{"id":4983,"date":"2022-06-26T10:10:05","date_gmt":"2022-06-26T08:10:05","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=4983"},"modified":"2025-06-04T08:41:49","modified_gmt":"2025-06-04T06:41:49","slug":"soldering-surfaces-for-printed-circuit-boards-part-4-half-lead-free","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-4-hal-bleifrei\/","title":{"rendered":"Soldering surfaces for printed circuit boards, part 4: HAL lead-free"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"4983\" class=\"elementor elementor-4983\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-fc285c9 e-flex e-con-boxed e-con e-parent\" data-id=\"fc285c9\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-d7a4c49 e-con-full e-flex e-con e-child\" data-id=\"d7a4c49\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9834a65 elementor-nav-menu__align-start elementor-nav-menu--dropdown-tablet elementor-nav-menu__text-align-aside elementor-nav-menu--toggle elementor-nav-menu--burger elementor-widget elementor-widget-nav-menu\" data-id=\"9834a65\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;layout&quot;:&quot;vertical&quot;,&quot;submenu_icon&quot;:{&quot;value&quot;:&quot;&lt;i class=\\&quot;fas fa-caret-down\\&quot; aria-hidden=\\&quot;true\\&quot;&gt;&lt;\\\/i&gt;&quot;,&quot;library&quot;:&quot;fa-solid&quot;},&quot;toggle&quot;:&quot;burger&quot;}\" data-widget_type=\"nav-menu.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t<nav aria-label=\"Surface Contributions\" class=\"elementor-nav-menu--main elementor-nav-menu__container elementor-nav-menu--layout-vertical e--pointer-background e--animation-fade\">\n\t\t\t\t<ul id=\"menu-1-9834a65\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26605\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaeche-leiterplatte-leiterplattenfinish-funktion-eigenschaften\/\" class=\"elementor-item\">Part 1: Function and properties<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26604\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-chemisch-nickel-gold\/\" class=\"elementor-item\">Part 2: Electroless nickel-gold<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26603\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-3-chemisch-zinn\/\" class=\"elementor-item\">Part 3: Immersion tin<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26602\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-4-hal-bleifrei\/\" class=\"elementor-item\">Part 4: HAL lead-free<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26601\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-5-osp\/\" class=\"elementor-item\">Part 5: Organic Solderability Preservative (OSP)<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t<div class=\"elementor-menu-toggle\" role=\"button\" tabindex=\"0\" aria-label=\"Menu Toggle\" aria-expanded=\"false\">\n\t\t\t<i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--open eicon-menu-bar\"><\/i><i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--close eicon-close\"><\/i>\t\t<\/div>\n\t\t\t\t\t<nav class=\"elementor-nav-menu--dropdown elementor-nav-menu__container\" aria-hidden=\"true\">\n\t\t\t\t<ul id=\"menu-2-9834a65\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26605\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaeche-leiterplatte-leiterplattenfinish-funktion-eigenschaften\/\" class=\"elementor-item\" tabindex=\"-1\">Part 1: Function and properties<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26604\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-chemisch-nickel-gold\/\" class=\"elementor-item\" tabindex=\"-1\">Part 2: Electroless nickel-gold<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26603\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-3-chemisch-zinn\/\" class=\"elementor-item\" tabindex=\"-1\">Part 3: Immersion tin<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26602\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-4-hal-bleifrei\/\" class=\"elementor-item\" tabindex=\"-1\">Part 4: HAL lead-free<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-26601\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-fuer-leiterplatten-teil-5-osp\/\" class=\"elementor-item\" tabindex=\"-1\">Part 5: Organic Solderability Preservative (OSP)<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-14f2930 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"14f2930\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-c23d5d0\" data-id=\"c23d5d0\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-ef87ee4 elementor-widget elementor-widget-text-editor\" data-id=\"ef87ee4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>With the <a href=\"https:\/\/www.ksg-pcb.com\/en\/loetoberflaechen-leiterplatten\/\">Soldering surface<\/a> \"HAL (hot air leveling lead-free), hot air tinning or HASL (hot air solder leveling), a layer of liquid tin is applied to the exposed copper surfaces. The PCBs are first wetted with flux and then immersed in a vertical solder bath. When the PCBs are removed from the solder bath, excess solder is blown off with hot air. The PCBs are then cooled in a horizontal process section.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-dca665f elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"dca665f\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-ae1a4ec\" data-id=\"ae1a4ec\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-b576ad8 elementor-widget elementor-widget-heading\" data-id=\"b576ad8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">What are the advantages of \"HAL lead-free\"?<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1ed360c elementor-widget elementor-widget-text-editor\" data-id=\"1ed360c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>\"HAL lead-free\" is the RoHS-compliant (2011\/65\/EU) further development of hot air tinning with tin\/lead solder, which was already used in PCB production in the 1960s. For \"HAL lead-free\", KSG uses a bar solder made from an alloy with 99.7 % tin and 0.3 % silver with a melting point of 217 to 227 \u00b0C. The tinning temperature is specified at 270 \u00b0C in accordance with UL. From a soldering point of view, hot air tinning offers the best solderability of all surfaces. Tin and copper on the connection surfaces form an intermetallic bonding zone (IMC). With proper <a href=\"https:\/\/www.ksg-pcb.com\/en\/storing-printed-circuit-boards-correctly-the-most-important-tips\/\">Storage<\/a> the PCB manufacturer provides a 12-month warranty on solderability.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-881f8a4\" data-id=\"881f8a4\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-874be07 elementor-view-default elementor-widget elementor-widget-icon\" data-id=\"874be07\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"icon.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-icon-wrapper\">\n\t\t\t<div class=\"elementor-icon\">\n\t\t\t<i aria-hidden=\"true\" class=\"fas fa-info-circle\"><\/i>\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-29fe7e3 elementor-widget elementor-widget-heading\" data-id=\"29fe7e3\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Brief info \"HAL lead-free\"<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-50322d8 elementor-widget elementor-widget-text-editor\" data-id=\"50322d8\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Alloy: 99.7 % tin | 0.3 % silver<br \/>Melting point: 217-227 \u00b0C<br \/>Tinning temperature according to UL: 270 \u00b0C<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-b1cd188 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"b1cd188\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-7745eb2\" data-id=\"7745eb2\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-74611ff elementor-widget elementor-widget-heading\" data-id=\"74611ff\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Irregular thickness of the tin layer due to the process<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-1e0385e elementor-widget elementor-widget-text-editor\" data-id=\"1e0385e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Hot-air tinned solder connections are characterized by relatively large fluctuations in the layer thickness or no planarity of the surface. This is due to the physically induced solder meniscus formation (see image) caused by the excess solder being blown off. This surface is therefore not suitable for fine-pitch SMT components.<\/p><p>The wetting of solder pads is evaluated according to J-STD-003. The thickness of the tin layer is defined from \"covered\" with approx. 1 \u00b5m at the hole entrance for THT connections to \u2264 40 \u00b5m in the center of the pad. The layer thicknesses can be determined destructively by grinding. In the \"HAL lead-free\" process, the base material of the PCB is subject to high thermal stress due to the large relative temperature increase (from room temperature to 270 \u00b0C) of lead-free solder. HAL lead-free is therefore not recommended for standard Tg-FR4 base materials.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-61a4615 elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"61a4615\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-9e39869\" data-id=\"9e39869\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a490859 elementor-widget elementor-widget-heading\" data-id=\"a490859\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h2 class=\"elementor-heading-title elementor-size-default\">Further advantages of \"HAL lead-free\"<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-51a50bd elementor-widget__width-initial elementor-widget elementor-widget-text-editor\" data-id=\"51a50bd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>HAL lead-free can be combined with electroplated nickel\/gold for plug contacts. Hot air tinning is suitable for press-fit technology. The surface is unsuitable for any wire bonding processes. Compared to the\u00a0<span style=\"font-style: inherit; font-weight: inherit; color: var( --e-global-color-primary ); font-family: Arial, sans-serif; font-size: 11.5pt;\">insensitive ENIG and the sensitive chemical tin, HAL lead-free settles in the middle. In concrete terms, this means that the surface is quite insensitive to thermal processes that follow the application of the soldering surface, e.g. the curing of lacquers or drying processes of the PCB before component assembly.\u00a0<\/span><span style=\"font-style: inherit; font-weight: inherit; color: var( --e-global-color-primary );\">In a direct comparison of process costs, lead-free hot air tinning is cheaper than soldering surfaces <\/span><a style=\"font-style: inherit; font-weight: inherit; font-family: Roboto, sans-serif; background-color: #ffffff;\" href=\"https:\/\/www.ksg-pcb.com\/en\/soldering-surfaces-electroless-nickel-gold\/\">electroless nickel\/gold<\/a><span style=\"font-style: inherit; font-weight: inherit; color: var( --e-global-color-primary );\"> and chemical tin. Hot air tinning has a share of around 20 % of all soldering surfaces used in Europe; this share is trending downwards.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t<div class=\"elementor-column elementor-col-50 elementor-top-column elementor-element elementor-element-64b034b\" data-id=\"64b034b\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-40ae28d elementor-widget elementor-widget-video\" data-id=\"40ae28d\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;youtube_url&quot;:&quot;https:\\\/\\\/youtu.be\\\/9IjKzUqWAow&quot;,&quot;video_type&quot;:&quot;youtube&quot;,&quot;controls&quot;:&quot;yes&quot;}\" data-widget_type=\"video.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t<div class=\"elementor-wrapper elementor-open-inline\">\n\t\t\t<div class=\"elementor-video\"><\/div>\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<section class=\"elementor-section elementor-top-section elementor-element elementor-element-df9fadf elementor-section-boxed elementor-section-height-default elementor-section-height-default\" data-id=\"df9fadf\" data-element_type=\"section\" data-e-type=\"section\">\n\t\t\t\t\t\t<div class=\"elementor-container elementor-column-gap-default\">\n\t\t\t\t\t<div class=\"elementor-column elementor-col-100 elementor-top-column elementor-element elementor-element-74b0cef\" data-id=\"74b0cef\" data-element_type=\"column\" data-e-type=\"column\">\n\t\t\t<div class=\"elementor-widget-wrap elementor-element-populated\">\n\t\t\t\t\t\t<div class=\"elementor-element elementor-element-a23ac39 elementor-widget elementor-widget-text-editor\" data-id=\"a23ac39\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>Would you like to find out more about the processes, properties, advantages and disadvantages of the individual soldering surfaces? Then take a look at our XPERTS online seminar. Annett Horbach and Matthias Stickel will give you lots of practical tips on choosing the right end surfaces for you.&nbsp;<a href=\"https:\/\/attendee.gotowebinar.com\/register\/4116992683359499?source=Blog\" target=\"_blank\" style=\"font-family: Roboto, sans-serif; background-color: rgb(255, 255, 255); font-weight: normal;\">Register directly!<\/a><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>The HAL lead-free soldering surface offers the best solderability of all surfaces, although the thickness of the tin layer varies.<\/p>","protected":false},"author":26,"featured_media":5237,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[202,161],"class_list":["post-4983","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-endoberflaechen","tag-loetoberflaechen"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>L\u00f6toberfl\u00e4chen f\u00fcr Leiterplatten: HAL bleifrei \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"HAL Bleifrei bietet die beste L\u00f6tbarkeit aller Oberfl\u00e4chen, allerdings schwankt die Dicke der Zinnschicht. 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