Embedded PCBs

Overview of embedding technology 

Lack of space on the outer layers? Why not use an additional assembly layer inside the PCB? With its embedding technologies, KSG offers you the right solution for the integration of active and passive electronic components - up to a minimum size of 01005 and a maximum component height of 2.5 mm.

Your advantages 

  • Production of application-specific systems (System-in-Package, SiP)
  • Maximum miniaturisation possible
  • Replaces board-to-board solutions
  • Housing replacement/protection against accidental contact 
  • Optimised thermal and power distribution
  • Improved EMC protection
  • Shorter signal paths
  • Complicated reverse engineering/plagiarism protection
  • Protected from extreme environmental influences
  • Protected from vibration, impact and pressure effects

When two soldering layers are not enough: maximum component density through embedding

Production of application-specific systems (System-in-Package)

Various integration technologies available

Detail view of an embedded PCB

Number of layers ≥ 3
PCB thickness

≥ 0.25mm for assembly layer
Total thickness dependent on component height

Materials FR4, other base materials on request 
Glass transition temperature 150°C, 170/180°C
Special features of components Components with cavities or electrolytic capacitors unsuitable; Suitability of the components must be tested; Components with copper terminals are required for laser connection; maximum height 2.50 mm
Special features PCB no HAL 
Design rules on request 

The specified values represent the maximum performance spectrum and may be restricted in certain combinations.

Cavity describes the production of one or more defined cavity in the PCB. The components are contacted electrically and mechanically using various methods.

Detail view of a PCB, made with the cavity process

The soldering process is used to place components on a PCB and embed them in the subsequent laminating multilayer in its composite. The electrical contact is made via the rewiring in the multilayer.

Detailed view of an embedded component contacted by the pad bonding process.

The components are bonded to a multilayer component, laminated into the composite and electrically connected by means of laser and subsequent electroplating. The components used have a terminal contact adapted to this technology.

Contact partner

Portrait of Ralph Fiehler

Ralph Fiehler
Head of Development
Phone+49 3721 266-275

Portrait Matthias Schmied

Matthias Schmied
Project Engineer
Phone+49 3721 266-391