{"id":4675,"date":"2021-08-18T12:00:08","date_gmt":"2021-08-18T10:00:08","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=4675"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"tips-for-printed-circuit-board-design-with-copper-elements-hsmtec-part-2","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/en\/tipps-fuer-das-leiterplattendesign-mit-kupferelementen-hsmtec-teil-2\/","title":{"rendered":"Tips for PCB design with copper elements (HSMtec) - Part 2"},"content":{"rendered":"

Design rules for high-current conductor tracks<\/strong><\/p>\n

These rules apply to the design of HSMtec printed circuit boards<\/a> to note:<\/p>\n

Standard values for HSMtec PCBs are 0.8 to 3.2 mm final thickness; maximum 12 layers; maximum 3 layers for copper cross-sections with copper profiles and currents up to 400 A<\/p>\n

Basic rule for current carrying capacity: For each copper profile of its width, the conductor track must be 1 mm wider all round. Example: An 8 mm copper profile requires a 10 mm wide conductor track.<\/p>\n

The copper profiles must not be placed on adjacent layers.<\/p>\n

A potential-independent copper support of at least the same size must be provided on the opposite FR4 core side of the copper element. This copper layout is potential-independent and serves as a clear support for the copper profile for ultrasonic welding.<\/p>\n

For economic reasons, the high-current conductor tracks should be routed directly and in a straight line (with as few changes in direction of the high-current connections as possible). Branches in the copper profiles can be realized via etched surfaces.<\/p>\n

Copper profiles are available in four widths: 2, 4, 8 and 12 mm with a variable length, but this should not be less than 15 mm.<\/p>\n

The distance between the profiles should be at least 2.20 mm.<\/p>\n

Changing layers of copper profiles from inner layers to outer layers (and back again) is no problem with through-hole plating.<\/p>\n

The high-current PCBs are suitable for all common connection contacts: screw, pressure contact, press-fit or soldering.<\/p>\n

Microvias and thermovias can be used to thermally connect the copper profiles to a heat sink. Conductor widths, residual rings and aspect ratios must be observed so that a sufficient amount of copper is deposited. A minimum copper thickness of 20 \u00b5m must be achieved in the hole.<\/p>\n

As the power components become hotter than the high-current conductor, a thermally optimized design is required.<\/p>","protected":false},"excerpt":{"rendered":"

Designregeln f\u00fcr Hochstromleiterbahnen Diese Regeln sind beim Design von HSMtec-Leiterplatten zu beachten: Standardwerte f\u00fcr HSMtec-Leiterplatten sind 0,8 bis 3,2 mm Enddicke; maximal 12 Lagen; maximal 3 Lagen f\u00fcr die Kupferquerschnitte […]<\/p>\n","protected":false},"author":26,"featured_media":4452,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[302,371],"class_list":["post-4675","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenentwicklung","tag-strombelastbarkeit"],"yoast_head":"\nTipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2 \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - Teil 2\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ksg-pcb.com\/en\/tips-for-printed-circuit-board-design-with-copper-elements-hsmtec-part-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tipps f\u00fcr das Leiterplattendesign mit Kupferelementen (HSMtec) - 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