Our service for thermal analysis of a printed circuit board is two-stage. It can be used in the run-up to development and layout as a software-based, thermographic simulation and can optionally be used as a real load test after the production of the first prototypes.
For the software-based, thermographic simulation, modelling is based on the layout data from Gerber data and other specifications, for example.
Additional information such as layer structure, base material, system structure, component characteristics, current ratings, ambient conditions and installation situation are also important in order to represent actual conditions as accurately as possible. From that information, the software calculates the expected temperatures using the finite elements method and represents them as a thermographic image.
In the second stage, the printed circuit board is tested in the high-current laboratory under real conditions. Equipped with two high-current generators and a thermal imaging camera, the high-current connections are subjected to the actual current levels expected. After thermal equilibrium has been reached, the thermal imaging camera carries out a surface measurement.
Thermal imaging camera