High current and thermal management on printed circuit boards
A comparison of technologies and application-oriented solutions
On 27.02.2025 at 10:30 a.m. Johann Hackl, Head of Technical Support at KSG, will be holding an online seminar as part of the "FED talks" format on the topic of "High-current and thermal management on and in the printed circuit board" hold.
Modern power electronics use components such as high-performance LEDs, MOSFETs and IGBTs, which require new PCB technologies. As a result, the PCB has long since left its shadowy existence in the assembly. As a multifunctional element within an electronic system, it can cope with high currents and provides heat dissipation for high-clocked, heat-producing processors and heat-emitting power components.
Sophisticated high-current and thermal management on and in the PCB is therefore essential. In this presentation, you will find out which technologies are available here and how you can implement this directly in the PCB.
Topics:
- What technologies are available to implement power solutions on the PCB
- Which solution is suitable for which applications
- What factors need to be taken into account when dimensioning a high-current PCB?
- How can optimized thermal management be implemented?
The seminar is free of charge! Duration approx. 1 hour.
English 
German