{"id":2503,"date":"2021-05-19T12:00:00","date_gmt":"2021-05-19T10:00:00","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=2503"},"modified":"2025-02-18T08:35:28","modified_gmt":"2025-02-18T07:35:28","slug":"3d-printed-circuit-boards-three-technologies-three-examples-part-1","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/en\/3d-gedruckte-leiterplatten-drei-technologien-drei-beispiele-teil-1\/","title":{"rendered":"3D printed circuit boards: three technologies, three examples (Part 1)"},"content":{"rendered":" \n

Three-dimensional PCBs make optimum use of the limited installation space and can be constructed using various processes, assembly variants and materials. With rigid-flex, semiflex and HSMtec 3D, we present three manufacturing processes and highlight their technical properties, possible applications as well as their advantages and limitations.<\/strong><\/p> \n

Increasing packing density, reducing weight and at the same time increasing the reliability of assemblies - three-dimensional PCBs are being used in more and more products. The ability to directly connect parts of a circuit on different PCBs or PCB segments replaces connectors and cables. In addition, 3D printed circuit boards open up new design possibilities and help to reduce system costs.<\/p> \n

Characteristically, the PCBs are designed as two-dimensional boards, manufactured in the panel and assembled. Only after assembly is the PCB bent into its three-dimensional shape. A distinction is made between one-off bending for assembly, a few bends, e.g. during use, or continuous bending, e.g. for high bending cycles during use.<\/p> \n

Rigid-flex PCB: versatile geometries and layouts<\/strong><\/p> \n

Rigid-flex PCBs are the preferred and optimal solution when several rigid PCBs are to be electrically connected in different installation positions and orientations. The parts of the circuit are distributed over several rigid circuit carriers and connected to each other via a flexible polyimide PCB foil. The flexible film is integrated into the layer structure of the connected circuit boards. The flexible and rigid parts are electrically connected. At the bending points, the FR4 material is milled down to the flex foil. The thin polyimide guarantees maximum three-dimensional adaptability to limited space conditions. The space required for the PCB can be \"folded away\", so to speak.<\/p> \n

Rigid-Flex technology is very versatile in terms of arrangement options and geometries. Further advantages: The elimination of many solder joints, cables, wires, jumpers and connectors not only minimizes space and weight, but also eliminates potential sources of error and reduces overall costs. However, bending radii and bending cycles must be taken into account with the thin materials of the flexible PCB part.<\/p> \n \n

\n
\"Rigid-flex
Rigid-flex multilayer: The electronics for the Power-Check tool clamp are housed on a 4-layer rigid-flex multilayer that connects four rigid parts with one flex part.<\/figcaption><\/figure> \n<\/figure>

One example: The compact housing of the Power-Check tool clamp from Ott-Jakob in Allg\u00e4u fits into the tool magazines of all machine manufacturers. The tool clamp checks the force with which the tool is pulled into the spindle cone of the machine tool. If the force falls below a certain threshold, there is a risk of increased tool wear or vibrations that leave unclean machining marks on a workpiece. The Power-Check checks not only the force: when setting up a new motor spindle, different tolerances for tools of different lengths can be simulated. In addition, digital switching outputs can be programmed for clear signal messages about whether a tool is well or poorly clamped.<\/p> \n

The sophisticated design is realized in a four-layer rigid-flex multilayer - just 122.89 mm long and 70.15 mm wide - with an electroless nickel-gold surface, which connects four rigid parts with, among others, a flex part that lifts off. On it are, among other things, a microcontroller, a measuring device amplifier, several magnetic switches, LEDs for the display, a complete front end for radio transmission and a lithium cell as energy storage.<\/p> ","protected":false},"excerpt":{"rendered":"

Dreidimensionale Leiterplatten nutzen den begrenzten Bauraum optimal aus und k\u00f6nnen mit verschiedenen Verfahren, Best\u00fcckungsvarianten und Materialien aufgebaut werden. Mit Starrflex, Semiflex und HSMtec 3D stellen wir drei Fertigungsverfahren vor […]<\/p>\n","protected":false},"author":26,"featured_media":2277,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[235],"class_list":["post-2503","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-leiterplattenwissen"],"yoast_head":"\n3D-Leiterplatten: drei Technologien, drei Beispiele (Teil 1) \u26af pcb-blog.com<\/title>\n<meta name=\"description\" content=\"3D-Leiterplatten er\u00f6ffnen neue konstruktive M\u00f6glichkeiten und helfen, Systemkosten zu reduzieren: starrflex, semiflec, HSMtec 3D im Vergleich\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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