What is important for the BGA fanout of SBU structures
Ball Grid Array (BGA) is a popular packaging technology for integrated circuits that enables a high pin count and compact design. Compared to traditional pin connection methods, BGA offers better thermal and electrical performance. A critical aspect of using BGA is the fanout design, which ensures the connection of the pins of the BGA chip to the traces of the [...]
Pattern plating and panel plating: the core processes of PCB production
In the complex production of printed circuit boards, there are two typical manufacturing processes for the core processes of through-hole plating and structuring. A distinction is made between "pattern plating" and "panel plating". Depending on the requirements, layer structure and layout, KSG decides on the most suitable manufacturing process. A combination of both processes ("semi-pattern plating") can also be used. Design rules for this [...]
High-quality PCBs thanks to Tg value determination
The reliability of printed circuit boards plays a crucial role in electronics production. Particularly in applications that are exposed to high temperatures, it is essential that the materials from which the PCBs are made can withstand these conditions. An important parameter for assessing the thermomechanical resilience of PCBs is the glass transition temperature, also known as the Tg value. In this article [...]
Guide to PCB design - The Digital Design Compass - an interview with Eugen Köhler (RAFI)
The rapid development of the electronics industry requires increasingly efficient tools and technologies in order to meet the growing demands. With our Digital Design Compass, we - the KSG Group - have brought to life a free online tool with helpful operating functions that is available around the clock. The platform supports PCB design and can be used in German and English [...]
The cost-optimized PCB - Part 2: Savings potential in pressing, drilling & milling
On the way to a cost-efficient PCB, it is not only the utilization and selection of materials - as described in Part 1 - that play a role. There is also potential for savings in the mechanical machining processes. In particular, it is important to reduce throughput times for pressing, drilling and milling. Enabling cost-efficient pressing processes The pressing process is primarily influenced by cost [...]
PCB marking shapes the future of smart production
Today we dive into the world of PCB marking and discover its importance in the context of Industry 4.0 and Smart Factory. In an era where technology and production are seamlessly merging, markings are not just simple information, but the input that paves the way for efficient, intelligent and state-of-the-art manufacturing. Let us [...]
Soldering surfaces for printed circuit boards, Part 5: Organic Solderability Preservative (OSP)
Organic surface protection (OSP, Organic Solderability Preservative or Organic Surface Protection) is a cost-effective alternative to metallic end surfaces on printed circuit boards. An organic layer is formed on the exposed copper areas, which protects against oxidation by oxygen. This maintains the solderability of the PCB for a defined period of time without the need for an additional metallic protective layer [...]
The cost-optimized printed circuit board. Savings potential for material & layer structure
The demand for ever more powerful and compact electronic devices is constantly growing. However, in times of rising raw material and energy prices, developers, engineers and companies are faced with the challenge of finding the right balance between quality and cost-effectiveness when developing high-performance components. This also applies to printed circuit boards as the backbone of electronic circuits. But where are the starting points for [...]
Pioneering technologies through precise impedance control: the role of the printed circuit board
In a time of constant change and advancing technologies, the drive to successfully bring groundbreaking innovations to market is not just an entrepreneurial endeavor, but rather the linchpin for sustainable success. Within this dynamic environment, defined impedance control on printed circuit boards plays a decisive role in determining the success or failure of your application [...]
3D printed circuit boards in the area of conflict between functionality and cost optimization
How to reduce costs in the production of rigid-flex printed circuit boards Whether energy, raw materials or personnel - there is hardly an area that is not currently affected by exorbitant cost increases. This also affects the manufacture of printed circuit boards. This makes it all the more important to look for potential savings, especially with complex components such as rigid-flex printed circuit boards. Here [...]
Practical tips for error-free, production-ready PCB design Part 1: External copper layers
Errors in PCB development cost time and money, but they can be avoided. As part of the "Practical tips" series of articles, we take a close look at typical PCB design errors and provide valuable insider knowledge for the efficient design of a PCB. An error-free PCB design that is suitable for series production is the basic prerequisite for cost-effective PCB production. But when it comes to layout, there are several [...]
#smartertogether for over 30 years: GE HealthCare and KSG Group in harmony with progress and quality
In a fast-moving world, trusting business partnerships are rare. So how is it possible to build and maintain a strong customer-supplier relationship over 30 years? One example of this is the successful collaboration between GE HealthCare and us, the KSG Group. We have been producing PCBs suitable for series production for various industries for over 64 years. Our high-quality KSG printed circuit boards are used in the [...]
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