Sharing knowledge with online-seminars

Knowledge is best shared through online-seminars. Therefore we appear on your screen and introduce new trends in PCB technology. Within 45 minutes, you will expand your knowledge of PCB applications, the use of design rules and much more. At the same time, you can use the chat function to contact our experts in real time and ask your questions.

Wärmemanagement KSG

07/10/2021; 11:00 am (UTC+1:00) - Postponed! 

High Power and Thermal Management Solutions

In this webinar we will discuss High Current and Thermal Management Applications for FR4 printed circuit boards. Highlighting the expanding requirements of different industries. We wish to show through discussion of typical applications the high current and thermal management technology we have available to address the various technical demands of these requirements to maximise the potential of FR4 printed circuit board capability.

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Recently held online-seminars


Three-dimensional PCBs can increase packing density, reduce weight and system costs, increase reliability of the assembly and also open up new design possibilities. Building on the first part of the webinar series, we will go into what design advantages the different 3D technologies offer and provide concrete tips and tricks for the construction and design of your multidimensional PCB.

In the webinar you will learn:

  • how to optimally design 3D printed circuit boards
  • background knowledge about the manufacturing processes of 3D printed circuit boards and how to use this knowledge for your design
  • suggested solutions for concrete application examples
  • tips and tricks for the optimal PCB layout
3D printed circuit boards


There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details during the design phase often already significantly determine the manufacturing costs of the later series product. Learn tips and tricks for cost reduction in PCB procurement based on the parameters:

Chemical processes (layout design in terms of complexity and dimensioning / backfill technologies and electroplating processes / masking and marking technologies / choice of soldering surface)
Test technologies (electrical test / measurement and test requirements)

[Translate to English (us-en):] Leiterplatten kosteneffizient beschaffen


In our webinars we highlight different technology variants for multidimensional printed circuit boards: Rigid-Flex, Semiflex, HSMtec-3D. Knowledge of the possibilities and properties of the processes helps to select the optimal solution for the respective assembly.

[Translate to English (us-en):] 3D Leiterplatten


There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details often determine the manufacturing costs of the subsequent series product during the design phase. In this online seminar, you will learn how to reduce the costs of procuring printed circuit boards if some key points for production are already taken into account during development.

[Translate to English (us-en):] Webinar Leiterplatten kosteneffizient beschaffen


In this online-seminar, you will learn about the trends that are driving the printed circuit board industry.

[Translate to English (us-en):] Roadmap der europäischen Leiterplattentechnologie


In this online-seminar, you'll learn which parameters are important when selecting the base material and how to select the right base material for your application



In this online-seminar, you get to know the most important parameters of FR4 base materials and find out details about the production and properties of base materials


Contact partner

Do you have questions about registration or about the topics and dates? 

Portrait von Vanessa Bergelt

Vanessa Bergelt
Public Relations
Phone+49 3721 266-469
Jetzt kontaktieren

Portrait von Maria Kirsch

Maria Kirsch
Sales Assistant
Phone+49 3721 266-253
Jetzt kontaktieren