\t<nav class=\"elementor-nav-menu--dropdown elementor-nav-menu__container\" aria-hidden=\"true\">\n\t\t\t\t<ul id=\"menu-2-9f1e996\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30504\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/\" class=\"elementor-item\" tabindex=\"-1\">Partie I : ce qui est important pour le fanout BGA des superstructures SBU<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30830\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/bga-fanout-im-sbu-aufbau-weitergedacht\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 2 : BGA Fanout dans la structure du SBU<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a9c6936 e-flex e-con-boxed e-con e-parent\" data-id=\"a9c6936\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-04cf48b elementor-widget elementor-widget-text-editor\" data-id=\"04cf48b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Le Ball Grid Array (BGA) est une technologie de bo\u00eetier populaire pour les circuits int\u00e9gr\u00e9s, qui permet un nombre \u00e9lev\u00e9 de broches et une construction compacte. Par rapport aux m\u00e9thodes traditionnelles de connexion des broches, le BGA offre de meilleures performances thermiques et \u00e9lectriques. Un aspect critique de l'utilisation du BGA est la conception du fanout, qui d\u00e9crit la connexion des broches de la puce BGA aux pistes du circuit imprim\u00e9 (PCB).<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-22b2ad2 e-flex e-con-boxed e-con e-parent\" data-id=\"22b2ad2\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7b3d44b elementor-widget elementor-widget-heading\" data-id=\"7b3d44b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Qu'est-ce que BGA-Fanout ?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9179da3 e-flex e-con-boxed e-con e-parent\" data-id=\"9179da3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9d5273f elementor-widget elementor-widget-text-editor\" data-id=\"9d5273f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Le terme <strong>Fanout<\/strong> fait r\u00e9f\u00e9rence \u00e0 la m\u00e9thode d'acheminement des connexions \u00e9lectriques depuis les bornes \u00e0 billes d'une puce BGA jusqu'aux pistes conductrices du PCB. Comme les broches BGA sont plac\u00e9es sous la puce, la conception n\u00e9cessite des m\u00e9thodes et des approches sp\u00e9cifiques pour rendre ces connexions efficaces et fiables.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-fd5070e e-flex e-con-boxed e-con e-parent\" data-id=\"fd5070e\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-acfd6d4 elementor-widget elementor-widget-heading\" data-id=\"acfd6d4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Consid\u00e9rations importantes pour la conception de BGA-Fanout<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-196d181 e-flex e-con-boxed e-con e-parent\" data-id=\"196d181\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-c113d39 e-con-full e-flex e-con e-child\" data-id=\"c113d39\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-870ae71 elementor-widget elementor-widget-text-editor\" data-id=\"870ae71\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Design et espacement des pads<\/strong>:<br \/><span style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); color: var( --e-global-color-primary );\">Les pastilles reli\u00e9es aux billes du BGA doivent \u00eatre positionn\u00e9es avec pr\u00e9cision. L'espace entre les pastilles doit \u00eatre suffisant pour \u00e9viter les courts-circuits et garantir une connexion soud\u00e9e fiable.<\/span><\/p><p><strong>Types de via et placement<\/strong>:<br \/><strong>Vias \u00e0 trous m\u00e9tallis\u00e9s<\/strong> (Through-Hole Vias) : Ces vias traversent l'ensemble du circuit imprim\u00e9 et relient toutes les couches entre elles. Ils sont faciles \u00e0 fabriquer, mais peuvent prendre plus de place.<br \/><strong>Vias aveugles<\/strong> (Vias aveugles) : Ces vias relient uniquement la couche ext\u00e9rieure \u00e0 une ou plusieurs couches int\u00e9rieures, sans traverser l'ensemble du circuit imprim\u00e9. Ils permettent de gagner de la place et sont souvent utilis\u00e9s dans les PCB HDI (High-Density Interconnect).<br \/><strong>Vias enterr\u00e9s<\/strong> (Buried Vias) : Ces vias se trouvent enti\u00e8rement \u00e0 l'int\u00e9rieur des couches internes du circuit imprim\u00e9 et ne sont pas visibles depuis les couches externes.<\/p><p><b>Guidage des pistes :<br \/><\/b>Les pistes conductrices doivent \u00eatre guid\u00e9es de mani\u00e8re \u00e0 ne pas se croiser et \u00eatre suffisamment espac\u00e9es pour \u00e9viter les courts-circuits. <span style=\"font-size: 16px;\">Des techniques de guidage des pistes plus \u00e9troites, comme les microvias et les pistes plus fines, sont souvent n\u00e9cessaires pour les BGA \u00e0 haute densit\u00e9 de broches.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c70ed03 e-con-full e-flex e-con e-child\" data-id=\"c70ed03\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-35ccdc3 e-con-full e-flex e-con e-child\" data-id=\"35ccdc3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3abd082 elementor-widget elementor-widget-text-editor\" data-id=\"3abd082\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: bold;\">Int\u00e9grit\u00e9 du signal et de la puissance<\/span>:<br \/>La minimisation des r\u00e9flexions de signaux et de la diaphonie est cruciale, en particulier pour les signaux \u00e0 grande vitesse. Les lignes d'alimentation doivent \u00eatre con\u00e7ues de mani\u00e8re \u00e0 pouvoir fournir suffisamment de courant sans provoquer de chute de tension ou de bruit excessif.<\/p><p><span style=\"font-weight: bold;\">Gestion thermique<\/span>:<br \/>La conception du fanout peut \u00e9galement influencer la gestion thermique. Les bonnes dispositions tiennent compte de la dissipation de la chaleur afin d'\u00e9viter la surchauffe des composants.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-899194b elementor-widget elementor-widget-image\" data-id=\"899194b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"450\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1024x576.jpg\" class=\"attachment-large size-large wp-image-2329\" alt=\"HDI-SBU-Multilayer\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1024x576.jpg 1024w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-300x169.jpg 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-768x432.jpg 768w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1536x864.jpg 1536w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2.jpg 1920w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-3029c82 e-flex e-con-boxed e-con e-parent\" data-id=\"3029c82\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3b5197f elementor-widget elementor-widget-heading\" data-id=\"3b5197f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">\u00c9tapes de la conception d'un design optimis\u00e9<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5994379 e-flex e-con-boxed e-con e-parent\" data-id=\"5994379\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-12ef3bd e-con-full e-flex e-con e-child\" data-id=\"12ef3bd\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7443f80 elementor-widget elementor-widget-image\" data-id=\"7443f80\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t<figure class=\"wp-caption\">\n\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"534\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1024x683.png\" class=\"attachment-large size-large wp-image-10215\" alt=\"KSG Digital Design Compass live S\u00e9minaire Thumbnail PCB Layout\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1024x683.png 1024w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-300x200.png 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-768x512.png 768w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1536x1025.png 1536w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-2048x1366.png 2048w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t<figcaption class=\"widget-image-caption wp-caption-text\">Le Digital Design Compass - La plate-forme intelligente pour un d\u00e9veloppement rapide et s\u00fbr des PCB.<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5b58e22 e-con-full e-flex e-con e-child\" data-id=\"5b58e22\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-47f3914 elementor-widget elementor-widget-text-editor\" data-id=\"47f3914\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ol><li>Choisir un logiciel de conception<\/li><li>\u00c9tudier la fiche de donn\u00e9es du composant<\/li><li>Concevoir un layout pad et via<\/li><li>Routage des pistes<\/li><li>Appliquer les r\u00e8gles de conception<\/li><li>Simulation et v\u00e9rification<\/li><li>Prototypage et test<\/li><\/ol><p>Pour le point \"3. Concevoir un pad et un via layout\", notre <a href=\"https:\/\/design-compass.ksg-pcb.com\/Login.htm\" target=\"_blank\" rel=\"noopener\">Digital Design Compass <\/a>avec les articles<\/p><p><a href=\"https:\/\/design-compass.ksg-pcb.com\/Design-Compass.htm?entry=6463b665b4398df7e0ab8ef0&amp;sharedArticle=hdi-sbu_leiterplatte_allgemeines\" target=\"_blank\" rel=\"noopener\">3.1.1 Circuit imprim\u00e9 HDI\/SBU<\/a>\u00a0<br \/><a style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); background-color: #ffffff;\" href=\"https:\/\/design-compass.ksg-pcb.com\/Design-Compass.htm?entry=6463b665b4398df7e0ab8ef0&amp;sharedArticle=design_loesungen_bga-design\" target=\"_blank\" rel=\"noopener\">16.2 Solutions de conception | BGA<\/a><\/p><p>une aide pr\u00e9cieuse \u00e0 la d\u00e9cision concernant la structure minimale des couches et les types de viatiques n\u00e9cessaires, ce qui se r\u00e9percute en fin de compte sur le rapport co\u00fbt-efficacit\u00e9 <strong>- <a href=\"https:\/\/www.ksg-pcb.com\/fr\/le-circuit-imprime-a-cout-optimise-materiau-et-structure-de-la-couche\/\" target=\"_blank\" rel=\"noopener\">Design to Cost<\/a><\/strong>.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d942436 e-flex e-con-boxed e-con e-parent\" data-id=\"d942436\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-f23b7f2 e-con-full e-flex e-con e-child\" data-id=\"f23b7f2\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-46f219b elementor-widget elementor-widget-text-editor\" data-id=\"46f219b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Situation L1 (Top) :<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fd97752 elementor-widget elementor-widget-image\" data-id=\"fd97752\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L1.svg\" class=\"attachment-large size-large wp-image-20006\" alt=\"Position L1 (Top) Fanout BGA Grille Conception de l&#039;agencement PCB Circuits imprim\u00e9s\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7b5288a e-con-full e-flex e-con e-child\" data-id=\"7b5288a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-815c3c6 elementor-widget elementor-widget-text-editor\" data-id=\"815c3c6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Situation L2 :<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-057cfcd elementor-widget elementor-widget-image\" data-id=\"057cfcd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L2.svg\" class=\"attachment-large size-large wp-image-20007\" alt=\"Emplacement L2 Fanout BGA Grille Conception de l&#039;agencement PCB Circuits imprim\u00e9s\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-13df1b3 e-con-full e-flex e-con e-child\" data-id=\"13df1b3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-301464b elementor-widget elementor-widget-text-editor\" data-id=\"301464b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Situation L3 :<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-76b8a6c elementor-widget elementor-widget-image\" data-id=\"76b8a6c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L3.svg\" class=\"attachment-large size-large wp-image-20008\" alt=\"Emplacement L3 Fanout BGA Grille Conception de l&#039;agencement PCB Circuits imprim\u00e9s\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-6959b80 e-con-full e-flex e-con e-child\" data-id=\"6959b80\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-385c04b elementor-widget elementor-widget-text-editor\" data-id=\"385c04b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Structure des couches :<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fe2e066 elementor-widget elementor-widget-image\" data-id=\"fe2e066\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"481\" height=\"396\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_Lagenaufbau-01.svg\" class=\"attachment-large size-large wp-image-20009\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-aec37c5 e-flex e-con-boxed e-con e-parent\" data-id=\"aec37c5\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6f489dc elementor-widget elementor-widget-heading\" data-id=\"6f489dc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Valeur ajout\u00e9e d'un fanout BGA optimis\u00e9<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e126529 e-flex e-con-boxed e-con e-parent\" data-id=\"e126529\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-a0fe63d e-con-full e-flex e-con e-child\" data-id=\"a0fe63d\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b7197aa elementor-widget elementor-widget-text-editor\" data-id=\"b7197aa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong><span style=\"text-decoration: underline;\">Haute densit\u00e9 de connexions<br \/><\/span><\/strong><\/p><p><strong>Pr\u00e9vention des erreurs<br \/><\/strong>Un design de fanout BGA soigneusement con\u00e7u r\u00e9duit le risque de d\u00e9fauts de soudure et de probl\u00e8mes m\u00e9caniques. Cela permet de r\u00e9duire le taux de d\u00e9faillance et d'augmenter la fiabilit\u00e9 du circuit imprim\u00e9, ce qui est particuli\u00e8rement important dans les applications critiques en termes de s\u00e9curit\u00e9.<\/p><p><strong>Gestion thermique<br \/><\/strong><span style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); color: var( --e-global-color-primary );\">Le placement et la conception cibl\u00e9s des vias et des pistes conductrices permettent d'\u00e9vacuer plus efficacement la chaleur. Cela permet de prolonger la dur\u00e9e de vie des composants et d'augmenter la fiabilit\u00e9 de l'ensemble du syst\u00e8me.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ca16d91 e-con-full e-flex e-con e-child\" data-id=\"ca16d91\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0c2522f elementor-widget elementor-widget-text-editor\" data-id=\"0c2522f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><b><span style=\"text-decoration: underline;\">Efficacit\u00e9 des co\u00fbts<\/span><br \/><\/b><\/p><p><b>R\u00e9duction des retouches et des arr\u00eats de travail<br \/><\/b><span style=\"font-size: 16px;\">En \u00e9vitant les erreurs de conception, les co\u00fbts li\u00e9s aux retouches et aux demandes de garantie diminuent. Il en r\u00e9sulte une diminution des co\u00fbts globaux et une plus grande satisfaction des clients gr\u00e2ce \u00e0 la r\u00e9duction des temps d'arr\u00eat.<\/span><\/p><p><strong>Utilisation efficace de la surface des PCB<\/strong><br \/>Une bonne conception du fanout permet une utilisation plus optimale de la surface du circuit imprim\u00e9, ce qui peut r\u00e9duire les co\u00fbts de fabrication en utilisant moins de mat\u00e9riaux.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f292833 e-con-full e-flex e-con e-child\" data-id=\"f292833\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e6f4810 elementor-widget elementor-widget-image\" data-id=\"e6f4810\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t<figure class=\"wp-caption\">\n\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"398\" height=\"397\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top.jpg\" class=\"attachment-large size-large wp-image-8058\" alt=\"Situation Top BGA Dissociation Situation Top de KSG Group\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top.jpg 398w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-300x300.jpg 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-150x150.jpg 150w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-45x45.jpg 45w\" sizes=\"(max-width: 398px) 100vw, 398px\" \/>\t\t\t\t\t\t\t\t\t\t\t<figcaption class=\"widget-image-caption wp-caption-text\">Couche sup\u00e9rieure dans le cas d'un d\u00e9senchev\u00eatrement BGA<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0edec46 e-con-full e-flex e-con e-child\" data-id=\"0edec46\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-50d33b6 elementor-widget elementor-widget-text-editor\" data-id=\"50d33b6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Am\u00e9lioration de la qualit\u00e9 de la production<\/strong><\/span><\/p><p><strong>Inspection et testabilit\u00e9 automatis\u00e9s<br \/><\/strong>Une conception pr\u00e9cise du fanout facilite l'inspection optique automatique (AOI) et d'autres proc\u00e9dures de test. Cela am\u00e9liore l'assurance qualit\u00e9 dans la production et garantit que seuls des produits sans d\u00e9faut sont livr\u00e9s.<\/p><p><strong>Processus d'assemblage plus simples<br \/><\/strong>L'optimisation du fanout simplifie le processus de brasage, ce qui permet d'augmenter l'efficacit\u00e9 de la production et de r\u00e9duire les co\u00fbts de production.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b1024d8 e-con-full e-flex e-con e-child\" data-id=\"b1024d8\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4f98da2 elementor-widget elementor-widget-text-editor\" data-id=\"4f98da2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Une plus grande flexibilit\u00e9 de conception<\/strong><\/span><\/p><p><strong>PCB multicouches<br \/><\/strong>Des techniques de fanout avanc\u00e9es, telles que les vias aveugles et enterr\u00e9es, permettent de cr\u00e9er des circuits imprim\u00e9s multicouches complexes. Il en r\u00e9sulte une densit\u00e9 d'int\u00e9gration plus \u00e9lev\u00e9e et des designs plus compacts qui r\u00e9pondent aux exigences des produits \u00e9lectroniques modernes peu encombrants.<\/p><p><strong>\u00c9volutivit\u00e9<\/strong><br \/>Une conception de fanout BGA bien pens\u00e9e facilite les adaptations et les mises \u00e0 niveau futures du circuit imprim\u00e9. Cela offre aux clients la flexibilit\u00e9 n\u00e9cessaire pour faire \u00e9voluer leurs produits sans devoir proc\u00e9der \u00e0 de nouveaux d\u00e9veloppements importants.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e7943f1 e-con-full e-flex e-con e-child\" data-id=\"e7943f1\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-42734d4 elementor-widget elementor-widget-text-editor\" data-id=\"42734d4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Meilleure performance<br \/><\/strong><\/span><\/p><p><strong>Int\u00e9grit\u00e9 du signal et de la puissance<\/strong><br \/>Une conception optimale du fanout r\u00e9duit les r\u00e9flexions de signaux, la diaphonie et d'autres facteurs d'interf\u00e9rence, ce qui am\u00e9liore la qualit\u00e9 du signal. Cela est essentiel pour les applications \u00e0 grande vitesse comme les appareils de communication et le mat\u00e9riel informatique. En outre, une alimentation \u00e9lectrique et une gestion de la masse bien pens\u00e9es garantissent des niveaux de tension stables et minimisent les perturbations \u00e9lectriques, ce qui permet aux composants de fonctionner plus efficacement.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5a1ee29 e-flex e-con-boxed e-con e-parent\" data-id=\"5a1ee29\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-543417e elementor-widget elementor-widget-heading\" data-id=\"543417e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Conclusion<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-1811c84 e-flex e-con-boxed e-con e-parent\" data-id=\"1811c84\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-bb04d39 elementor-widget elementor-widget-text-editor\" data-id=\"bb04d39\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>La conception du fanout BGA est une partie complexe et critique de la conception d'un PCB, qui n\u00e9cessite une planification minutieuse et une ex\u00e9cution pr\u00e9cise. En suivant les consid\u00e9rations et les \u00e9tapes mentionn\u00e9es ci-dessus, les concepteurs peuvent s'assurer que leurs circuits imprim\u00e9s fonctionnent de mani\u00e8re fiable et r\u00e9pondent aux exigences des appareils \u00e9lectroniques modernes. Avec la miniaturisation et la complexit\u00e9 croissantes des composants \u00e9lectroniques, l'importance d'un fanout BGA bien con\u00e7u ne fera qu'augmenter et la ma\u00eetrise de cette technique est essentielle pour les concepteurs de PCB.<\/p><p>Il est essentiel pour la fabrication de produits \u00e9lectroniques performants, fiables et rentables. Les clients b\u00e9n\u00e9ficient de taux de d\u00e9faillance r\u00e9duits, d'une r\u00e9serve de puissance plus importante et d'un co\u00fbt total de possession plus faible. En outre, un fanout bien con\u00e7u permet une plus grande flexibilit\u00e9 et une meilleure \u00e9volutivit\u00e9, ce qui facilite l'adaptation des produits aux exigences du march\u00e9 en constante \u00e9volution.<\/p><p>Investir dans une conception BGA-Fanout de haute qualit\u00e9 est rentable \u00e0 long terme, car cela am\u00e9liore consid\u00e9rablement la qualit\u00e9 globale du produit final et maximise ainsi la valeur ajout\u00e9e pour le client.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Ball Grid Array (BGA) ist eine popul\u00e4re Geh\u00e4usetechnologie f\u00fcr integrierte Schaltungen, die eine hohe Pinanzahl und eine kompakte Bauweise erm\u00f6glicht. Im Vergleich zu traditionellen Pin-Anschlussmethoden, bietet BGA eine bessere thermische [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":20025,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[392,302,177,235,388,390],"class_list":["post-11664","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-automotive","tag-leiterplattenentwicklung","tag-leiterplattenherstellung","tag-leiterplattenwissen","tag-medizintechnik","tag-verteidigung"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>BGA-Fanout auf Leiterplatten - So gelingt es!<\/title>\n<meta name=\"description\" content=\"Wie Ihnen das BGA-Fanout beim PCB-Design von SBU-Aufbauten trotz hoher Bauteildichte und Miniaturisierung von Komponenten gelingt.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ksg-pcb.com\/fr\/ce-qui-est-important-pour-le-fanout-bga-des-structures-sbu\/\" \/>\n<meta property=\"og:locale\" content=\"fr_FR\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"BGA-Fanout auf Leiterplatten - 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