Services
Embedded PCBs
General Information
Lack of space on the outer layers? Why not use an additional assembly layer inside the PCB? KSG's embedded technologies offer the suitable solution for the integration of active and passive SMD components as small as component size 01005 and a maximum component height of 2.5 mm.
All features
- Production of application-specific systems (System-in-Package, SiP)
- Greatest possible miniaturisation
- Housing replacement
- Contact protection
- Optimised heat and power distribution
- Replaces board-to-board solutions
- Improved EMC protection
- Shorter signal paths
- Harder to reverse engineer/plagiarism protection
- Protected from extreme environmental influences
- Protected from vibration, impact and pressure effects
