Research and Development 

We're eager to find out what we can make possible for you.

Our boots are always pulled on for the extra mile we need to walk to bring your ideas to life. Our aim is to take your product to market or to perfect it. That's what drives us. And it fills us with passion. Our compass points towards this goal. Every day. We find solutions where traditional technologies aren't enough. With our cross-site Research and Development department, we are breaking new ground. After all, you can't develop things that have never existed with methods that are already in place. 

Icon: Our tasks

Tasks

  • Basic research
  • Technology development (in cooperation with our customers, industrial partners, research institutes and universities)
  • further technological development of our manufacturing processes
  • Qualifying new materials
  • Continuous improvement of product/ process quality and cost structures
Icon: 200 projects

200 projects

Over the past 3 years, 200 projects have been implemented in cooperation with our customers, industrial partners, research institutes and universities within the framework of government-funded cooperation and joint projects. 

Icon: 6 Projektingenieure

6 project engineers

are available to our customers for technical support in all questions concerning printed circuit board technology and share their know-how with interested customers at conferences, specialist forums, webinars and seminars.

Icon: one passion

We adapt to the market. So that you can profit from this.

Since 2002, a team of KSG experts have been researching and developing the further advancement of printed circuit board technologies, independently of production. This company meets the challenges of ever more complex market requirements for printed circuit board technology, product and process quality and an economic cost structure with interdisciplinary and wide-ranging expertise.

Porträt von Ralph Fiehler

Ralph Fiehler
Head of R&D 
ralph.fiehler@ksg-pcb.com

Portrait of Udo Börner

Udo Börner
Project Engineer
udo.boerner@ksg-pcb.com

Portrait of Georgi Georgiev

Georgi Georgiev
Project Engineer
georgi.georgiev@ksg-pcb.com

Portrait of Tilo Leistner

Tilo Leistner
Project Engineer
tilo.leistner@ksg-pcb.com

Portrait of Johannes Schauer

Johannes Schauer
Project Engineer
johannes.schauer@ksg-pcb.com

Portrait of Matthias Schmied

Matthias Schmied
Project Engineer
matthias.schmied@ksg-pcb.com

Portrait of Dr. Kathrin Weise

Dr. Kathrin Weise
Project Engineer
kathrin.weise@ksg-pcb.com

CURRENT PROJECTS IN THE FIELD OF R&D

Aim: Development of a highly integrated IoT radio sensor module for networked monitoring of operating conditions during production and product life.

KSG challenge: Development of an embedded technology for a miniaturised IoT sensor circuit carrier 

Content: The aim of the PCB 4.0 research project is to create a technology platform for the design and manufacture of embedded miniaturised radio sensor nodes and their integration into production processes. In addition to design methods and module and assembly concepts, the partners developed relevant strategies for series production. The performance of the technologies developed is to be demonstrated by means of radio sensor layers, which, integrated in circuit boards, detect and process the actual production status of industrial electronics in real time. In the process, self-diagnosis methods allow fully continuous condition-based maintenance of the entire production process. Through the successful implementation of the project task, the integration of electronics into the printed circuit board system, KSG was able to further expand its competence in the field of embedded technology.

Partner

  • EnOcean GmbH  
  • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
  • Sensorik-Bayern GmbH  
  • Siemens Aktiengesellschaft  
  • Technische Universität Berlin 
  • WIBU-SYSTEMS AG 

highly miniaturised autonomous radio sensor nodes, a) sensor beacon for 3-axis acceleration and ambient conditions (Sensorik Bayern), b) miniaturised version for ambient conditions (TUB, KSG) 

Aim: development of a high-resolution radar system with integrated AI-supported data processing for collaborative autonomous driving

KSG challenge: Development of embedding technology for the AI radar sensor with system-integrated planar antenna or autonomous SMD-mountable 3D antenna

Content: The AI-Radar project aims to increase the resolution of radar sensors using AI methods and innovative antenna geometries. With AI algorithms, the measured values of individual radar sensors are to be linked to each other in real time, thus decisively increasing the resolution and safety of the sensor technology as a whole. In addition, the radar sensors' detection range is to be extended by new three-dimensional antenna structures. The project investigates the development of distributed data processing in the sensors in order to achieve miniaturisation of the electronic components. In order to further increase safety, information from the immediate vicinity is included, which can be used to detect stationary traffic better.
 


Partner:

  • Creonic GmbH
  • Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration IZM
  • InnoSenT GmbH
  • Universität Bielefeld

Aim: Research into an innovative inductive energy transmission system for autonomous electric drive systems as a key technology for the use of highly flexible actuators in the 4th industrial revolution.

KSG challenge: Development of a printed circuit board technology for the integration of high performance coils by integration of HF strands in cavities in a 20-layer hybrid FR4-HF multilayer structure with PCB layouts with line/space < 50 µm.

ContentIn automation technology, there are some challenging applications that require hermetic sealing of machines, such as assembly robots in the semiconductor industry or in medical technology. Classic cable trailing or sliding contacts can often not be used due to the specific requirements. The power must then be transmitted wirelessly to the actuators in the vending machines. The INDUGIE project will therefore investigate innovative contactless power transmission systems. These actuators should be able to transmit large electrical powers in a variety of ways, e.g. in a plane, point or line form, inductively and thus be able to supply a wide variety of actuators with power simultaneously.

[Translate to English (us-en):] System induktiv Energieübertragung

Partner: 

  • Finepower GmbH
  • Johann Lasslop GmbH 
  • MACCON Elektroniksysteme GmbH
  • Rudolf Pack GmbH & Co. KG
  • Technische Universität Dortmund

Contact partner

[Translate to English (us-en):] Porträt von Ralph Fiehler

Ralph Fiehler
Head of R&D
Phone+49 3721 266-275
ralph.fiehler@ksg-pcb.com