Multi-dimensional solutions

KSG-Overview of Multi-dimensional solutions

Three-dimensional PCBs make optimum use of restricted installation space. Parts of a circuit that are interconnected across various PCBs or board segments can also replace connectors and leads. What is more, 3D PCBs can increase package density, reduce weight, increase module reliability and open up new design possibilities while reducing overall system costs.

Multi-dimensional boards can be constructed by various methods using a variety of structures and materials. We can offer you a number of different technologies so that your 3D circuit board is implemented in the best possible way. Each of the three processes uses different structures and has different technical characteristics, design advantages and limits.

Your benefits

  • Symmetrical and asymmetrical stack-ups
  • Choice of several technologies for applications
  • More than one flexible layer possible
  • Impedance across bending area also possible
  • Self-supporting, stable 3D structures without additional assembly
  • Cost savings through replacement of plug and cable connections
  • Optical flexibility through the individual orientation of separate LEDs in lighting applications

PCB technologies for multi-dimensional solutions

HSMtec® 3D

Graphic of an HSMtec® 3D PCB structure

Additional new design possibilities according to application

Reduction of process stages in subsequent module processing

Reliable connection technology

Special installation variants

Picture of a rigid-flex asymmetrical 3D PCB

Table technologies for 3D PCBs

We can offer you the following services for KSG 3D circuit boards:

  • Advice on the right choice of PCB technology 
  • Creation of an individual concept according to your requirements
  • Support in the design, dimensioning and concept selection of your 3D PCB
  • Thermal measurements and analyses
  • We can take care of development, series production, assembly and installation in conjunction with our network partners

High-speed cameras


Sequential, 6 copper layers,

2 flex layers

Material FR4 – Isola DE104 (TG≈135 °C), polyimide
PCB thickness 1,1 mm

Circuit board technology

Rigid-flex, symmetrical, through connection, 
Line/space: 100µm/150µm
Surface Chemical nickel/gold
Special features 3 press cycles, symmetrical structure, blue solder resist mask

Motor controller for fan cooling

Structure 4-layer multilayer, 70µm copper
Material FR4 TG150°C Panasonic R-1566W
PCB thickness 1,7 mm
Circuit board technology 12mm, 8mm and 2mm wide copper profiles on an inner layer and an outer layer for 60 and 15 amperes
Special features Eight half-bridges have to be connected to the connectors by 4x15A = 60A conductors. Heat dissipation from the half-bridges has to be carried via a bending edge to a PCB tab that is glued to an aluminium heat sink in the casing.

Sensor for production lines

Structure 4-layer multilayer
Material FR4 TG150°C Panasonic R1566W
PCB thickness 1,5 mm
Circuit board technology Semi-flex, one flexible layer on the outside, cover foil over flexible area
Application: Event lighting
Structure 4-layer multilayer
Material FR4 Standard TG 130°C
PCB thickness 1,6 mm
Circuit board technology Semi-flex in combination with HSMtec for heat dissipation from LED to heat sink
Photo detail of a 3D semi-flex PCB

Event lighting

Structure 4-layer multilayer
Material FR4 Standard TG 130°C
PCB thickness 1,6 mm
Circuit board technology Semi-flex in combination with HSMtec for heat dissipation from LED to heat sink
Before/after photo of an LED application

When designing and producing a 3D PCB there is a large number of parameters to consider. That is why we advise you to talk to us at a very early stage of development. Through our online advice service or on-site workshops we can discuss the technical aspects and special considerations that such PCB types involve right from the start. We are also happy to help you with technical optimisation features or cost reduction measures.

Simply make an appointment by e-mail right now:

Contact partner

If you have any questions about the topic, we are happy to be your contact person.

Portrait of Dirk Deiters

Dirk Deiters
Product Management Input Sytems
Phone+49 173 8724929

Portrait of Robert Ratheiser

Robert Ratheiser
Product Management Input Sytems
Phone+43 2985 2141-520