High-frequency PCBs

Overview of high-frequency technology

High frequencies require high precision. And extensive expertise. In cooperation with our customers from the automotive and telecommunications industries, we at KSG have developed to become one of the leading manufacturers of printed circuit boards for high-frequency applications in the range from 24 to 77 GHz.
Many years of experience in processing special high-frequency materials have made us the perfect partner for you and your PCB project.

Your advantages

  • Safeguarded signal integrity for electronic circuit carriers
  • Different high-frequency base materials based on resin and glass or PTFE and ceramics
  • Full and hybrid stack-ups
  • Support as early as the design phase
  • Restricted etching tolerance ensured

Fast, faster, high frequency:

the correct base material is crucial

Safeguarded signal integrity for electronic circuit carriers

Full and hybrid stack-ups

are possible, depending on requirements,

Detail view of a high frequency PCB

Number of layers 2 - 20 
PCB thickness 0.2 - 3.20 mm (depending on base material type) 
Materials FR4, PTFE, hydrocarbon system, modified FR4 systems 
Glass qualities  Partially "Square Weave" or "Spread Fibres" and low-Dk glass available 
Layer stack-ups double-sided PCB, pure multilayer, hybrid multilayer 
external laminate for multilayer possible 
Technology combinations   Countless possibilities on request 

The values specified represent the maximum performance spectrum and may be restricted in certain combinations.

Etching tolerances of ±15 µm are possible in high process reliability. For this purpose, the processes are specifically controlled for each order and each PCB layout. Additional inspection processes during production ensure consistent quality.

Detailed view of high-frequency PCBs during testing process

Interference may occur during the transmission of signals via plated through holes. In order to minimise this effect, it is possible to remove the electrical part of the plated through hole that is not required. Low-interference signal transmissions can be achieved by means of back drilling or back hole drilling.

Graphic of a high-frequency PCB

Contact partner 

If you have any questions about the topic, we are happy to be your contact person.

Portrait Matthias Schmied

Matthias Schmied
Project Engineer
Phone+49 3721 266-391