Multilayer PCBs

Overview of multilayer technology

The miniaturisation of electronic devices requires the implementation of more and more functionalities in less and less space. At the same time, the density of components on a circuit board is also increasing. Multilayer circuit boards with four or more copper layers are therefore used in almost all areas of electronics.

Rewiring is possible on up to 30 layers, which are generally connected with plated through holes. Thicknesses of up to 3.20 mm are possible in PCB production.

Your advantages

  • Circuit boards with up to 30 layers of copper 
  • Existing material variety provides countless combination possibilities 
  • Extremely thin material components starting from 0.05 mm thickness of inner layer for electrical functions in multilayer assemblies 
  • From circuit board sample to large-scale production from a single source
  • Printed circuit board samples produced in series quality

When two layers just aren't enough anymore

Virtually freely selectable layer stack-ups

Impedance controlled layouts

Multilayer PCBs

The main challenge with multilayer PCBs is to ensure the optimal handling of the very thin layers of material. Continuously automated production processes ensure consistent quality even with high-layer multilayers.

Accurately designed registration processes guarantee maximum uniformity of all layers - even with the finest structures. The layer stack-up can be individually designed for many electrical requirements (EMC, impedance, etc.) using insulation thicknesses starting at 50 μm for cores and prepregs.

The resin filling and insulation thicknesses for the layer stack-ups are calculated by means of intelligent software. Cost and quality optimisation can also be achieved.

Number of layers 4 to 30
PCB thickness 0.50 to 3.20mm
Materials FR4, hybrid of different FR4 possible
Glass transition temperature Base material 135°C; 150°C; 170/180°C
Aspect Ratio Plated through holes ≤ 1:10

The values specified represent the maximum performance spectrum and may be restricted in certain combinations.

Solder resist masks 

  • Photosensitive coating systems, thermal final curing
  • Colours: green, red, blue, glossy black, matt black, white, yellow
  • Non-photosensitive coating systems, purely thermosetting: white, black

Surfaces 

  • Chemical nickel/gold
  • Chemical tin
  • Electroplated nickel/gold
  • HAL or HAL lead-free
  • OSP
  • others on request

Additional printing 

  • Identification/assembly
  • Hole filler/through hole filler
  • Peelable solder mask 
  • Heatsink
  • Carbon

Edge plating 

The end faces of the PCB contour can be plated in order to improve the EMC protection of a PCB, make electrical contact with the housing of the module or meet increased cleanliness requirements. 

Edge plating

Milled plated through holes 

It is possible to produce application-specific components with so-called milled plated through holes. Due to the possibility of contact on the front side, the resulting PCBs can be soldered as components to another board (interposer).

Milled plated through holes.

Contour machining

Contour production: milling and scoring

Graph optimal production panel exploitation of a printed circuit board

Reductions can be achieved through the targeted adaptation of panel frames or minor changes in the size of the PCB by increasing the space utilisation of our production panels. The net usable area of our production panels including contour machining can be found in our PCB Design Compass:

Contact partner

Portrait of Martin Leeb

Martin Leeb
Technical Order Processing
Phone+43 2985 2141-573
martin.leeb@ksg-pcb.com

Portrait of Jörg Susa

Jörg Surma
Head of Technical Order Processing/CAM
Phone+49 3721 266-113
joerg.surma@ksg-pcb.com