Organic surface protection (OSP, Organic Solderability Preservative or Organic Surface Protection) is a cost-effective alternative to metallic end surfaces on printed circuit boards. On the exposed
Printed circuit boards are tested intensively in advance to ensure that they work reliably even with high temperature fluctuations. KSG explains how.
The HAL lead-free soldering surface offers the best solderability of all surfaces, although the thickness of the tin layer varies.
The "chemical tin" soldering surface offers a planar surface and good solderability for fine-pitch components. We explain the most important properties of the solder surface.
Electroless nickel-gold is the most commonly used soldering surface for printed circuit boards in Europe. Find out the reasons in our blog article.
The solder surface - also known as the end surface or PCB finish - is a thin metallic or organic layer that the PCB manufacturer applies to the copper surfaces of the component connections.
Iceberg®: uniform surface level over the entire conductor pattern Iceberg® PCBs are partial thick copper PCBs. In one wiring level there are areas with 50 to 70 µm copper for the
Thick copper, Iceberg® and HSMtec® are three different technologies for high-current printed circuit boards. The article compares the three technologies and explains the design possibilities, current carrying capacity and
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