07/10/2021; 11:00 am (UTC+1:00) - Postponed!
High Power and Thermal Management Solutions
In this webinar we will discuss High Current and Thermal Management Applications for FR4 printed circuit boards. Highlighting the expanding requirements of different industries. We wish to show through discussion of typical applications the high current and thermal management technology we have available to address the various technical demands of these requirements to maximise the potential of FR4 printed circuit board capability.
Recently held online-seminars
28/01/2021
Three-dimensional PCBs can increase packing density, reduce weight and system costs, increase reliability of the assembly and also open up new design possibilities. Building on the first part of the webinar series, we will go into what design advantages the different 3D technologies offer and provide concrete tips and tricks for the construction and design of your multidimensional PCB.
In the webinar you will learn:
- how to optimally design 3D printed circuit boards
- background knowledge about the manufacturing processes of 3D printed circuit boards and how to use this knowledge for your design
- suggested solutions for concrete application examples
- tips and tricks for the optimal PCB layout
10/12/2020
There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details during the design phase often already significantly determine the manufacturing costs of the later series product. Learn tips and tricks for cost reduction in PCB procurement based on the parameters:
Chemical processes (layout design in terms of complexity and dimensioning / backfill technologies and electroplating processes / masking and marking technologies / choice of soldering surface)
Test technologies (electrical test / measurement and test requirements)
![[Translate to English (us-en):] Leiterplatten kosteneffizient beschaffen](/fileadmin/Leiterplatten_kosteneffizient_beschaffen_180_180.jpg "[Translate to English (us-en):] Leiterplatten kosteneffizient beschaffen")
15/10/2020
In our webinars we highlight different technology variants for multidimensional printed circuit boards: Rigid-Flex, Semiflex, HSMtec-3D. Knowledge of the possibilities and properties of the processes helps to select the optimal solution for the respective assembly.
24/09/2020
There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details often determine the manufacturing costs of the subsequent series product during the design phase. In this online seminar, you will learn how to reduce the costs of procuring printed circuit boards if some key points for production are already taken into account during development.
![[Translate to English (us-en):] Webinar Leiterplatten kosteneffizient beschaffen](/fileadmin/Images/Leistungen/webinare/Leiterplatten_kosteneffizient_beschaffen_296_191.jpg "[Translate to English (us-en):] Kosteneffiziente Leiterplattenbeschaffung")
18/06/2020
In this online-seminar, you will learn about the trends that are driving the printed circuit board industry.
![[Translate to English (us-en):] Roadmap der europäischen Leiterplattentechnologie](/fileadmin/Images/Leistungen/webinare/ksg-leiterplatten-webinare-roadmap-leiterplattenindustrie.jpg "[Translate to English (us-en):] Roadmap der europäischen Leiterplattentechnologie")
07/05/2020
In this online-seminar, you'll learn which parameters are important when selecting the base material and how to select the right base material for your application
05/03/2020
In this online-seminar, you get to know the most important parameters of FR4 base materials and find out details about the production and properties of base materials
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