{"id":11664,"date":"2024-10-10T08:20:14","date_gmt":"2024-10-10T06:20:14","guid":{"rendered":"https:\/\/ksg-pcb.com\/?p=11664"},"modified":"2026-03-12T07:15:12","modified_gmt":"2026-03-12T06:15:12","slug":"what-is-important-for-the-bga-fanout-of-sbu-superstructures","status":"publish","type":"post","link":"https:\/\/www.ksg-pcb.com\/en\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/","title":{"rendered":"What is important for the BGA fanout of SBU structures"},"content":{"rendered":"<div data-elementor-type=\"wp-post\" data-elementor-id=\"11664\" class=\"elementor elementor-11664\" data-elementor-post-type=\"post\">\n\t\t\t\t<div class=\"elementor-element elementor-element-5737375f e-flex e-con-boxed e-con e-parent\" data-id=\"5737375f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-1ac97d3f e-con-full e-flex e-con e-child\" data-id=\"1ac97d3f\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9f1e996 elementor-nav-menu__align-start elementor-nav-menu--dropdown-tablet elementor-nav-menu__text-align-aside elementor-nav-menu--toggle elementor-nav-menu--burger elementor-widget elementor-widget-nav-menu\" data-id=\"9f1e996\" data-element_type=\"widget\" data-e-type=\"widget\" data-settings=\"{&quot;layout&quot;:&quot;vertical&quot;,&quot;submenu_icon&quot;:{&quot;value&quot;:&quot;&lt;i class=\\&quot;fas fa-caret-down\\&quot; aria-hidden=\\&quot;true\\&quot;&gt;&lt;\\\/i&gt;&quot;,&quot;library&quot;:&quot;fa-solid&quot;},&quot;toggle&quot;:&quot;burger&quot;}\" data-widget_type=\"nav-menu.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t<nav aria-label=\"BGA Fanout\" class=\"elementor-nav-menu--main elementor-nav-menu__container elementor-nav-menu--layout-vertical e--pointer-background e--animation-fade\">\n\t\t\t\t<ul id=\"menu-1-9f1e996\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30504\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/\" class=\"elementor-item\">Part I: What is important for the BGA fan-out of SBU superstructures<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30830\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/bga-fanout-im-sbu-aufbau-weitergedacht\/\" class=\"elementor-item\">Part 2: BGA fanout in the SBU structure<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t<div class=\"elementor-menu-toggle\" role=\"button\" tabindex=\"0\" aria-label=\"Menu Toggle\" aria-expanded=\"false\">\n\t\t\t<i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--open eicon-menu-bar\"><\/i><i aria-hidden=\"true\" role=\"presentation\" class=\"elementor-menu-toggle__icon--close eicon-close\"><\/i>\t\t<\/div>\n\t\t\t\t\t<nav class=\"elementor-nav-menu--dropdown elementor-nav-menu__container\" aria-hidden=\"true\">\n\t\t\t\t<ul id=\"menu-2-9f1e996\" class=\"elementor-nav-menu sm-vertical\"><li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30504\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/worauf-es-beim-bga-fanout-von-sbu-aufbauten-ankommt\/\" class=\"elementor-item\" tabindex=\"-1\">Part I: What is important for the BGA fan-out of SBU superstructures<\/a><\/li>\n<li class=\"menu-item menu-item-type-post_type menu-item-object-post menu-item-30830\"><a href=\"https:\/\/www.ksg-pcb.com\/en\/bga-fanout-im-sbu-aufbau-weitergedacht\/\" class=\"elementor-item\" tabindex=\"-1\">Part 2: BGA fanout in the SBU structure<\/a><\/li>\n<\/ul>\t\t\t<\/nav>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-a9c6936 e-flex e-con-boxed e-con e-parent\" data-id=\"a9c6936\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-04cf48b elementor-widget elementor-widget-text-editor\" data-id=\"04cf48b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and compact design. Compared to traditional pin connection methods, BGA offers better thermal and electrical performance. A critical aspect of using BGA is the fanout design, which describes the connection of the pins of the BGA chip to the traces of the printed circuit board (PCB).<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-22b2ad2 e-flex e-con-boxed e-con e-parent\" data-id=\"22b2ad2\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7b3d44b elementor-widget elementor-widget-heading\" data-id=\"7b3d44b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">What is BGA fanout?<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-9179da3 e-flex e-con-boxed e-con e-parent\" data-id=\"9179da3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-9d5273f elementor-widget elementor-widget-text-editor\" data-id=\"9d5273f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>The term <strong>Fanout<\/strong> refers to the method of routing the electrical connections from the ball terminals of a BGA chip to the traces on the PCB. Since the BGA pins are placed under the chip, the design requires special methods and approaches to make these connections effective and reliable.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-fd5070e e-flex e-con-boxed e-con e-parent\" data-id=\"fd5070e\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-acfd6d4 elementor-widget elementor-widget-heading\" data-id=\"acfd6d4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Important considerations for the BGA fanout design<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-196d181 e-flex e-con-boxed e-con e-parent\" data-id=\"196d181\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-c113d39 e-con-full e-flex e-con e-child\" data-id=\"c113d39\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-870ae71 elementor-widget elementor-widget-text-editor\" data-id=\"870ae71\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Pad design and spacing<\/strong>:<br \/><span style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); color: var( --e-global-color-primary );\">The pads that are connected to the balls of the BGA must be precisely positioned. The distance between the pads must be sufficient to avoid short circuits and ensure a reliable solder connection.<\/span><\/p><p><strong>Via types and placement<\/strong>:<br \/><strong>Plated-through vias<\/strong> (through-hole vias): These vias penetrate the entire PCB and connect all layers with each other. They are easy to manufacture, but can take up more space.<br \/><strong>Blind vias<\/strong> (blind vias): These vias only connect the outer layer to one or more inner layers without penetrating the entire PCB. They save space and are often used in HDI (High-Density Interconnect) PCBs.<br \/><strong>Buried vias<\/strong> (buried vias): These vias are located entirely within the inner layers of the PCB and are not visible from the outer layers.<\/p><p><b>Conductor routing:<br \/><\/b>The conductor tracks must be routed in such a way that they do not cross each other and have sufficient distance between them to avoid short circuits. <span style=\"font-size: 16px;\">Tighter routing techniques, such as microvias and thinner traces, are often necessary for BGAs with high pin density.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-c70ed03 e-con-full e-flex e-con e-child\" data-id=\"c70ed03\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t<div class=\"elementor-element elementor-element-35ccdc3 e-con-full e-flex e-con e-child\" data-id=\"35ccdc3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3abd082 elementor-widget elementor-widget-text-editor\" data-id=\"3abd082\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"font-weight: bold;\">Signal and power integrity<\/span>:<br \/>Minimizing signal reflections and crosstalk is critical, especially with high-speed signals. Supply paths must be designed in such a way that they can deliver sufficient current without causing excessive voltage drop or noise.<\/p><p><span style=\"font-weight: bold;\">Thermal management<\/span>:<br \/>The fanout design can also influence thermal management. Good layouts take heat dissipation into account to prevent components from overheating.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-899194b elementor-widget elementor-widget-image\" data-id=\"899194b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img fetchpriority=\"high\" decoding=\"async\" width=\"800\" height=\"450\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1024x576.jpg\" class=\"attachment-large size-large wp-image-2329\" alt=\"HDI-SBU-Multilayer\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1024x576.jpg 1024w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-300x169.jpg 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-768x432.jpg 768w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2-1536x864.jpg 1536w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2021\/03\/Multilayer-HDI-SBU-26-Lagen-2.jpg 1920w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-3029c82 e-flex e-con-boxed e-con e-parent\" data-id=\"3029c82\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-3b5197f elementor-widget elementor-widget-heading\" data-id=\"3b5197f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Steps to create an optimized design<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5994379 e-flex e-con-boxed e-con e-parent\" data-id=\"5994379\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-12ef3bd e-con-full e-flex e-con e-child\" data-id=\"12ef3bd\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-7443f80 elementor-widget elementor-widget-image\" data-id=\"7443f80\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t<figure class=\"wp-caption\">\n\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"800\" height=\"534\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1024x683.png\" class=\"attachment-large size-large wp-image-10215\" alt=\"KSG Digital Design Compass live Seminar Thumbnail PCB Layout\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1024x683.png 1024w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-300x200.png 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-768x512.png 768w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-1536x1025.png 1536w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/02\/2023_11_17_KSG-Mockup-DDC-2048x1366.png 2048w\" sizes=\"(max-width: 800px) 100vw, 800px\" \/>\t\t\t\t\t\t\t\t\t\t\t<figcaption class=\"widget-image-caption wp-caption-text\">The Digital Design Compass - The smart platform for fast and reliable PCB development.<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5b58e22 e-con-full e-flex e-con e-child\" data-id=\"5b58e22\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-47f3914 elementor-widget elementor-widget-text-editor\" data-id=\"47f3914\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<ol><li>Select design software<\/li><li>Study component data sheet<\/li><li>Design pad and via layout<\/li><li>Routing conductor paths<\/li><li>Apply design rules<\/li><li>Simulation and verification<\/li><li>Prototype production and testing<\/li><\/ol><p>For point \"3. Design pad and via layout\", our <a href=\"https:\/\/design-compass.ksg-pcb.com\/Login.htm\" target=\"_blank\" rel=\"noopener\">Digital Design Compass <\/a>with the articles<\/p><p><a href=\"https:\/\/design-compass.ksg-pcb.com\/Design-Compass.htm?entry=6463b665b4398df7e0ab8ef0&amp;sharedArticle=hdi-sbu_leiterplatte_allgemeines\" target=\"_blank\" rel=\"noopener\">3.1.1 HDI\/SBU circuit board<\/a>\u00a0<br \/><a style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); background-color: #ffffff;\" href=\"https:\/\/design-compass.ksg-pcb.com\/Design-Compass.htm?entry=6463b665b4398df7e0ab8ef0&amp;sharedArticle=design_loesungen_bga-design\" target=\"_blank\" rel=\"noopener\">16.2 Design solutions | BGA<\/a><\/p><p>Valuable decision-making aids for the minimum necessary layer structure and the minimum necessary viatypes, which ultimately has an impact on cost efficiency <strong>- <a href=\"https:\/\/www.ksg-pcb.com\/en\/the-cost-optimized-printed-circuit-board-material-and-layer-structure\/\" target=\"_blank\" rel=\"noopener\">Design to Cost<\/a><\/strong>.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-d942436 e-flex e-con-boxed e-con e-parent\" data-id=\"d942436\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-f23b7f2 e-con-full e-flex e-con e-child\" data-id=\"f23b7f2\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-46f219b elementor-widget elementor-widget-text-editor\" data-id=\"46f219b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Location L1 (Top):<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fd97752 elementor-widget elementor-widget-image\" data-id=\"fd97752\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L1.svg\" class=\"attachment-large size-large wp-image-20006\" alt=\"Layer L1 (Top) BGA fanout grid Layout design PCB circuit boards\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-7b5288a e-con-full e-flex e-con e-child\" data-id=\"7b5288a\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-815c3c6 elementor-widget elementor-widget-text-editor\" data-id=\"815c3c6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Position L2:<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-057cfcd elementor-widget elementor-widget-image\" data-id=\"057cfcd\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L2.svg\" class=\"attachment-large size-large wp-image-20007\" alt=\"Layer L2 BGA fanout grid layout design PCB circuit boards\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-13df1b3 e-con-full e-flex e-con e-child\" data-id=\"13df1b3\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-301464b elementor-widget elementor-widget-text-editor\" data-id=\"301464b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Position L3:<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-76b8a6c elementor-widget elementor-widget-image\" data-id=\"76b8a6c\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"243\" height=\"243\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_L3.svg\" class=\"attachment-large size-large wp-image-20008\" alt=\"Layer L3 BGA fanout grid layout design PCB circuit boards\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-6959b80 e-con-full e-flex e-con e-child\" data-id=\"6959b80\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-385c04b elementor-widget elementor-widget-text-editor\" data-id=\"385c04b\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong>Layer structure:<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<div class=\"elementor-element elementor-element-fe2e066 elementor-widget elementor-widget-image\" data-id=\"fe2e066\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"481\" height=\"396\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2024\/09\/BGA-05mm-Raster-144-Pads_Lagenaufbau-01.svg\" class=\"attachment-large size-large wp-image-20009\" alt=\"\" \/>\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-aec37c5 e-flex e-con-boxed e-con e-parent\" data-id=\"aec37c5\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-6f489dc elementor-widget elementor-widget-heading\" data-id=\"6f489dc\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Added value of an optimized BGA fanout<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e126529 e-flex e-con-boxed e-con e-parent\" data-id=\"e126529\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t<div class=\"elementor-element elementor-element-a0fe63d e-con-full e-flex e-con e-child\" data-id=\"a0fe63d\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-b7197aa elementor-widget elementor-widget-text-editor\" data-id=\"b7197aa\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><strong><span style=\"text-decoration: underline;\">High connection density<br \/><\/span><\/strong><\/p><p><strong>Error avoidance<br \/><\/strong>A carefully designed BGA fan-out design reduces the risk of soldering errors and mechanical problems. This reduces the failure rate and increases the reliability of the PCB, which is particularly important in safety-critical applications.<\/p><p><strong>Thermal management<br \/><\/strong><span style=\"font-style: inherit; font-weight: inherit; text-align: var(--text-align); color: var( --e-global-color-primary );\">Heat can be dissipated more efficiently through the targeted placement and design of vias and conductor paths. This extends the service life of the components and increases the reliability of the entire system.<\/span><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-ca16d91 e-con-full e-flex e-con e-child\" data-id=\"ca16d91\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-0c2522f elementor-widget elementor-widget-text-editor\" data-id=\"0c2522f\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><b><span style=\"text-decoration: underline;\">Cost efficiency<\/span><br \/><\/b><\/p><p><b>Reduced rework and downtime<br \/><\/b><span style=\"font-size: 16px;\">Avoiding design errors reduces the cost of rework and warranty claims. This leads to lower overall costs and higher customer satisfaction due to less downtime.<\/span><\/p><p><strong>Efficient use of the PCB area<\/strong><br \/>A good fanout design allows for a more optimal use of PCB space, which can reduce manufacturing costs as less material is required.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-f292833 e-con-full e-flex e-con e-child\" data-id=\"f292833\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-e6f4810 elementor-widget elementor-widget-image\" data-id=\"e6f4810\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"image.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t\t\t\t<figure class=\"wp-caption\">\n\t\t\t\t\t\t\t\t\t\t<img loading=\"lazy\" decoding=\"async\" width=\"398\" height=\"397\" src=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top.jpg\" class=\"attachment-large size-large wp-image-8058\" alt=\"Location Top BGA Unbundling Location Top of the KSG Group\" srcset=\"https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top.jpg 398w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-300x300.jpg 300w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-150x150.jpg 150w, https:\/\/www.ksg-pcb.com\/wp-content\/uploads\/2023\/03\/Lage_Top-45x45.jpg 45w\" sizes=\"(max-width: 398px) 100vw, 398px\" \/>\t\t\t\t\t\t\t\t\t\t\t<figcaption class=\"widget-image-caption wp-caption-text\">Top layer for BGA unbundling<\/figcaption>\n\t\t\t\t\t\t\t\t\t\t<\/figure>\n\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-0edec46 e-con-full e-flex e-con e-child\" data-id=\"0edec46\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-50d33b6 elementor-widget elementor-widget-text-editor\" data-id=\"50d33b6\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Improved production quality<\/strong><\/span><\/p><p><strong>Automated inspection and testability<br \/><\/strong>A precise fan-out design simplifies automatic optical inspection (AOI) and other test procedures. This improves quality assurance in production and ensures that only flawless products are delivered.<\/p><p><strong>Simpler assembly processes<br \/><\/strong>By optimizing the fan-out, the soldering process is simplified, resulting in higher production efficiency and lower production costs.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-b1024d8 e-con-full e-flex e-con e-child\" data-id=\"b1024d8\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-4f98da2 elementor-widget elementor-widget-text-editor\" data-id=\"4f98da2\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Greater design flexibility<\/strong><\/span><\/p><p><strong>Multilayer PCBs<br \/><\/strong>Advanced fan-out techniques such as blind and buried vias enable the creation of complex multilayer PCBs. This leads to higher integration density and more compact designs that meet the requirements of modern, space-saving electronic products.<\/p><p><strong>Scalability<\/strong><br \/>A well thought-out BGA fanout design facilitates future adaptations and upgrades of the PCB. This gives customers the flexibility to further develop their products without having to undertake extensive new developments.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-e7943f1 e-con-full e-flex e-con e-child\" data-id=\"e7943f1\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t<div class=\"elementor-element elementor-element-42734d4 elementor-widget elementor-widget-text-editor\" data-id=\"42734d4\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p><span style=\"text-decoration: underline;\"><strong>Higher performance<br \/><\/strong><\/span><\/p><p><strong>Signal and power integrity<\/strong><br \/>An optimized fanout design reduces signal reflections, crosstalk and other interference factors, which improves signal quality. This is crucial for high-speed applications such as communication devices and computer hardware. In addition, a well-designed power supply and ground routing ensures stable voltage levels and minimizes electrical interference, allowing components to operate more efficiently.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-5a1ee29 e-flex e-con-boxed e-con e-parent\" data-id=\"5a1ee29\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-543417e elementor-widget elementor-widget-heading\" data-id=\"543417e\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"heading.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t<h3 class=\"elementor-heading-title elementor-size-default\">Conclusion<\/h3>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t<div class=\"elementor-element elementor-element-1811c84 e-flex e-con-boxed e-con e-parent\" data-id=\"1811c84\" data-element_type=\"container\" data-e-type=\"container\">\n\t\t\t\t\t<div class=\"e-con-inner\">\n\t\t\t\t<div class=\"elementor-element elementor-element-bb04d39 elementor-widget elementor-widget-text-editor\" data-id=\"bb04d39\" data-element_type=\"widget\" data-e-type=\"widget\" data-widget_type=\"text-editor.default\">\n\t\t\t\t<div class=\"elementor-widget-container\">\n\t\t\t\t\t\t\t\t\t<p>BGA fanout design is a complex and critical part of PCB design that requires careful planning and precise execution. By following the above considerations and steps, designers can ensure that their PCBs function reliably and meet the requirements of modern electronic devices. As the miniaturization and complexity of electronic components continues, the importance of a well-designed BGA fanout will continue to grow, and mastering this technique is essential for PCB designers.<\/p><p>It is crucial for the manufacture of high-performance, reliable and cost-efficient electronic products. Customers benefit from lower failure rates, higher power reserve and lower total cost of ownership. In addition, a well-designed fanout allows for greater flexibility and scalability, making it easier to adapt products to ever-evolving market requirements.<\/p><p>Investing in a high-quality BGA fanout design pays off in the long term by significantly improving the overall quality of the end product and thus maximizing added value for the customer.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"<p>Ball Grid Array (BGA) ist eine popul\u00e4re Geh\u00e4usetechnologie f\u00fcr integrierte Schaltungen, die eine hohe Pinanzahl und eine kompakte Bauweise erm\u00f6glicht. Im Vergleich zu traditionellen Pin-Anschlussmethoden, bietet BGA eine bessere thermische [&hellip;]<\/p>\n","protected":false},"author":26,"featured_media":20025,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[221],"tags":[392,302,177,235,388,390],"class_list":["post-11664","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","tag-automotive","tag-leiterplattenentwicklung","tag-leiterplattenherstellung","tag-leiterplattenwissen","tag-medizintechnik","tag-verteidigung"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>BGA-Fanout auf Leiterplatten - So gelingt es!<\/title>\n<meta name=\"description\" content=\"Wie Ihnen das BGA-Fanout beim PCB-Design von SBU-Aufbauten trotz hoher Bauteildichte und Miniaturisierung von Komponenten gelingt.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ksg-pcb.com\/en\/what-is-important-for-the-bga-fanout-of-sbu-superstructures\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"BGA-Fanout auf Leiterplatten - 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