Sharing knowledge with online-seminars

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Knowledge is best shared through online-seminars. Therefor we appear on your screen and introduce new trends in PCB technology. Within 45 minutes, you will expand your knowledge of PCB applications, the use of design rules and much more. At the same time, you can use the chat function to contact our experts in real time and ask your questions.

18.03.2021, 10:30

Optimal layout of HDI and SBU boards

An optimized design is a prerequisite for the successful implementation of complex HDI-, Microvia- or SBU- boards. In this webinar, you will learn how to optimally design these PCBs and what to look out for in a cost-efficient layer structure.

Recently held online-seminars

01/28/2021

Three-dimensional PCBs can increase packing density, reduce weight and system costs, increase reliability of the assembly and also open up new design possibilities. Building on the first part of the webinar series, we will go into what design advantages the different 3D technologies offer and provide concrete tips and tricks for the construction and design of your multidimensional PCB.

In the webinar you will learn:

how to optimally design 3D printed circuit boards
background knowledge about the manufacturing processes of 3D printed circuit boards and how to use this knowledge for your design
suggested solutions for concrete application examples
tips and tricks for the optimal PCB layout

12/10/2020

There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details during the design phase often already significantly determine the manufacturing costs of the later series product. Learn tips and tricks for cost reduction in PCB procurement based on the parameters:

Chemical processes (layout design in terms of complexity and dimensioning / backfill technologies and electroplating processes / masking and marking technologies / choice of soldering surface)
Test technologies (electrical test / measurement and test requirements)

[Translate to English (us-en):] Leiterplatten kosteneffizient beschaffen

10/15/2020

In our webinars we highlight different technology variants for multidimensional printed circuit boards: Rigid-Flex, Semiflex, HSMtec-3D. Knowledge of the possibilities and properties of the processes helps to select the optimal solution for the respective assembly.

[Translate to English (us-en):] 3D Leiterplatten

09/24/2020

There is great potential for savings in many electronic assemblies. In the case of the printed circuit board, small details often determine the manufacturing costs of the subsequent series product during the design phase. In this online seminar, you will learn how to reduce the costs of procuring printed circuit boards if some key points for production are already taken into account during development.

[Translate to English (us-en):] Webinar Leiterplatten kosteneffizient beschaffen

06/18/2020

In this online-seminar, you will learn about the trends that are driving the printed circuit board industry.

[Translate to English (us-en):] Roadmap der europäischen Leiterplattentechnologie

05/07/2020

In this online-seminar, you'll learn which parameters are important when selecting the base material and how to select the right base material for your application

03/05/2020

In this online-seminar, you get to know the most important parameters of FR4 base materials and find out details about the production and properties of base materials