Overview of high-frequency technology
High frequencies require high precision. And extensive expertise. In cooperation with our customers from the automotive and telecommunications industries, we at KSG have developed to become one of the leading manufacturers of printed circuit boards for high-frequency applications in the range from 24 to 77 GHz.
Many years of experience in processing special high-frequency materials have made us the perfect partner for you and your PCB project.
- Safeguarded signal integrity for electronic circuit carriers
- Different high-frequency base materials based on resin and glass or PTFE and ceramics
- Full and hybrid stack-ups
- Support as early as the design phase
- Restricted etching tolerance ensured
|Number of layers||2 - 20|
|PCB thickness||0.2 - 3.20 mm (depending on base material type)|
|Materials||FR4, PTFE, hydrocarbon system, modified FR4 systems|
|Glass qualities||Partially "Square Weave" or "Spread Fibres" and low-Dk glass available|
|Layer stack-ups||double-sided PCB, pure multilayer, hybrid multilayer |
external laminate for multilayer possible
|Technology combinations||Countless possibilities on request|
The values specified represent the maximum performance spectrum and may be restricted in certain combinations.
Interference may occur during the transmission of signals via plated through holes. In order to minimise this effect, it is possible to remove the electrical part of the plated through hole that is not required. Low-interference signal transmissions can be achieved by means of back drilling or back hole drilling.
If you have any questions about the topic, we are happy to be your contact person.