In order to meet increasing demands for more miniaturisation and thus higher packing densities, multilayer boards starting with four copper layers have become indispensable for many applications. Thanks to state-of-the-art production technology, layouts from a line/space of 75 μm and up to a printed circuit board thickness of 3.2 mm are standard technology at KSG.
- Stack-ups from four copper layers and up to a thickness of 3.2 mm
- The choice of material depends on the number of layers
- Extremely thin material components starting from 0.25 mm thickness for electrical functions in multilayer assemblies
- From prototype to large-scale production from a single source