High-frequency PCBs

Overview of high-frequency technology

High frequencies require high precision. And extensive expertise. In cooperation with our customers from the automotive and telecommunications industries, we at KSG have developed to become one of the leading manufacturers of printed circuit boards for high-frequency applications in the range from 24 to 77 GHz.
Many years of experience in processing special high-frequency materials have made us the perfect partner for you and your PCB project.

Your advantages

  • Safeguarded signal integrity for electronic circuit carriers
  • Different high-frequency base materials based on resin and glass or PTFE and ceramics
  • Full and hybrid stack-ups
  • Support as early as the design phase
  • Restricted etching tolerance ensured
Graphics of a high frequency circuit board stack

Fast, faster, high frequency:

the correct base material is crucial

Radar applications challenge manufacturing processes 

Depending on requirements, full and hybrid stack-ups are possible

Detailaufnahme einer Embedded-Leiterplatte

Number of layers 2 - 20 
PCB thickness 0.2 - 3.20 mm (depending on base material type) 
Materials FR4, PTFE, hydrocarbon system, modified FR4 systems 
Glass qualities  Partially "Square Weave" or "Spread Fibres" and low-Dk glass available 
Layer stack-ups double-sided PCB, pure multilayer, hybrid multilayer 
external laminate for multilayer possible 
Technology combinations   Countless possibilities on request 

The values specified represent the maximum performance spectrum and may be restricted in certain combinations.

Solder resist masks 

  • Photosensitive solder mask systems
  • UV solder mask system: Screen printing
  • Colours: green, red, blue, glossy black, matt black, white, yellow


  • Chemical nickel/gold
  • Chemical tin
  • Electroplated nickel/gold
  • HAL or HAL lead-free
  • OSP
  • others on request

Additional printing 

  • Identification/assembly
  • Hole filler/through hole filler
  • Peelable solder mask 
  • Heatsink
  • Carbon

Edge plating 

The end faces of the PCB contour can be plated in order to improve the EMC protection of a PCB, make electrical contact with the housing of the module or meet increased cleanliness requirements. 

Edge metallisation

Milled plated through holes 

It is possible to produce application-specific components with so-called milled plated through holes. Due to the possibility of contact on the front side, the resulting PCBs can be soldered as components to another board (interposer).

milled plated-through holes.

Contour machining

Contour production: milling and scoring

Etching tolerances of ±15 µm are possible in high process reliability. For this purpose, the processes are specifically controlled for each order and each PCB layout. Additional inspection processes during production ensure consistent quality.

Detailed view of high-frequency PCBs during testing process

Mit einer hohen Prozesssicherheit sind Ätztoleranzen von ±15 µm möglich. Hierfür erfolgt eine gezielte Steuerung der Prozesse für jeden Auftrag und jedes Leiterplatten-Layout. Zusätzlich gewährleisten fertigungsbegleitende Prüfprozesse eine gleichbleibende Qualität.

Detailed view of high-frequency PCBs during testing process

Interference may occur during the transmission of signals via plated through holes. In order to minimise this effect, it is possible to remove the electrical part of the plated through hole that is not required. Low-interference signal transmissions can be achieved by means of back drilling or back hole drilling.

Graphic of a high-frequency PCB stack without back drilling Graphic of a high-frequency PCB stack without back drilling
Graphic of a high-frequency PCB stack with back drilling Graphic of a high-frequency PCB stack with back drilling

Bei der Übertragung von Signalen über Durchkontaktierungen kann es vorkommen, dass Störungen entstehen. Um diesen Effekt zu minimieren, ist es möglich den elektrisch nicht benötigten Teil der Durchkontaktierung zu entfernen. Mittels des sogenannten Backdrilling oder Back Hole Drilling lassen sich so störungsarme Signalübertragungen realisieren.

Graphic of a high-frequency PCB stack without back drilling
Graphic of a high-frequency PCB stack with back drilling

Contact partner 

If you have any questions about the topic, we are happy to be your contact person.

Portrait of Georgi Georgiev

Georgi Georgiev
Project Engineer
Phone +49 3721 266-204