High-frequency PCBs
In cooperation with our customers we have developed to become a leading manufacturer of printed circuit boards for high-frequency applications in the range from 24 to 77 GHz.
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We are happy to support your high-frequency project at every step along the way.
Contact our expert team here.
High frequencies require high precision. And extensive expertise. In cooperation with our customers from the automotive and telecommunications industries, we at KSG have developed to become one of the leading manufacturers of printed circuit boards for high-frequency applications in the range from 24 to 77 GHz.
Many years of experience in processing special high-frequency materials have made us the perfect partner for you and your PCB project.
Number of layers | 2 - 20 |
PCB thickness | 0.2 - 3.20 mm (depending on base material type) |
Materials | FR4, PTFE, hydrocarbon system, modified FR4 systems |
Glass qualities | Partially "Square Weave" or "Spread Fibres" and low-Dk glass available |
Layer stack-ups | double-sided PCB, pure multilayer, hybrid multilayer external laminate for multilayer possible |
Technology combinations | Countless possibilities on request |
The values specified represent the maximum performance spectrum and may be restricted in certain combinations.
Interference may occur during the transmission of signals via plated through holes. In order to minimise this effect, it is possible to remove the electrical part of the plated through hole that is not required. Low-interference signal transmissions can be achieved by means of back drilling or back hole drilling.
Digital Design Compass
The smart platform for fast and reliable PCB development.
- 2 plants. 1 platform. Available 24/7.
- Design rules for all technologies
- Practical examples and design-to-cost tips
We’ve combined all the parameters for you in our Design Compass.
A safe track to be smarter together
Take advantage of the direct line to the experienced PCB experts in our Technical Support. We are happy to support you in every phase of your project.
Fast, faster, high frequency:
the correct base material is crucial
Safeguarded signal integrity for electronic circuit carriers
Full and hybrid stack-ups
are possible, depending on requirements,