{"id":10628,"date":"2024-02-16T15:13:29","date_gmt":"2024-02-16T14:13:29","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=10628"},"modified":"2025-06-04T08:42:16","modified_gmt":"2025-06-04T06:42:16","slug":"surfaces-de-soudure-pour-circuits-imprimes-partie-5-osp","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-5-osp\/","title":{"rendered":"Surfaces de soudure pour circuits imprim\u00e9s, partie 5 : agents de pr\u00e9servation de la soudabilit\u00e9 organique (OSP)"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"10628\" class=\"elementor elementor-10628\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-92b91d5 e-flex e-con-boxed e-con e-parent\" data-id=\"92b91d5\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-ea693c8 elementor-nav-menu__align-start elementor-nav-menu--dropdown-tablet elementor-nav-menu__text-align-aside elementor-nav-menu--toggle elementor-nav-menu--burger elementor-widget elementor-widget-nav-menu\" data-id=\"ea693c8\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;layout&quot;:&quot;vertical&quot;,&quot;submenu_icon&quot;:{&quot;value&quot;:&quot;&lt;i class=\\&quot;fas fa-caret-down\\&quot; aria-hidden=\\&quot;true\\&quot;&gt;&lt;\\\/i&gt;&quot;,&quot;library&quot;:&quot;fa-solid&quot;},&quot;toggle&quot;:&quot;burger&quot;}\" data-widget_type=\"nav-menu.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t<nav aria-label=\"Surface Contributions\" class=\"elementor-nav-menu--main elementor-nav-menu__container elementor-nav-menu--layout-vertical e--pointer-background e--animation-fade\">\n\t\t\t\t<ul id=\"menu-1-ea693c8\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26605\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaeche-leiterplatte-leiterplattenfinish-funktion-eigenschaften\/\" class=\"elementor-item\">Partie 1 : Fonction et caract\u00e9ristiques<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26604\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-chemisch-nickel-gold\/\" class=\"elementor-item\">Partie 2 : Nickel chimique or<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26603\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-3-chemisch-zinn\/\" class=\"elementor-item\">Partie 3 : \u00c9tain chimique<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26602\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-4-hal-bleifrei\/\" class=\"elementor-item\">Partie 4 : HAL sans plomb<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26601\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-5-osp\/\" class=\"elementor-item\">Partie 5 : Organic Solderability Preservative (OSP)<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t<div class=\"elementor-menu-toggle\" role=\"button\" tabindex=\"0\" aria-label=\"Permuter le menu\" aria-expanded=\"false\">\n\t\t\t<i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--open eicon-menu-bar\"><\/i><i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--close eicon-close\"><\/i>\t\t<\/div>\n\t\t\t\t\t<nav class=\"elementor-nav-menu--dropdown elementor-nav-menu__container\" aria-hidden=\"true\">\n\t\t\t\t<ul id=\"menu-2-ea693c8\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26605\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaeche-leiterplatte-leiterplattenfinish-funktion-eigenschaften\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 1 : Fonction et caract\u00e9ristiques<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26604\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-chemisch-nickel-gold\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 2 : Nickel chimique or<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26603\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-3-chemisch-zinn\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 3 : \u00c9tain chimique<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26602\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-4-hal-bleifrei\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 4 : HAL sans plomb<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26601\"><a href=\"https:\/\/www.ksg-pcb.com\/fr\/loetoberflaechen-fuer-leiterplatten-teil-5-osp\/\" class=\"elementor-item\" tabindex=\"-1\">Partie 5 : Organic Solderability Preservative (OSP)<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-f26f694 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"f26f694\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-80ecc06\" data-id=\"80ecc06\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-c4c8901 elementor-widget elementor-widget-text-editor\" data-id=\"c4c8901\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>La protection de surface organique (OSP, Organic Solderability Preservative ou encore Organic Surface Protection) repr\u00e9sente une alternative \u00e9conomique aux surfaces finales m\u00e9talliques des circuits imprim\u00e9s. Une couche organique est form\u00e9e sur les points de cuivre expos\u00e9s, ce qui les prot\u00e8ge de l'oxydation par l'oxyg\u00e8ne. Ainsi, la soudabilit\u00e9 du circuit imprim\u00e9 est maintenue pendant une p\u00e9riode d\u00e9finie, sans qu'une couche de protection m\u00e9tallique suppl\u00e9mentaire ne soit n\u00e9cessaire.<\/p><p>La dur\u00e9e de conservation des circuits imprim\u00e9s enduits avec l'OSP ENTEK Plus HT est d'au moins six mois \u00e0 une temp\u00e9rature maximale de 30 \u00b0C et une humidit\u00e9 relative maximale de 70 %. Ensuite, un nouveau rev\u00eatement peut \u00eatre appliqu\u00e9 pour renouveler la dur\u00e9e de conservation. Des alternatives permettant d'augmenter la dur\u00e9e de stockage \u00e0 plus de 12 mois sont actuellement \u00e0 l'\u00e9tude. KSG applique une \u00e9paisseur de couche OSP qui permet des charges thermiques multiples lors du traitement ult\u00e9rieur des circuits imprim\u00e9s. L'\u00e9paisseur de la couche obtenue est r\u00e9guli\u00e8rement contr\u00f4l\u00e9e par analyse spectrophotom\u00e9trique.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3b7ae5c elementor-widget elementor-widget-heading\" data-id=\"3b7ae5c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Avantages et inconv\u00e9nients de l'OSP<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-fa475fb elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"fa475fb\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-573ec16\" data-id=\"573ec16\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-3ef515f elementor-widget elementor-widget-text-editor\" data-id=\"3ef515f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Par rapport au processus d'\u00e9tamage \u00e0 l'air chaud, la protection organique de surface (OSP) se caract\u00e9rise par un d\u00e9p\u00f4t tr\u00e8s fin et homog\u00e8ne. Elle est donc id\u00e9ale pour les pastilles CMS plates et simplifie l'impression de la p\u00e2te \u00e0 braser. Gr\u00e2ce au d\u00e9p\u00f4t \u00e0 35 \u00b0C, il n'y a pas de stress thermique sur la pastille conductrice et il n'y a pas de d\u00e9formation ou de fissuration du mat\u00e9riau de base. Pour les applications \u00e0 haute fr\u00e9quence, l'OSP est une surface finale privil\u00e9gi\u00e9e, car les propri\u00e9t\u00e9s de transmission \u00e9lectrique ne sont pas alt\u00e9r\u00e9es par le d\u00e9p\u00f4t organique, compar\u00e9 \u00e0 une surface finale m\u00e9tallique comme l'or chimique au nickel. L'OSP convient pour la technique d'insertion en force et peut \u00e9galement \u00eatre combin\u00e9 avec d'autres surfaces d'extr\u00e9mit\u00e9 (par ex. nickel-or galvanique).\u00a0<\/p><p>Il faut savoir que la couche OSP est attaqu\u00e9e par les solvants, les acides et les bases. Cela a pour cons\u00e9quence qu'une retouche lors de l'impression de la p\u00e2te \u00e0 braser n'est possible que dans une certaine mesure, car le flux dans la p\u00e2te \u00e0 braser attaque la couche OSP et le cuivre peut \u00eatre expos\u00e9 apr\u00e8s le retrait de la p\u00e2te \u00e0 braser et le nettoyage du circuit imprim\u00e9. Lors de l'emballage de circuits imprim\u00e9s avec rev\u00eatement OSP, en cas de papier interm\u00e9diaire, celui-ci devrait \u00eatre exempt de soufre et de pH neutre, et le d\u00e9shydratant dans le paquet ne devrait jamais entrer en contact direct avec la couche OSP, car les d\u00e9shydratants peuvent contenir des compos\u00e9s soufr\u00e9s et endommager ainsi la couche protectrice organique.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-a782710 elementor-widget elementor-widget-heading\" data-id=\"a782710\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Recommandations sur l'aptitude \u00e0 la transformation<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-15f0f53 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"15f0f53\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-46074e8\" data-id=\"46074e8\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-6dcf14b elementor-widget elementor-widget-text-editor\" data-id=\"6dcf14b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Pour obtenir des r\u00e9sultats de brasage optimaux, les param\u00e8tres de brasage doivent \u00eatre adapt\u00e9s \u00e0 la nouvelle surface. Pour tous les circuits imprim\u00e9s ENTEK Plus HT, il faut notamment tenir compte du choix du flux et de la p\u00e2te \u00e0 braser utilis\u00e9s ainsi que des effets de la temp\u00e9rature sur la surface pour les installations de brasage sans gaz protecteur.<\/p><p>La couche OSP est endommag\u00e9e par les chlorures et les compos\u00e9s soufr\u00e9s de l'air ambiant. Cela signifie qu'apr\u00e8s l'ouverture de l'emballage de livraison, les circuits imprim\u00e9s non trait\u00e9s doivent \u00eatre r\u00e9emball\u00e9s le plus rapidement possible et stock\u00e9s dans les conditions mentionn\u00e9es. En outre, il convient de renoncer \u00e0 l'utilisation de rubans adh\u00e9sifs, d'\u00e9tiquettes adh\u00e9sives, d'encres pour tampons, de marqueurs et d'\u00e9lastiques en contact direct avec la couche OSP, car ils peuvent \u00e9galement contenir des compos\u00e9s soufr\u00e9s.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-e921369 elementor-widget elementor-widget-heading\" data-id=\"e921369\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Attention \u00e0 la temp\u00e9rature de surface<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-0344b00 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"0344b00\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-8027fe0\" data-id=\"8027fe0\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-90ba024 elementor-widget elementor-widget-text-editor\" data-id=\"90ba024\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>La couche OSP est influenc\u00e9e par la chaleur et l'oxyg\u00e8ne. Lorsque les circuits imprim\u00e9s sont expos\u00e9s \u00e0 des temp\u00e9ratures particuli\u00e8rement \u00e9lev\u00e9es, l'oxyg\u00e8ne se diffuse \u00e0 travers la couche OSP et la couche d'oxyde de cuivre \u00e0 la limite entre le cuivre du circuit imprim\u00e9 et la couche organique s'agrandit (de l'ordre de quelques nanom\u00e8tres). L'utilisation de profils de refusion \u00e0 basse temp\u00e9rature et d'azote comme gaz de protection permet de produire moins d'oxyde de cuivre que les profils de refusion \u00e0 haute temp\u00e9rature et le traitement sous atmosph\u00e8re d'air. Cet aspect doit \u00eatre pris en compte non seulement pour le placement lui-m\u00eame, mais aussi pour le recuit avant le placement. Ainsi, un recuit prolong\u00e9 \u00e0 plus de 100 \u00b0C sans gaz protecteur n'est pas possible. Le fournisseur de proc\u00e9d\u00e9s indique comme limite pour ENTEK Plus HT 125 \u00b0C pendant 3 heures. L'action de la temp\u00e9rature sur la couche OSP a un autre effet : l'OSP devient plus dure et plus compacte, ce qui est renforc\u00e9 par l'utilisation d'azote. Les aspects expliqu\u00e9s font que la couche OSP est difficile \u00e0 enlever et que le choix du flux et de la p\u00e2te \u00e0 braser utilis\u00e9s joue un r\u00f4le important.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-91726ee elementor-widget elementor-widget-heading\" data-id=\"91726ee\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Choisir le bon flux et la bonne p\u00e2te \u00e0 braser<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-df87c36 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"df87c36\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-34cb47c\" data-id=\"34cb47c\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-88e2f2a elementor-widget elementor-widget-text-editor\" data-id=\"88e2f2a\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Que se passe-t-il au niveau de la couche OSP lors du brasage ? Les composants du flux ou de la p\u00e2te \u00e0 souder, plus pr\u00e9cis\u00e9ment les solvants organiques et les acides organiques, provoquent le d\u00e9tachement de la couche OSP. D'autres composants, principalement les activateurs, \u00e9liminent en revanche la tr\u00e8s fine couche d'oxyde de cuivre qui se trouve entre la couche OSP et le cuivre des circuits imprim\u00e9s. Ensuite, la phase interm\u00e9tallique entre le cuivre et l'\u00e9tain peut se former lors du soudage, c'est-\u00e0-dire qu'un mouillage sans d\u00e9faut peut avoir lieu.<\/p><p>Il a \u00e9t\u00e9 d\u00e9montr\u00e9 que certains solvants et acides organiques enl\u00e8vent plus efficacement la couche d'ENTEK Plus HT et que la couche d'oxyde de cuivre est mieux d\u00e9clench\u00e9e par certains activateurs. En g\u00e9n\u00e9ral, les combinaisons des ingr\u00e9dients mentionn\u00e9s donnent de meilleurs r\u00e9sultats. Ceci est particuli\u00e8rement important lorsque la couche OSP a d\u00e9j\u00e0 subi des \u00e9tapes de temp\u00e9rature, par exemple en cas de brasage par refusion multiple. Des flux sp\u00e9cialement adapt\u00e9s au brasage s\u00e9lectif et au brasage \u00e0 la vague peuvent mieux nettoyer la surface de cuivre ; lors du processus de refusion, le choix de la p\u00e2te \u00e0 braser permet d'\u00e9liminer plus efficacement la couche OSP soumise \u00e0 la temp\u00e9rature.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-3736d78 elementor-widget elementor-widget-heading\" data-id=\"3736d78\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Test de qualification<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-6d86b1c elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"6d86b1c\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-b281fab\" data-id=\"b281fab\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-c3b4044 elementor-widget elementor-widget-text-editor\" data-id=\"c3b4044\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Pour v\u00e9rifier la fiabilit\u00e9, il n'est pas possible d'appliquer aux circuits imprim\u00e9s ENTEK Plus HT un vieillissement thermique tel qu'il est effectu\u00e9 sur les circuits imprim\u00e9s \u00e9tam\u00e9s pour simuler un stockage \u00e0 long terme. Un test de la surface organique qui a fait ses preuves est le test climatique (5 jours, 40 \u00b0C, 92 % d'humidit\u00e9 relative). Celui-ci montre clairement si la qualit\u00e9 du rev\u00eatement de surface appliqu\u00e9 est parfaite ou alt\u00e9r\u00e9e. Les d\u00e9fauts ou les pores sont tr\u00e8s faciles \u00e0 d\u00e9tecter apr\u00e8s le test, car les zones de cuivre non prot\u00e9g\u00e9es s'oxydent pendant le test climatique et prennent ainsi une couleur sombre. Outre le test climatique, KSG Group contr\u00f4le \u00e9galement r\u00e9guli\u00e8rement la mouillabilit\u00e9 dans le cadre du test de fiabilit\u00e9 au moyen du Solder Spread Test et du Solder Float Test.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1088b66 elementor-widget elementor-widget-heading\" data-id=\"1088b66\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\"><b>Cl\u00e9s \u00e0 emporter<\/b><\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-8bce875 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"8bce875\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-a0fce36\" data-id=\"a0fce36\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-c4580fa elementor-widget elementor-widget-text-editor\" data-id=\"c4580fa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Dans l'ensemble, l'OSP est extr\u00eamement polyvalente et offre, outre les aspects financiers et environnementaux, un certain nombre d'avantages par rapport aux surfaces finales m\u00e9talliques. Pour maximiser la durabilit\u00e9 et les performances de la surface OSP, il convient de suivre attentivement les recommandations relatives au traitement ult\u00e9rieur.  Ce n'est que r\u00e9cemment que le groupe KSG a \u00e9tendu ses capacit\u00e9s dans le domaine du traitement de surface organique et mis en service une nouvelle installation OSP.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Der organische Oberfl\u00e4chenschutz (OSP, Organic Solderability Preservative oder auch Organic Surface Protection) stellt eine kosteng\u00fcnstige Alternative zu metallischen Endoberfl\u00e4chen bei Leiterplatten dar. Auf den freiliegenden Kupferstellen wird eine organische Schicht [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":10638,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[202,177,161],"class_list":["post-10628","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-endoberflaechen","tag-leiterplattenherstellung","tag-loetoberflaechen"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>L\u00f6toberfl\u00e4chen f\u00fcr Leiterplatten: OSP \u26af pcb-log.com<\/title>\n<meta name=\"description\" content=\"OSP stellt eine kosteng\u00fcnstige Alternative zu metallischen Endoberfl\u00e4chen dar. 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